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| Number | Title | Issue Date |
| 7361533 | Stacked embedded leadframe A method of forming a stackable embedded leadframe package includes coupling an electronic component having bond pads to a substrate; coupling on the substrate a leadframe having a plurality of leads, each lead having a lower mounting portion; encapsulating the elec... | 04/22/2008 |
| 7269897 | Manufacturing process of a stacked semiconductor device A manufacturing process of a stacked semiconductor device, comprising the following steps: integrating a plurality of electronic devices in a plurality of active areas realized in a semiconductor wafer; distributing an adhesive layer on active areas, splitting the s... | 09/18/2007 |
| 7268322 | Semiconductor heating apparatus A semiconductor heating apparatus, in which, when measuring the electrical properties of multiple chips formed on a large size wafer, only one or a several chips are heated uniformly, and the other chips are on standby at a low temperature. The semiconductor heating... | 09/11/2007 |
| 7225998 | Apparatus and method for preparing and delivering fuel A method and apparatus for vaporizing liquid fuel. The apparatus includes at least one capillary flow passage, the at least one capillary flow passage having an inlet end and an outlet end; a fluid control valve for placing the inlet end of the at least one capillar... | 06/05/2007 |
| 7204900 | Method of fabricating structures using low temperature cofired ceramics Disclosed is a method of forming an LTCC structure that involves providing at least a first ceramic tape sheet, laminating at least a second ceramic tape sheet to the at least a first ceramic tape sheet to form a substructure, laminating at least a third ceramic tap... | 04/17/2007 |
| 7189297 | Method of manufacturing ESD protection component A method of manufacturing an Electro Static Discharge (ESD) protection componentin which slurry including varistor particles and a resin binder is produced, and a varistor green sheet is formed from this slurry. A conductor layer is formed on a surface of the varist... | 03/13/2007 |
| 7144618 | Multilayer composite and method for preparing the same A multilayer composite includes an insulating substrate and patterned conductive layers and insulating layers alternately laminated on the insulating substrate. In a laminating process, a correcting insulating layer is formed on a laminate when a predetermined numbe... | 12/05/2006 |
| 7140085 | Process for manufacturing a capacitive vacuum measuring cell A capacitive vacuum measuring cell includes first and second ceramic housing bodies (1, 4) joined by an edge seal (3). A thin ceramic membrane (2) is supported between first and second housing bodies (1, 4) by the edge seal (3) at ... | 11/28/2006 |
| 7136021 | Ceramic chip antenna A ceramic chip antenna for transmitting and receiving wireless signals. The antenna includes a substrate and a conductor. The substrate is made of sintered ceramic material with a low dielectric loss and a high dielectric constant. A pair of concavities is cut from ... | 11/14/2006 |
| 7115182 | Anodic bonding process for ceramics A method of bonding components comprising the following steps. At least a first ceramic component and a second ceramic component are provided. A first conductive layer is formed over the upper surface of the first ceramic component. An intermediate film is formed ov... | 10/03/2006 |
| 7107855 | Membrane for capacitive vacuum measuring cell A ceramic membrane for a capacitive vacuum measuring cell includes a thin ceramic membrane with a thickness of | 09/19/2006 |
| 7105070 | Method for producing ceramic substrate, and ceramic substrate A method for producing a ceramic substrate which employs a cofiring process using restraint sheets in which a second ceramic green sheet 7 is laminated on a green ceramic substrate 30 so as to cover surface conductors 32 of the green ceramic sub... | 09/12/2006 |
| 7075775 | Chip-type electronic component In a chip-type electronic component of the present invention, at least one surface of a ceramic body is a convexly curved surface. Specifically, at least one surface in a thickness direction of the ceramic body may be convexly curved, and the side surface of the cer... | 07/11/2006 |
| 7045827 | Lids for wafer-scale optoelectronic packages A lid for a wafer-scale package includes a body having a bond area around a cavity defined by the body, an oxide layer atop the bond area and the cavity, and a reflective layer atop the oxide layer. The cavity has an angled sidewall where a portion of the reflective... | 05/16/2006 |
