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Class 156/345.29 - With etchant gas supply or exhaust structure located outside of etching chamber (e.g., supply tank, pipe network, exhaust pump, particle filter)


Subclass of Class 156 - Adhesive bonding and miscellaneous chemical manufacture
Definition: Apparatus including a structurally defined means located
No. of patents: 281
Last issue date: 10/18/2011


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NumberTitleIssue Date
8038834Method and system for controlling radical distribution
A plasma processing system includes a processing chamber, a substrate holder configured to hold a substrate for plasma processing, and a gas injection assembly. The gas injection assembly includes a first evacuation port located substantially in a center of the gas ...
10/18/2011
7833382Vacuum processing apparatus
A vacuum processing apparatus comprising a transfer unit disposed at a center thereof, plural processing chambers, each processing chamber having a processing table for supporting an object to be processed and carrying out processing using a gas; and amass flow cont...
11/16/2010
7718030Method and system for controlling radical distribution
A plasma processing system includes a processing chamber, a substrate holder configured to hold a substrate for plasma processing, and a gas injection assembly. The gas injection assembly includes a first evacuation port located substantially in a center of the gas ...
05/18/2010
7648610Baffle plate, apparatus for producing the same, method of producing the same, and gas processing apparatus containing baffle plate
The present invention provides a gas process apparatus that realizes uniform exhaust without depending on process conditions, a gas process chamber that constitutes the gas process apparatus, a baffle plate mounted on the gas process chamber, a method of producing t...
01/19/2010
7517429Plasma treatment apparatus
The present invention relates to a plasma treatment apparatus, and more particularly, to a plasma treatment apparatus capable of supplying pressure gas while preventing flying of particles accumulated on the bottom of a chamber. The plasma treatment apparatus of the...
04/14/2009
7491292Apparatus for catching byproducts in semiconductor device fabrication equipment
An apparatus for catching byproducts in semiconductor device processing equipment is disposed in an exhaust line between a process chamber and a vacuum pump. The apparatus includes a cylindrical trap housing member, an upper cover and a lower cover covering the uppe...
02/17/2009
7491291Apparatus for trapping residual products in semiconductor device fabrication equipment
An apparatus traps residual products before the products can be formed in or flow to a vacuum pump in semiconductor device manufacturing equipment. The apparatus is connected between a process chamber and the vacuum pump and includes first and second cooling plates ...
02/17/2009
7481902Substrate processing apparatus and method, high speed rotary valve and cleaning method
A substrate processing apparatus includes a processing vessel provided with a stage holding thereon a substrate to be processed and evacuated at an evacuation port, and a source gas supplying system that supplies plural source gases to the processing vessel separate...
01/27/2009
7431773Atomic layer deposition apparatus and method
An atomic layer deposition method includes positioning a semiconductor substrate within an atomic layer deposition chamber. A first deposition precursor is fed to the chamber under first vacuum conditions effective to form a first monolayer on the substrate. The fir...
10/07/2008
7402210Apparatus and method for hybrid chemical processing
In one embodiment, an apparatus for performing an atomic layer deposition process is provided which includes a chamber body having a substrate support, a lid assembly attached to the chamber body, and delivery sub-assemblies coupled to the lid assembly and configure...
07/22/2008
7383841Method of cleaning substrate-processing device and substrate-processing device
In a cleaning step of a substrate-processing device, vacuum drawing is made for the space between an inner chamber and an outer chamber that receives the inner chamber. Temperature of the inner chamber is set higher than the temperature of the inner chamber during s...
06/10/2008
7374620Substrate processing apparatus
A substrate processing apparatus (10A) using a microwave plasma is disclosed wherein an inner partition wall (15) is provided within a process chamber (11) so that the inside of the process chamber (11) is divided into a space (11A...
05/20/2008
7371332Uniform etch system
Etching a layer over a substrate is provided. The substrate is placed in a plasma processing chamber. A first gas is provided to an inner zone within the plasma processing chamber. A second gas is provided to the outer zone within the plasma processing chamber, wher...
05/13/2008
7364798Internal member for plasma-treating vessel and method of producing the same
It is to propose an internal member for a plasma treating vessel having excellent resistances to chemical corrosion and plasma erosion under an environment containing a halogen gas and an advantageous method of producing the same, which is a member formed by coverin...
04/29/2008
7354501Upper chamber for high density plasma CVD
The present invention is directed to an upper chamber design of a plasma CVD chamber which provides more uniform conditions for forming thin CVD films on a substrate. Embodiments of the invention improve temperature control of the upper chamber and improve particle ...
04/08/2008
7351291Semiconductor processing system
A semiconductor processing system includes a load lock chamber and first to third process chambers connected to an airtight transfer chamber. The second process chamber is disposed below the first process chamber and overlaps with the first process chamber. The thir...
