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| Number | Title | Issue Date |
| 7332805 | Electronic package with improved current carrying capability and method of forming the same An electronic package and method for forming such package that expands the current capability of lines and/or reducing line resistance for packages with a given feature dimension while relaxing feature tolerances. The methods and structures include electrical wiring... | 02/19/2008 |
| 7276130 | Production method of multilayer ceramic electronic device A method of producing a multilayer ceramic electronic device, having a firing step for firing a pre-firing element body wherein a plurality of dielectric layers and internal electrode layers containing a base metal are alternately arranged, characterized in that the... | 10/02/2007 |
| 7204900 | Method of fabricating structures using low temperature cofired ceramics Disclosed is a method of forming an LTCC structure that involves providing at least a first ceramic tape sheet, laminating at least a second ceramic tape sheet to the at least a first ceramic tape sheet to form a substructure, laminating at least a third ceramic tap... | 04/17/2007 |
| 7189297 | Method of manufacturing ESD protection component A method of manufacturing an Electro Static Discharge (ESD) protection componentin which slurry including varistor particles and a resin binder is produced, and a varistor green sheet is formed from this slurry. A conductor layer is formed on a surface of the varist... | 03/13/2007 |
| 7144618 | Multilayer composite and method for preparing the same A multilayer composite includes an insulating substrate and patterned conductive layers and insulating layers alternately laminated on the insulating substrate. In a laminating process, a correcting insulating layer is formed on a laminate when a predetermined numbe... | 12/05/2006 |
| 7127812 | Process for producing a multi-layer printed wiring board A board 20 is provided with a Cu film 30 as a conformal mask, in which are formed a register mark 30b and an opening 3a through which a via hole is formed. A camera senses this register mark 30b so that the pos... | 10/31/2006 |
| 7122131 | Conductive paste for via conductor, ceramic wiring board using the same, and method of manufacturing the same The present invention is directed to a conductive paste for via conductor, comprising a Cu powder having a glass layer formed on the surface, a Ni powder having a metal oxide layer formed on the surface, and a ceramic component homogeneous as that of a ceramic compo... | 10/17/2006 |
| 7089659 | Method of producing ceramic laminates A method of producing ceramic laminates includes forming a ceramic green sheet by applying a ceramic slurry on a carrier film; forming, maintaining a predetermined gap, a plurality of electrically conducting patterns having inclined surfaces at the ends by printing ... | 08/15/2006 |
| 7070669 | Method for forming ceramic thick film element arrays An improved process for producing ceramic thick film array elements is provided. In this regard, ceramic elements are formed on a temporary, or printing, substrate by screen printing or other forming methods. The temporary, or printing, substrate is advantageously p... | 07/04/2006 |
| 7063813 | Stacked ceramic body and production method thereof This invention provides a stacked ceramic body that prevents reaction between components of dielectric layers and components of electrode layers of an unsintered stacked body during sintering and in which both components do not easily form a liquid phase, and a prod... | 06/20/2006 |
| 7034231 | Method for the manufacture of printed circuit boards with plated resistors A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as... | 04/25/2006 |
| 7011726 | Method of fabricating thin dielectric film and thin film capacitor including the dielectric film A method of fabricating a thin dielectric film, a thin dielectric film formed according to the method, and a system including the thin dielectric film. The method includes: depositing a ceramic precursor material on a metal sheet, the ceramic precursor material incl... | 03/14/2006 |
| 6972060 | Method for producing stacked ceramic body This invention provides a method for producing a stacked ceramic body that does not require strict control of an oxygen partial pressure in a sintering gas. To produce a stacked ceramic body by alternately stacking dielectric layer and electrode layers, an unsintere... | 12/06/2005 |