| 7018494 | Method of producing a composite sheet and method of producing a laminate by using the composite sheet A method of producing a composite sheet in which a through hole formed in a predetermined portion of the first ceramic sheet is buried with a different kind of sheet having substantially the same thickness as the first ceramic sheet, such as a resin sheet a metal sh... | 03/28/2006 |
| 6973706 | Method of making a transcutaneous electrochemical sensor A process for the manufacture of small sensors with reproducible surfaces, including electrochemical sensors. One process includes fanning channels in the surface of a substrate and disposing a conductive material in the channels to form an electrode. The conductive... | 12/13/2005 |
| 6949156 | Methods for making and using self-constrained low temperature glass-ceramic unfired tape for microelectronics A monolithic self-constrained green body tape for use in low temperature ceramic co-firing is provided. The tape contains at least two layers: one low temperature ceramic layer containing particles of a glass, a ceramic, and an organic binder, and a self-constrainin... | 09/27/2005 |
| 6942833 | Ceramic multilayer substrate manufacturing method and unfired composite multilayer body To produce a green composite laminate 11, a green multilayer collective substrate 13 containing low-temperature sinterable glass ceramic powder as a main ingredient is disposed between first and second shrinkage-restraining layers 14a and... | 09/13/2005 |
| 6919125 | Dual composition ceramic substrate for microelectronic applications Ceramic substrates (1) for microelectronic modules are formed in multiple layers (7 & 9) fused into a unitary one-piece assembly. The layers contain the same ceramic material but in different purity so that one outer layer (9) is optimal ... | 07/19/2005 |
| 6910250 | Piezo-electric/electrostrictive device, and method of manufacturing same The present invention provides a piezo-electric/electrostrictive device including a pair of thin plate sections in an opposed relation to each other, a fixing section for supporting the thin plate sections, and at least one pair of piezo-electric/electrostrictive el... | 06/28/2005 |
| 6900073 | Fast firing flattening method and apparatus for sintered multilayer ceramic electronic substrates An apparatus for flattening sintered ceramic electronic packaging substrates having opposing faces with undesired camber interleaves the substrates with spacers. At least one heating zone includes a heat transfer medium movable toward and away from the stack of inte... | 05/31/2005 |
| 6723192 | Process for producing a thin film EL device A composite substrate in which the surface of the insulating layer is not influenced by the electrode layer and which requires neither a grinding process nor a sol-gel process, is easy to produce and can provide a thin-film EL device having a high display quality wh... | 04/20/2004 |
| 6660116 | Capacitive filtered feedthrough array for an implantable medical device A capacitive filtered feedthrough assembly is formed in a solid state manner to employ highly miniaturized conductive paths each filtered by a discoid capacitive filter embedded in a capacitive filter array. A non-conductive, co-fired metal-ceramic substr... | 12/09/2003 |
| 6627020 | Method for sinter distortion control A method to control the post sinter distortion of free sintered multilayer ceramic substrates by placing a discrete non-densifying structure in the green ceramic laminate prior to sintering. One or several discrete non-densifying structures are placed on ... | 09/30/2003 |
| 6579393 | High thermal conductivity lossy dielectric using co-densified multilayer configuration Systems and methods are described for loss dielectrics. A method of manufacturing a lossy dielectric includes providing at least one high dielectric loss layer and providing at least one high thermal conductivity-electrically insulating layer adjacent the... | 06/17/2003 |
| 6506691 | High rate silicon nitride deposition method at low pressures A method for high rate silicon nitride deposition at low pressures, including a method of operating a CVD reactor providing a novel combination of wafer temperature, gas flow and chamber pressure resulting in both rapid deposition and a uniform, smooth fi... | 01/14/2003 |
| 6495959 | Cermet for lamp and ceramic discharge lamp An improved cermet for hermetically sealing a discharge vessel in a ceramic discharge lamp where the cermet includes a material having a coefficient of linear expansion which is at least equal to a coefficient of linear expansion of a translucent ceramic,... | 12/17/2002 |
