"That the automobile has practically reached the limit of its development is suggested by the fact that during the past year no improvements of a radical nature have been introduced."
Scientific American ; Jan. 2 edition, 1909
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| Number | Title | Issue Date |
| 7988817 | Lift pin driving device and a flat panel display manufacturing apparatus having same A lift pin driving device and a flat panel display (FPD) manufacturing apparatus having the device are provided. The lift pin driving device can precisely move a plurality of lift pins using one motor, thus realizing a simple lift pin driving structure and a simple ... | 08/02/2011 |
| 7556712 | Laser cleaning of backside of wafer for photolithographic processing A photolithography process may be carried out after cleaning the backside of a wafer by means of an apparatus that includes an illumination module for conducting an optical illumination operation of photolithography to the front side of the wafer, and a cleaning mod... | 07/07/2009 |
| 7537673 | Plasma processing apparatus Disclosed herein is a plasma processing apparatus, which generates plasma within a vacuum chamber to process semiconductor substrates using the plasma. The apparatus comprises a substrate mounting table, an outer lifting bar, and a baffle. The outer lifting bar comp... | 05/26/2009 |
| 7422655 | Apparatus for performing semiconductor processing on target substrate An apparatus for performing a semiconductor process on a target substrate (W) includes a lifting mechanism (48) disposed in a worktable (38) to assist transfer of the target substrate. The lifting mechanism includes a lifter pin (51) configured ... | 09/09/2008 |
| 7422637 | Processing chamber configured for uniform gas flow An apparatus and method for performing uniform gas flow in a processing chamber is provided. In one embodiment, an apparatus is an edge ring that includes an annular body having an annular seal projecting therefrom is provided. The seal is coupled to a side of the a... | 09/09/2008 |
| 7419551 | Plasma reactor with apparatus for dynamically adjusting the plasma source power applicator and the workpiece relative to one another A plasma reactor for processing a workpiece includes a process chamber comprising an enclosure including a ceiling and having a vertical axis of symmetry generally perpendicular to said ceiling, a workpiece support pedestal inside the chamber and generally facing th... | 09/02/2008 |
| 7416632 | Substrate processing apparatus and substrate processing method A substrate processing apparatus and a substrate processing method are provided wherein an oxide film which is thinner than the conventional films can be formed with uniform thickness when forming an oxide film on the front-side surface of a substrate. A subs... | 08/26/2008 |
| 7413612 | In situ substrate holder leveling method and apparatus Embodiments of the present invention are directed to adjusting the spacing between the substrate support and the faceplate of the gas distribution member to achieve improved uniformity of the layer formed on the substrate. One embodiment of the present invention is ... | 08/19/2008 |
| 7396432 | Composite shadow ring assembled with dowel pins and method of using A composite shadow ring that is constructed of an upper ring and a lower ring assembled together by a plurality of dowel pins and a method for using the ring. The upper ring and the lower ring each has a predetermined outside diameter that is substantially the same,... | 07/08/2008 |
| 7393433 | Plasma processing apparatus, semiconductor manufacturing apparatus and electrostatic chucking unit used thereof A wiring member which becomes substantially symmetrical on the plane of an electrostatic chuck unit is connected to the tip end of an RF introduction rod between the RF introduction rod and the electrostatic chuck unit in order to make uniform generation of an elect... | 07/01/2008 |
| 7381276 | Susceptor pocket with beveled projection sidewall An apparatus for holding a semiconductor substrate comprises a plate having a pocket which holds the substrate, wherein the pocket comprises a lower surface and an inner edge. The inner edge comprises a plurality of members extending radially inward to reduce the ar... | 06/03/2008 |
| 7371287 | Substrate handling system A substrate handling system and method in which an air chuck produces a film of air between the substrate and the air chuck, a magnetic chuck attracts the substrate to the air chuck, and an actuator subsystem moves the magnetic chuck closer to and away from the air ... | 05/13/2008 |
| 7347656 | Vacuum processing apparatus and semiconductor manufacturing line using the same A vacuum processing apparatus is composed of a cassette block and a vacuum processing block. The cassette block has a cassette table for mounting a plurality of cassettes containing a sample and an atmospheric transfer means. The vacuum processing block has a plural... | 03/25/2008 |
