...that the inventor of the electric motor was a blacksmith named Thomas Davenport? Described as "a brilliantly unsuccessful inventor", Davenport invented the first rotary electric motor. In 1836 he headed out -- on foot -- from his Vermont home to file a patent application at the Patent Office in Washington, D.C. By the time he got there, he had squandered away his money and couldn't afford the $30 filing fee so he turned around and went home. When he later mailed in his application with money he'd raised, the Patent office was destroyed in a fire. He did finally get credit for his invention on Feb. 5, 1837.
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| Number | Title | Issue Date |
| 8056616 | Exhaust heat recovery apparatus An exhaust heat recovery apparatus includes an evaporation unit and a condensation unit communicated with the evaporation unit such that an operation fluid circulates therein. The evaporation unit is disposed in a first fluid passage through which a first fluid flow... | 11/15/2011 |
| 8047267 | Apparatus for cooling communication equipment using heat pipe The present invention is directed to an apparatus for cooling communication equipment using a heat pipe, which releases heat from a heat-emitting unit by a simple, reliable and safe scheme. The present invention provides an apparatus for releasing heat, which compri... | 11/01/2011 |
| 7931071 | Heat exchanger with heat pipe A heat exchanger includes an evaporation side heat pipe in which a working fluid flowing therein is heat exchanged with a high-temperature fluid to be evaporated, a condensation side heat pipe in which the working fluid flowing therein is heat exchanged with a low-t... | 04/26/2011 |
| 7926553 | Cooling system for electronic devices, in particular, computers The invention concerns a cooling system for electronic devices, especially computers, comprising an evaporator (1), a vapor-distribution and condensate-collection element (3) and a condenser (2) with a plurality of condenser pipes (6) and... | 04/19/2011 |
| 7891412 | Heat exchanger using a storage fluid The invention relates to a heat exchanger, in particular for an air conditioning, ventilation and/or heating device of a motor vehicle, said heat exchanger comprising a plurality of stacked modules (100) which define two series of distinct channels for circul... | 02/22/2011 |
| 7882888 | Two-phase heat transfer system including a thermal capacitance device A two-phase heat transfer system includes an evaporator unit configured to receive heat from a source, a liquid line fluidly connected to the evaporator unit, a vapor line fluidly connected to the evaporator unit, and a condenser. The evaporation unit includes a the... | 02/08/2011 |
| 7828045 | Heat sink and information processor using heat sink The present invention relates to a heat sink. More particularly, the present invention relates to a heat sink used for radiating heat from an integrated circuit package such as a micro-processor arranged in a portable type electronic apparatus such as a notebook typ... | 11/09/2010 |
| 7661463 | Cooling device incorporating boiling chamber A cooling device includes a boiling chamber containing working fluid therein. The chamber includes a bottom wall for contacting with a heat generating component and a cover hermetically connected with the bottom wall. The cover includes a top wall and a bulge formed... | 02/16/2010 |
| 7506682 | Liquid cooled thermosiphon for electronic components A fluid heat exchanger assembly cools an electronic device with a cooling fluid supplied from a heat extractor (R, F) to an upper portion of a housing. A refrigerant is disposed in a lower portion of the housing for liquid-to-vapor transformation. A partition divide... | 03/24/2009 |
| 7363965 | Onboard hydrogen storage unit with heat transfer system for use in a hydrogen powered vehicle An onboard hydrogen storage unit with heat transfer system for a hydrogen powered vehicle. The system includes a hydrogen storage vessel containing a hydrogen storage alloy configured to receive a stream of hydrogen and provide hydrogen for use in powering a vehicle... | 04/29/2008 |
| 7352580 | CPU cooler A CPU cooler includes a heat-conducting unit and a heat-dissipating unit. The heat-conducting unit consists of a heat-conducting block, a heat-conducting piping, an inflow pipe and an outflow pipe. The heat-conducting block is closely positioned on the CPU and the h... | 04/01/2008 |
| 7322400 | Cooling apparatus having low profile extrusion A cooling apparatus has a low profile extrusion with a plurality of micro tubes extended there through. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid removes heat via an adiabatic process. ... | 01/29/2008 |