| 6964718 | Method of preparing multilayered piezoelectric ceramic material Co-fired multilayer piezoelectric ceramic materials with base metal electrodes based on copper, copper alloy, are found as an effective approach to manufacture low cost multilayer piezoelectrics. The method of the invention is performed at low firing temperature and... | 11/15/2005 |
| 6960271 | Laminate-type dielectric device, a production method and an electrode paste material A laminate type dielectric device is formed by alternately laminating dielectric ceramic layers and electrode layers and integrally baking the laminate product. The electode layers are mainly made of an electrically conductive base metal material having greater stan... | 11/01/2005 |
| 6960537 | Incorporation of nitrogen into high k dielectric film A high k dielectric film and methods for forming the same are disclosed. The high k material includes two peaks of impurity concentration, particularly nitrogen, such as at a lower interface and upper interface, making the layer particularly suitable for transistor ... | 11/01/2005 |
| 6919125 | Dual composition ceramic substrate for microelectronic applications Ceramic substrates (1) for microelectronic modules are formed in multiple layers (7 & 9) fused into a unitary one-piece assembly. The layers contain the same ceramic material but in different purity so that one outer layer (9) is optimal ... | 07/19/2005 |
| 6861622 | Negative temperature coefficient thermistor and method for manufacturing the same A negative temperature coefficient thermistor includes a thermistor element containing a transition metal oxide as a main component; internal electrodes disposed in the thermistor element; and external electrodes, electrically connected to the internal electrodes. A... | 03/01/2005 |
| 6855222 | Method for manufacturing laminated multilayer electronic components A method for producing a laminated electronic component produces a laminated electronic component having a superior surge-proofing property, a sufficient resistance to a flux, and excellent electrical properties, without experience the occurrence of structural effec... | 02/15/2005 |
| 6846375 | Method of manufacturing multilayer ceramic wiring board and conductive paste for use The present invention provides a method of manufacturing a low-temperature sintering multilayer ceramic wiring board comprising the steps of: forming a wiring layer by printing conductive paste (4) on an unfired green sheet (1); forming a laminate by l... | 01/25/2005 |
| 6723192 | Process for producing a thin film EL device A composite substrate in which the surface of the insulating layer is not influenced by the electrode layer and which requires neither a grinding process nor a sol-gel process, is easy to produce and can provide a thin-film EL device having a high display quality wh... | 04/20/2004 |
| 6660116 | Capacitive filtered feedthrough array for an implantable medical device A capacitive filtered feedthrough assembly is formed in a solid state manner to employ highly miniaturized conductive paths each filtered by a discoid capacitive filter embedded in a capacitive filter array. A non-conductive, co-fired metal-ceramic substr... | 12/09/2003 |
| 6627020 | Method for sinter distortion control A method to control the post sinter distortion of free sintered multilayer ceramic substrates by placing a discrete non-densifying structure in the green ceramic laminate prior to sintering. One or several discrete non-densifying structures are placed on ... | 09/30/2003 |
| 6623663 | Electroconductive paste and method for manufacturing a multilayer ceramic electronic part using the same An electroconductive paste is provided containing from about 5% to 18% by weight of an organic vehicle comprising a solvent and a binder, from about 80% to 93% by weight of an electroconductive metal powder in a spherical or granular shape and with a part... | 09/23/2003 |
| 6610241 | Microwave sintering of multilayer dielectrics with base metal electrodes Certain embodiments relate to a process for forming a multilayer electrical device. The process includes providing a multilayer structure including layers of a dielectric material and an electrode material. The electrode material may include at least one ... | 08/26/2003 |
| 6488795 | Multilayered ceramic substrate and method of producing the same A method of producing a multilayered ceramic substrate in which wiring conductors can be provided on both main surfaces and the density of the wiring conductors can be increased by a non-shrinkage process. In the producing method, a green composite lamina... | 12/03/2002 |
| 6418616 | Full additive process with filled plated through holes A method provides for additive plating on a subcomposite having filled plated through holes. Fine-line circuitry is achieved via electroless deposition onto a dielectric substrate after the through hole is plated and filled. Fine-line circuitry may be rou... | 07/16/2002 |
