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President Rutherford B. Hayes ; Said in 1876, after Alexander Graham Bell demonstrated the telephone to him at the White House
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| Number | Title | Issue Date |
| 7429720 | Electric heating pipe and electric heating apparatus using it The present invention relates to an electric radiating pipe capable of enhancing a heating efficiency in such a manner that a mixture of a porous operation medium and a volatile operation fluid is filled in a radiation pipe, and a porous operation medium is fast hea... | 09/30/2008 |
| 7410597 | Thermally conductive material A thermally conductive material includes a supercritical fluid and a number of carbon nanotubes incorporated in the supercritical fluid. The supercritical fluid may be selected from a group consisting of carbon dioxide, water, ammonia, ethane, ethane, nitrous oxide,... | 08/12/2008 |
| 7363925 | Gas-treatment devices An HME for a tracheostomy tube has a flexible outer housing of a gas-permeable material containing an HME element of discrete particles, granules or the like of a hygroscopic material. The particles are contained between the outer housing and an inner wall of a foam... | 04/29/2008 |
| 7342787 | Integrated circuit cooling apparatus and method In various embodiments, heat from a computer component may be absorbed into a medium, moved to a remote heat dispersal unit and dissipated into the surrounding air. In some embodiments, the heat dispersal unit may include a heat sink. In some embodiments, the medium... | 03/11/2008 |
| 7331379 | Heat dissipation device with heat pipe A heat dissipation device includes a fin set, a sinuous heat pipe transferring heat to different parts of the fin set, and a base thermally contacting the heat pipe. The heat pipe has a middle U-shaped portion and two L-shaped portions at two sides of the U-shaped p... | 02/19/2008 |
| 7329030 | Assembling structure for LED road lamp and heat dissipating module In an assembling structure for LED road lamp and heat dissipating module, the LED road lamp includes a partition board, an upper casing, a light transmitting lens and an LED lamp set. The upper casing and the light transmitting lens are set separately on upper and l... | 02/12/2008 |
| 7306750 | Carboxylate salts in heat-storage applications The application of carboxylate salts for storing thermal energy is disclosed. The invention is directed to methods for the storage and use of thermal energy comprising contacting mixtures of alkali metal salts or alkali earth metal salts of carboxylic acids, storing... | 12/11/2007 |
| 7299860 | Integral fastener heat pipe Invention disclosures novel design of structural components and fasteners that in addition to sound mechanical strength reveal excellent thermal characteristics, which allows using them as super efficient heat sinking/management solutions. ... | 11/27/2007 |
| 7293423 | Method and apparatus for controlling freezing nucleation and propagation An apparatus and method of controlling freezing in a liquid system is disclosed. The apparatus includes a heat exchanger having a initial zone characterized by a surface area to volume ratio. The apparatus also includes means for initiating freezing of a fluid from ... | 11/13/2007 |
| 7293601 | Thermoduct A thermoduct comprises a metallic tube with multiple trenches, cupric powder and a metallic net, wherein the metallic net and the cupric powder are disposed inside the metallic tube and function as a capillary texture. The cupric powder is sintered to adhere to rece... | 11/13/2007 |
| 7274106 | Packaged electroosmotic pumps using porous frits for cooling integrated circuits An integrated electroosmotic pump may be incorporated in the same integrated circuit package with a re-combiner, and an integrated circuit chip to be cooled by fluid pumped by the electroosmotic pump. ... | 09/25/2007 |
| 7265976 | Microchannel thermal management system A microchannel thermal management system for thermally managing a heat producing device. The microchannel thermal management system includes a housing having an interior surface, a cap having a plurality of microchannels attached to the interior surface of the housi... | 09/04/2007 |
| 7258160 | Heat transfer element, cooling device and electronic device having the element A heat transfer element includes a container having a heat input section for receiving heat generated by a heating element and a heat output section for radiating the heat outside, and condensable working fluid that is vacuum-sealed in the container to transfer the ... | 08/21/2007 |