| 7322401 | Ventilator Ventilator including a case having a first flow passage and a second flow passage therein, at least one fan in the case for supplying room air to a room through the first flow passage, and guiding outdoor air to the room through the second flow passage, and a heat e... | 01/29/2008 |
| 7320357 | Thermal control of automotive interiors with phase change material The inventive method includes the utilization of different phase change materials with different melting temperature ranges in each of the headliner (3), the seats (7), and the instrument panel (12) of an automobile in order to save energy while... | 01/22/2008 |
| 7318378 | Temperature control method and printing machine In a method for controlling the temperature of a first printing unit by way of a temperature control medium, the temperature control medium used is a dampening solution from a second printing unit. ... | 01/15/2008 |
| 7316265 | Method for passive phase change thermal management In one embodiment, a method includes forming a conductive structure having a cavity, injecting a phase change material into the cavity, injecting a plurality of spheres into the cavity, and sealing the cavity. ... | 01/08/2008 |
| 7310232 | Multi-surface heat sink film An electrical assembly comprising plurality of heat producing devices in direct thermal contact with perforated heat pipe film. Direct benefits of this invention for circuit board packages are weight reduction, volume reduction, increase of allowable heat dissipatio... | 12/18/2007 |
| 7289322 | Heat sink A heat sink includes a fin assembly (20) including a plurality of fin plates (22) and a fan (30) mounted on the fin assembly. Each fin plate includes a plurality of cutouts (226) defined on one edge thereof, and the cutouts of the fin pla... | 10/30/2007 |
| 7275588 | Planar heat pipe structure A planar heat pipe has a hollow planar tube and a wick structure attached to an interior sidewall of the planar tube. A spiral support member is installed to extend along the interior sidewall, so as to press the wick structure against the interior sidewall. The spi... | 10/02/2007 |
| 7273593 | Reactor having a heat exchange medium circulation A reactor including a bundle of catalyst tubes through which a reaction mixture is passed, and wherein a heat exchange medium is passed through a space surrounding the catalyst tubes and including ring lines at both reactor ends with jacket orifices for feeding in a... | 09/25/2007 |
| 7262965 | Thermal structure for electric devices A thermal structure includes a fin module, a heat sink base, a heat pipe, a fan housing, and a fan. One end of the heat pipe is connected with the fin module and the other end of the heat pipe is installed on the heat sink base. The fan housing is fixed on the fin m... | 08/28/2007 |
| 7258160 | Heat transfer element, cooling device and electronic device having the element A heat transfer element includes a container having a heat input section for receiving heat generated by a heating element and a heat output section for radiating the heat outside, and condensable working fluid that is vacuum-sealed in the container to transfer the ... | 08/21/2007 |
| 7246940 | Method and apparatus for managing the temperature of thermal components A temperature management system for managing the temperature of a discrete, thermal component. The temperature management system comprises a heat exchanger thermally coupled with the thermal component. The system also comprises a fluid transfer device that circulate... | 07/24/2007 |
| 7243705 | Integrated circuit coolant microchannel with compliant cover An apparatus includes a microchannel structure having microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. The apparatus also includes a c... | 07/17/2007 |
| 7240720 | Method and thermally active multi-phase heat transfer apparatus and method for abstracting heat using liquid bi-phase heat exchanging composition Apparatus for abstracting heat comprises a container charged with a first liquid and with small auxiliary containers free to circulate in the first liquid. Each of the small auxiliary containers is charged with a second liquid. The first and second liquids each have... | 07/10/2007 |
| 7238836 | Method of producing unsaturated aldehyde and unsaturated acid in fixed-bed catalytic partial oxidation reactor with enhanced heat control system The present invention provides a process of producing unsaturated aldehydes and unsaturated acids from olefins by fixed-bed catalytic partial oxidation in a shell-and-tube heat exchanger-type reactor. In this process, the reactor comprises a first-step reaction zone... | 07/03/2007 |