| 6335077 | Electrically conductive paste for via-hole and method of producing monolithic ceramic substrate using the same As an electrically conductive paste for via-holes, an organic vehicle and an electrically conductive metal powder coated with a resin which is insoluble in the organic vehicle are prepared. Filling via-holes with the electrically conductive paste for via-... | 01/01/2002 |
| 6284080 | Barrier metallization in ceramic substrate for implantable medical devices The present invention relates to multi-layer ceramic packaging of hybrid micro-electronic devices, including those for implantable medical devices. The invention permits size reduction and design simplification in such packaging by eliminating the need fo... | 09/04/2001 |
| 6270601 | Method for producing filled vias in electronic components The present invention relates to a process for producing filled vias which are made of two components, a first component which forms a bonding layer between the wall of the via and a second component which forms the core of the via. Preferably, the two co... | 08/07/2001 |
| 6258192 | Multi-thickness, multi-layer green sheet processing The present invention relates generally to using at least one green sheet that is originally very thin with the help of at least one thicker green sheet. At least one organic adhesion barrier is used to build the multi-layer ceramic laminates. Basically, ... | 07/10/2001 |
| 6248960 | Ceramics substrate with electronic circuit and its manufacturing method In a ceramic wiring board which comprises a copper via, breaks and defects of via interconnections resulting from enlargement of copper particles in the interior of the via during sintering, are prevented. For this purpose, alumina of mean particle diamet... | 06/19/2001 |
| 6245185 | Method of making a multilayer ceramic product with thin layers Disclosed is a method of making a multilayer ceramic product with thin layers, the method including the steps of: (a) providing a thick ceramic greensheet and a plurality of thin ceramic greensheets; (b) aligning and stacking the thin ceramic greensheet o... | 06/12/2001 |
| 6241838 | Method of producing a multi-layer ceramic substrate A method of producing a multi-layer ceramic substrate involves the steps of preparing compact blocks including a raw ceramic functional material to be the passive component, preparing a raw composite laminated member having a plurality of laminated cerami... | 06/05/2001 |
| 6228196 | Method of producing a multi-layer ceramic substrate The invention provides a method of producing a multi-layer ceramic substrate comprising a laminated member having a plurality of ceramic layers made of a ceramic insulating material and a wiring conductor, comprising the steps of: preparing a raw compact ... | 05/08/2001 |
| 6217821 | Method of forming distortion-free circuits A method of forming a distortion-free circuit whereby a conductive composition is applied to at least one layer of green ceramic tape. The conductive composition formulation is based on total composition, conductive powder selected from Ag, Pd, Pt and mix... | 04/17/2001 |
| 6139666 | Method for producing ceramic surfaces with easily removable contact sheets A method for making multilayer ceramic substrates having substantially reduced planar shrinkage and distortion resulting from the firing or sintering process. Contact sheets are employed in the fabrication process on the surface of the multilayer ceramic ... | 10/31/2000 |
| 6120708 | Conductive paste and method for producing ceramic substrate using the same A conductive paste for forming via-holes in a ceramic substrate, which paste contains about 80-94 wt. % spherical or granular conductive metal powder having a particle size of about 0.1-50 μm, 1-10 wt. % resin powder which swells in a solvent contained i... | 09/19/2000 |
| 6066219 | Process for producing a ceramic substrate and a ceramic substrate The invention relates to a novel ceramic substrate with at least one layer essentially of aluminum nitride which is provided on at least one surface side with an intermediate or auxiliary layer which contains aluminum oxide and which has a thickness in th... | 05/23/2000 |
| 5985068 | Method of manufacturing a monolithic ceramic electronic device A method of manufacturing a monolithic ceramic electronic device includes the following steps: forming a first metal film on a PET film; forming a multilayered metal film by forming a second metal film on a part of the first metal film, the second metal f... | 11/16/1999 |