| 7254026 | Heat dissipation device with heat pipe A heat dissipation device (40) includes at least a heat pipe (45) and a plurality of metal fins (43) thermally connected to the heat pipe. Each of the metal fins defines therein an aperture (431). An extension flange (433) extends ... | 08/07/2007 |
| 7237337 | Heat dissipating apparatus having micro-structure layer and method of fabricating the same The present invention relates to a heat dissipating apparatus having micro-structure layer and method for fabricating the same. The method provides two highly heat conductive members having structure patterns. A highly heat conductive material is coated on the struc... | 07/03/2007 |
| 7227257 | Cooling micro-channels The present disclosure relates generally to microelectronic technology, and more specifically, to an apparatus used for the cooling of active electronic devices utilizing micro-channels or micro-trenches, and a technique for fabricating the same. ... | 06/05/2007 |
| 7222661 | Cooling module A cooling module includes a thermal conductive member. An endoergic chamber, a radiative chamber and a circulation pump chamber are defined along the thermal conductive member. The thermal conductive member contacts a heat generating object outside the endoergic cha... | 05/29/2007 |
| 7222058 | Method of modeling and sizing a heat exchanger A method of modeling a heat exchanger is disclosed and comprises assigning input temperatures, assumed output temperatures, and a set of flow rates, inputting the parameters into a set of equations arranged to calculate a heat transfer coefficient, inputting paramet... | 05/22/2007 |
| 7218519 | Thermal management arrangement with a low heat flux channel flow coupled to high heat flux channels Embodiments of the present invention include an apparatus, method, and system for a thermal management arrangement having a low heat flux channel flow coupled to high heat flux channels. ... | 05/15/2007 |
| 7216695 | Method of operating a thermal management system A spray cooling system for extreme environments for providing a desired enclosed environment for electronic devices regardless of external environmental conditions. The spray cooling system for extreme environments includes an enclosure that isolates the electronic ... | 05/15/2007 |
| 7204298 | Techniques for microchannel cooling Techniques for heat transfer are provided. In one aspect of the invention, a heat-transfer device is provided. The heat-transfer device comprises one or more microchannels suitable for containing a heat-transfer fluid, one or more of the microchannels having protrud... | 04/17/2007 |
| 7201214 | Remedies to prevent cracking in a liquid system A liquid cooling system utilizing minimal size and volume enclosures, air pockets, compressible objects, and flexible objects is provided to protect against expansion of water-based solutions when frozen. In such a system, pipes, pumps, and heat exchangers are desig... | 04/10/2007 |
| 7143817 | Support structure of heat-pipe multi-layer wick structure A support structure of a heat-pipe multi-layer wick structure, having a hollow heat-pipe tube and multiple separate layers of weaving mesh wick structure overlaying on an interior surface of the heat-pipe tube. The wick structure has a curly circular shape. The oute... | 12/05/2006 |
| 7140421 | Wick structure of heat pipe A wick structure is attached on an internal sidewall of a heat pipe. The wick structure includes a plurality of orthogonal woven fibers. The fibers extending along a longitudinal direction of the heat pipe are thinner; therefore the wick structure is capably of prov... | 11/28/2006 |
| 7137442 | Vapor chamber A vapor chamber, in which a condensable fluid, which evaporates and condenses depending on a state of input and radiation of a heat, is encapsulated in a hollow and flat sealed receptacle as a liquid phase working fluid; and in which the wick for creating the capill... | 11/21/2006 |
| 7123479 | Enhanced flow channel for component cooling in computer systems An evaporator having an enhanced flow channel design for use in a computer system is described. Specifically, micro-channels of the evaporator comprise nucleation sites and different channel widths. The enhanced flow channel design improves heat transfer from a comp... | 10/17/2006 |
| 7117931 | Systems for low cost liquid cooling According to some embodiments, systems for low cost liquid cooling may be provided. In some embodiments, a system may comprise a core having a first end and a second end, wherein the core defines a cavity extending between the first and second ends, a plurality of f... | 10/10/2006 |