| 7347900 | Chemical vapor deposition apparatus and method A chemical vapor deposition (CVD) apparatus includes a process chamber where a deposition process is performed on a wafer. A gas supply assembly is mounted in the process chamber for supplying a process gas to the process chamber, and a vacuum pump is mounted in the... | 03/25/2008 |
| 7337792 | Liquid processing apparatus and liquid processing method A cleaning apparatus 1 includes a foup loading/unloading part 2 for mounting foups F each accommodating a plurality of wafers W at intervals of a constant pitch (normal pitch), a rotor 34 capable of holding the wafers W at half the normal pitch ... | 03/04/2008 |
| 7334979 | Adjustable substrate transfer apparatus A substrate transfer apparatus (100) includes a base (40), first and second cassettes (1, 2), a adjustable cassette (6), and a push unit (50). The adjustable cassette (6) is between the first and second cassettes, and has a ... | 02/26/2008 |
| 7311782 | Apparatus for active temperature control of susceptors A method and an apparatus utilized for thermal processing of substrates during semiconductor manufacturing. The method includes heating the substrate to a predetermined temperature using a heating assembly, cooling the substrate to the predetermined temperature usin... | 12/25/2007 |
| 7276125 | Barrel type susceptor The barrel type susceptor for use in the semiconductor epitaxial growth is characterized in that a face plate 5 of a susceptor main body 2 having the shape of a truncated cone is partitioned into two or more in a longitudinal direction thereof, each pa... | 10/02/2007 |
| 7276123 | Semiconductor-processing apparatus provided with susceptor and placing block A semiconductor-processing apparatus comprises a susceptor and removable placing blocks detachably placed at a periphery of the susceptor for transferring a substrate. Retractable supporting members are provided for detaching/attaching the placing blocks from/to the... | 10/02/2007 |
| 7267725 | Thin-film deposition apparatus A thin-film deposition apparatus includes a reaction chamber, a substrate transfer chamber, a susceptor having a radially-extending step portion, a ring-shaped separation wall for separating the reaction chamber and the substrate transfer chamber at a processing pos... | 09/11/2007 |
| 7264688 | Plasma reactor apparatus with independent capacitive and toroidal plasma sources A plasma reactor includes a toroidal plasma source having an RF power applicator, and RF generator being coupled to the RF power applicator. The reactor further includes a capacitively coupled plasma source power applicator or electrode at the ceiling or the workpie... | 09/04/2007 |
| 7261796 | Method and apparatus for aligning a machine tool A machine tool is provided comprising a base, a slide assembly attached to the base for supporting a tool and translating the tool along an axis, and a workpiece holder attached to the base. At least one of the slide assembly and the workpiece holder are movable lat... | 08/28/2007 |
| 7258811 | Wafer stage including electrostatic chuck and method for dechucking wafer using the wafer stage A wafer stage including an electrostatic chuck and a method for dechucking a wafer using the wafer stage are provided, wherein, the wafer stage includes an electrostatic chuck support, an electrostatic chuck, a lifting means, and a grounding means including a device... | 08/21/2007 |
| 7252737 | Pedestal with integral shield Generally, a substrate support member for supporting a substrate is provided. In one embodiment, a substrate support member for supporting a substrate includes a body coupled to a lower shield. The body has an upper surface adapted to support the substrate and a low... | 08/07/2007 |
| 7244336 | Temperature controlled hot edge ring assembly for reducing plasma reactor etch rate drift A temperature-controlled hot edge ring assembly adapted to surround a substrate support in a plasma reaction chamber. The assembly includes a conductive lower ring, a ceramic intermediate ring, and an upper ring. The intermediate ring overlies the lower ring and is ... | 07/17/2007 |
| 7225819 | Apparatus process and method for mounting and treating a substrate The present invention is a method, apparatus and process for an improved substrate mounting and processing technique for various substrate treatments comprising cleaning, dicing, sawing, polishing, and planarization, among others. ... | 06/05/2007 |
| 7224450 | Method and apparatus for position-dependent optical metrology calibration A calibration method suitable for highly precise and highly accurate surface metrology measurements is described. In preferred embodiments, an optical inspection tool including a movable optics system is characterized in terms of position and wavelength dependent qu... | 05/29/2007 |