| 7213338 | Cooler, electronic apparatus, and method for fabricating cooler This invention provides a cooler having an excellent cooling performance, which is capable of being downsized and low-profiled, an electronic apparatus and a method for fabricating the cooler. The cooler (1) comprises lower board member (10) and upper ... | 05/08/2007 |
| 7207178 | Superconducting device with a cooling-unit cold head thermally coupled to a rotating superconductive winding The superconducting device has a rotor which is rotatable about an axis of rotation and is provided with a superconductive winding in a heat conducting winding carrier. The winding carrier has a central cooling agent cavity with a lateral cavity leading out of the w... | 04/24/2007 |
| 7198096 | Stacked low profile cooling system and method for making same A stacked array of low profile heat pipes each with a plurality of micro tubes extended therethrough. The stacked low profile heat pipes are placed into thermal connection with heat producing components. A heat transfer fluid is contained in the micro tubes of the l... | 04/03/2007 |
| 7191984 | Thermal design for spacecraft modules A thermal management system for a spacecraft module includes a baseplate and wall system that is precharacterized to provide a given level of thermal performance regardless of an orientation of the spacecraft relative to a source of solar energy. The system is chara... | 03/20/2007 |
| 7188663 | Radiating module and the manufacturing method thereof A method for manufacturing a radiating module consisting of a plurality of radiating fins, at least one heat-transfer tube, and a seat includes the steps of forming through holes on the radiating fins, extending the heat-transfer tube through the through holes on th... | 03/13/2007 |
| 7174950 | Heat transfer system for a satellite including an evaporator A heat transfer system includes a heat transfer passage in the vicinity of a source of dissipated heat on a satellite to collect heat dissipated by the source and a fluid loop including an evaporator having over part of its path a maximum surface area of its externa... | 02/13/2007 |
| 7167364 | Cooler with blower between two heatsinks A cooler for cooling of electronic components comprises at least two heatsinks thermally connected with each other by heat spreading means, and a double inlet centrifugal blower comprises a casing with two inlets and an outlet, a radial impeller with an axle and an ... | 01/23/2007 |
| 7156158 | Heat pipe type cooler To realize a integrally constructed cooler of the heat pipe type which ensures the achievement of sufficient cooling capacity and the realization of a simple, compact and inexpensive cooler, that is especially low in height, employing and incorporating ingeniously a... | 01/02/2007 |
| 7152667 | Tower type finned heat pipe type heat sink A heat sink comprises: a base portion having one face to be contacted by an exothermic member; a heat pipe erected on the other face of the base portion; and a plurality of fins mounted on the outer face of the heat pipe. Further comprised are: an axially short cyli... | 12/26/2006 |
| 7150312 | Stacked low profile cooling system and method for making same A stacked array of low profile heat pipes each with a plurality of micro tubes extended therethrough. The stacked low profile heat pipes are placed into thermal connection with heat producing components. A heat transfer fluid is contained in the micro tubes of the l... | 12/19/2006 |
| 7149084 | Redundant liquid cooling system and electronic apparatus having the same therein In an electronic apparatus, including personal computers, being called by a desktop type and a notebook type, as well as a server, etc., comprising a redundant cooling system, mounting a CPU 200 necessitating cooling in a housing 100, wherein a liquid ... | 12/12/2006 |
| 7147045 | Toroidal low-profile extrusion cooling system and method thereof A toroidally shaped LPE with a plurality of microtubes extending through the LPE is disclosed. The LPEs are placed into thermal connection with heat producing components. A heat transfer fluid is contained in the microtubes of the LPEs and removes the heat from the ... | 12/12/2006 |
| 7143819 | Heat sink with angled heat pipe A heat sink comprises a base having a substantially flat region for interfacing with an electronic component, and at least one heat pipe having a first region substantially parallel to the flat region of the base and a second region substantially perpendicular to th... | 12/05/2006 |
| 7143813 | Foam bumper and radiator for a lightweight heat rejection system Methods and apparatus are provided for a lightweight heat rejection system suitable for spacecraft applications. The apparatus comprises a manifold configured with an array of heat pipes in thermal contact with a manifold coolant. The heat pipes transfer the coolant... | 12/05/2006 |