| 6316116 | Ceramic circuit board and method of manufacturing the same The present invention provides a ceramic circuit board comprising: a ceramic substrate comprising ceramic crystal grains and liquid phase component grains; and a conductive layer to be formed as a circuit integrally formed to the ceramic substrate, wherei... | 11/13/2001 |
| 6245185 | Method of making a multilayer ceramic product with thin layers Disclosed is a method of making a multilayer ceramic product with thin layers, the method including the steps of: (a) providing a thick ceramic greensheet and a plurality of thin ceramic greensheets; (b) aligning and stacking the thin ceramic greensheet o... | 06/12/2001 |
| 5932043 | Method for flat firing aluminum nitride/tungsten electronic modules A method and apparatus for flattening a ceramic body comprised primarily of an aluminum nitride system having a liquid phase additive necessary for low temperature sintering during a firing thereof is disclosed. The ceramic body is referred to as an alumi... | 08/03/1999 |
| 5759320 | Method of forming cavity substrates using compressive pads The present invention relates generally to a new apparatus and method for forming cavities in semiconductor substrates without the necessity of using an insert. More particularly, the invention encompasses an apparatus and a method for fabricating cavitie... | 06/02/1998 |
| 5688450 | Method of making an electronic package structure utilizing aluminum nitride/aluminum composite material A packaged electronic structure includes an electronic device, and a package to which the electronic device is affixed. At least a portion of the package is made of a composite material of aluminum nitride dispersed in aluminum. The composite material is ... | 11/18/1997 |
| 5683529 | Process of producing aluminum nitride multiple-layer circuit board A process of producing a multiple-layer circuit board of aluminum nitride, including the steps of: preparing green sheets of aluminum nitride, forming on the green sheets conductor patterns of a conductor paste containing tungsten as a main conductor comp... | 11/04/1997 |
| 5681410 | Method of producing a piezoelectric/electrostrictive actuator A method of producing a piezoelectric/electrostrictive actuator including a ceramic substrate and a piezoelectric/electrostrictive portion, including the steps of: superposing on each other a first and a second green sheet which give, by firing thereof, a... | 10/28/1997 |
| 5662755 | Method of making multi-layered ceramic substrates A method of making a multi-layered ceramic substrate which includes the steps of laminating a desired number of green sheets each being made of glass ceramics containing at least an organic binder and a solvent and each having a pattern of electrodes form... | 09/02/1997 |
| 5656113 | Method of manufacturing a multilayered wiring substrate of aluminum nitride having a high dielectric layer An aluminum nitride multilayered wiring substrate and a method of manufacturing the wiring substrate are provided. The wiring substrate is provided with the high dielectric layer. Although the wiring substrate has no excessively multilayered structure, hi... | 08/12/1997 |
| 5593526 | Process for preparing a multi-layer wiring board A process for producing a multi-layer wiring board having alternate layers of a glass ceramic material and conductor patterns. The glass ceramic layers are made up of a glass ceramic material including a glass matrix and ceramic particles dispersed in the... | 01/14/1997 |
| 5575872 | Method for forming a ceramic circuit substrate A laminated body of a plurality of slit ceramic green sheets 10 with rod-shaped members 11 placed in the spaces defined by the slits 9 is sandwiched by two laminated ceramic green bodies of a plurality of blank ceramic green sheets 8, pressing to make the... | 11/19/1996 |
| 5534091 | Joining method of ceramics and insertion member for heating and joining for use in the method The present invention related to a method for joining ceramic members and an insertion member to be employed in the joining method. In the present invention, ceramic members are heated by the induction heating in a state that a heating ceramic member havi... | 07/09/1996 |
| 5516388 | Sol-gel bonding Preexisting elements are bonded by placing a sol-gel solution between juxtapositioned surfaces of the elements and sintering a gel formed from the solution at a temperature, which does not damage the elements, to form a sol-gel derived bonding material. T... | 05/14/1996 |