| 7204913 | In-situ pre-coating of plasma etch chamber for improved productivity and chamber condition control A semiconductor processing chamber having a silicon containing pre-coat is provided. The chamber includes a top electrode in communication with a power supply and a processing chamber defined within a base, a sidewall extending from the base, and a top disposed on t... | 04/17/2007 |
| 7204888 | Lift pin assembly for substrate processing Embodiments of the present invention provide an apparatus for constraining and supporting the lift pins to prevent or minimize lateral movement of the lift pins that causes substrate hand-off problems and associated degradation in substrate processing characteristic... | 04/17/2007 |
| 7201176 | Wafer chucking apparatus for spin processor A wafer chuck is configured to hold a wafer efficiently for spin process cleaning of wafer edges and back sides. A first group of retractable tips extend to hold the wafer during a first portion of the cleaning period. A second group of retractable tips extend to ho... | 04/10/2007 |
| 7179397 | Plasma processing methods and apparatus To move an article in and out of plasma during plasma processing, the article is rotated by a first drive around a first axis, and the first drive is itself rotated by a second drive. As a result, the article enters the plasma at different angles for different posit... | 02/20/2007 |
| 7169234 | Apparatus and methods for preventing rotational slippage between a vertical shaft and a support structure for a semiconductor wafer holder A substrate support assembly positively secures a substrate holder support to a rotation shaft with respect to rotationally applied forces. A substrate holder support is configured to have an opening in a socket into which, when aligned with an indentation in the ro... | 01/30/2007 |
| 7166187 | Segmented cold plate for rapid thermal processing (RTP) tool for conduction cooling The present invention is directed to a semiconductor thermal processing system and an apparatus for thermally cooling a semiconductor substrate. According to one aspect of the present invention, a semiconductor thermal processing system and associated apparatus and ... | 01/23/2007 |
| 7153388 | Chamber for high-pressure wafer processing and method for making the same Broadly speaking, a wafer processing chamber for performing a high pressure wafer process is provided. More specifically, the wafer processing chamber incorporates a wafer processing volume and an outer chamber volume. The wafer processing volume is configured to co... | 12/26/2006 |
| 7153367 | Drive mechanism for a vacuum treatment apparatus The invention relates to a drive mechanism for a vacuum treatment apparatus by which substrate holders can be transported around an axis (A—A) from an entrance airlock to an exit airlock. A stationary supporting column (1) is disposed in the center and on i... | 12/26/2006 |
| 7140066 | Apparatus and method for inspecting and cleaning semiconductor devices A semiconductor device is inspected and cleaned by applying a vacuum to the area in which the semiconductor device is positioned. Micro-sized particulates that are brushed off the semiconductor device during cleaning are drawn off by the vacuum. ... | 11/28/2006 |
| 7094312 | Focused particle beam systems and methods using a tilt column Particle beam systems and methods for interacting with a workpiece according to this invention include a work stage assembly and a first particle beam source. The work stage assembly is adapted a) for supporting a workpiece, b) for translating along a first axis, c)... | 08/22/2006 |
| 7087119 | Atomic layer deposition with point of use generated reactive gas species An apparatus for atomic layer deposition preventing mixing of a precursor gas and an input gas. From the apparatus a flow of the input gas is provided over a surface of the workpiece wherein a beam of the electromagnetic radiation is directed into the input gas in c... | 08/08/2006 |
| 7087122 | Wafer backside plate for use in a spin, rinse, and dry module and methods for making and implementing the same A method for spinning a wafer to enable rinsing and drying is provided. The method includes engaging the wafer at a wafer processing plane and spinning the wafer. The method further includes moving a wafer backside plate from a first position to a second position as... | 08/08/2006 |
| 7040330 | Method and apparatus for megasonic cleaning of patterned substrates A system for cleaning a semiconductor substrate is provided. The system includes transducers for generating acoustic energy oriented in a substantially perpendicular direction to a surface of a semiconductor substrate and an acoustic energy oriented in a substantial... | 05/09/2006 |