| 7110259 | Heat dissipating device incorporating heat pipe A heat dissipating device incorporating heat pipes includes a heat sink (10), a first heat pipe (50) and a second heat pipe (70). The heat sink has a first base (11), a second base (21) and a plurality of fins sandwiched between th... | 09/19/2006 |
| 7105382 | Self-aligned electrodes contained within the trenches of an electroosmotic pump A device where the electrodes of an electroosmotic pump are located directly in the flow-producing region of the electroosmotic pump is described as well as methods of forming such a device. Placing the electrodes of an electroosmotic pump directly in the flow-produ... | 09/12/2006 |
| 7104313 | Apparatus for using fluid laden with nanoparticles for application in electronic cooling An apparatus for using fluid laden with nanoparticles for application in electronic cooling is described. In one embodiment, an electromagnetic pump is used to circulate the nanoparticle laden fluid. ... | 09/12/2006 |
| 7084495 | Electroosmotic pumps using porous frits for cooling integrated circuit stacks A stack of heat generating integrated circuit chips may be provided with intervening cooling integrated circuit chips. The cooling integrated circuit chips may include microchannels for the flow of the cooling fluid. The cooling fluid may be pumped using the integra... | 08/01/2006 |
| 7073569 | Cooling assembly with spirally wound fin The subject invention provides a heat sink for a liquid cooled cooling assembly for removing heat generated by an electronic device. The heat sink includes a flow diverter having a hyperbolic cross section disposed on a base for absorbing a significant portion of th... | 07/11/2006 |
| 7051791 | Cooling apparatus and electronic equipment The rotation of axial-flow blades permits air entered through an inlet port to exit directly to outside of a case in the axial direction, and the rotation of centrifugal blades permits air entered through the inlet port to exit through a side surface outlet port to ... | 05/30/2006 |
| 7047640 | Method of manufacturing a heat dissipating device A method of manufacturing a heat dissipating device, the method includes steps: a) affording a heat pipe, a solid solder bar and a heat sink, wherein the heat sink includes a base defining a groove at a side thereof; b) placing the solder bar and the heat pipe, in t... | 05/23/2006 |
| 7044201 | Flat heat transferring device and method of fabricating the same A substantially flat heat transferring device and a method of fabricating the same are provided. The device includes a lower plate, an upper plate, a wick plate, and a liquid-phase coolant, while the lower plate contacts a heat source at its bottom. The upper plate ... | 05/16/2006 |
| 7013954 | Thermosiphon A thermosiphon which can be manufactured easily at low costs, having excellent resistance to pressure, without the circulation of a working fluid being hindered. A condenser 3 includes a condensing section 4 composed of extruded members in which a plur... | 03/21/2006 |
| 7011765 | Heat transfer fluid based on polyphenylmethanes exhibiting improved thermal stability The invention concerns a heat transfer fluid comprising a monobenzyl-1,2,3,4-tetrahydronaphthalene or a mixture of mono-and polybenzyl-1,2,3,4-tetrahydronaphthalene and/or a mixture of partly hydrogenated polyphenyls and at least a polyphenylmethane composition.... | 03/14/2006 |
| 7004240 | Heat transport system A system includes a heat transfer system and a priming system coupled to the heat transfer system. The heat transfer system includes a main evaporator having a core, a primary wick, and a secondary wick, and a condenser coupled to the main evaporator by a liquid lin... | 02/28/2006 |
| 6992381 | Using external radiators with electroosmotic pumps for cooling integrated circuits An integrated circuit to be cooled may be abutted in face-to-face abutment with a cooling integrated circuit. The cooling integrated circuit may include electroosmotic pumps to pump cooling fluid through the cooling integrated circuits via microchannels to thereby c... | 01/31/2006 |
| 6968841 | Heat and moisture exchanger A device for passive humidification of tracheostomized or intubated patients, comprising an outer body which forms an opening for connection to the patient and is connected to at least one seat of a filtering element which is connected to the outside, the device fur... | 11/29/2005 |