04/01/2008
7335601Method of processing an object and method of controlling processing apparatus to prevent contamination of the object
A method of manufacture includes processing an object in a chamber and subsequently generating an electrical force of attraction to float contaminants off of a region adjacent the processed object before the object is unloaded from the chamber. The object may be pro...
02/26/2008
7334346Device and method for controlling dehydration during freeze-drying
A device for controlling dehydration during freeze-drying in an enclosure connected to a vacuum line includes an analyzer for analyzing the gases contained in the enclosure, the gas analyzer comprising a system for ionizing the gases comprising a plasma source in co...
02/26/2008
7332038Device for depositing in particular crystalline layers on one or more, in particular likewise crystalline substrates
A device for depositing crystalline layers onto one or more substrates in a process chamber, including: a reverse-heatable support plate which forms a wall of the process chamber and which is heated with a high frequency and is formed of inertly coated graphite; a g...
02/19/2008
7332689Tacking method and apparatus
An apparatus for tacking a multi-lumen tubular assembly together comprises a laser, an optical member and a placement tray for retaining the tubular assembly. A portion of the optical member defines a window that is substantially transparent to laser energy emitted ...
02/19/2008
7321125Transverse magnetic field voltage isolator
A voltage-isolating passageway for providing high voltage isolation between a component maintained at high DC voltage and a component maintained at a substantially lower voltage is described. The voltage-isolating passageway incorporates a transverse magnetic field ...
01/22/2008
7309471Method for producing unsaturated halogenic hydrocarbons and device suitable for use with said method
An apparatus for producing ethylenically unsaturated aliphatic halogenic hydrocarbons by thermal cleavage of saturated aliphatic halogenic carbons using an apparatus that introduces an educt gas stream into a reactor which includes at least one supply conduit which ...
12/18/2007
7300558Rapid cycle time gas burster
An apparatus for rapidly establishing at least one preselected gas pressure in a process chamber comprising: (a) a chamber defining an interior space adapted to be maintained at a reduced pressure; and (b) a gas su...
11/27/2007
7296532Bypass gas feed system and method to improve reactant gas flow and film deposition
A method and reactant gas bypass system for carrying out a plasma enhanced chemical vapor deposition (PECVD) process with improved gas flow stability to avoid unionized reactant precursors and thickness non-uniformities the method including providing a semiconductor...
11/20/2007
7294207Gas-admission element for CVD processes, and device
The invention relates to a method for depositing especially, crystalline layers onto especially, crystalline substrates. At least two process gases are led into a process chamber of a reactor separately from each other, through a gas inlet mechanism above a heated s...
11/13/2007
7292427Pin lift chuck assembly for warped substrates
A vacuum chuck apparatus may include chuck plate having a substantially flat chucking surface, one or more lift pins, and a lifting mechanism. The lift pins are configured to clamp a substrate at three or more locations. The lifting mechanism lifts the heads of the ...
11/06/2007
7282112Method and apparatus for an improved baffle plate in a plasma processing system
The present invention presents an improved baffle plate for a plasma processing system, wherein the design and fabrication of the baffle plate advantageously provides for a uniform processing plasma in the process space with substantially minimal erosion of the baff...
10/16/2007
7276122Multi-workpiece processing chamber
A multi-workpiece chamber includes at least two processing stations, for exposing workpieces to a treatment process. A partition cooperates with the chamber such that the partition is disengagably removable from the chamber and re-engagable with the chamber for sele...
10/02/2007
7262409Chemical etch solution and technique for imaging a device's shallow junction profile
The present invention provides, in one aspect, a method of imaging a microelectronics device 100. The method comprises cleaning, when contaminants are preset, a sample of a microelectronics device 100 to be imaged with a first solution comprising hydro...
08/28/2007
7255773Plasma processing apparatus and evacuation ring
A plasma processing apparatus having an evacuation ring with high plasma resistance and capable of minimizing abnormal discharge is provided. A processing chamber 100 includes a ceiling unit 110 at which an upper electrode 112 is provided and a ...
08/14/2007
7253756Method and device for dynamically accelerating analog-to-digital converter
A method and a device for dynamically accelerating an analog-to-digital converter (ADC) are provided. The device for dynamically accelerating ADC is capable of detecting the sampling frequency and controlling the maximum conversion rate by boosting the current into ...
08/07/2007
7252719High pressure processing method
A high-pressure processing apparatus includes a processing vessel including a processing chamber formed therein to perform a certain process onto an object in the processing chamber; fluid feeding means which feeds a high-pressure fluid into the processing chamber; ...
08/07/2007
7252716Gas injection apparatus for semiconductor processing system
A gas injection apparatus for injecting a reactive gas into a reaction chamber of a semiconductor processing system includes an injector in contact with an inner surface of a wall of the reaction chamber. The injector has a plurality of nozzles through which the rea...
08/07/2007
7250094Heat treatment apparatus
A processing gas is prevented from entering into a space below a placement table. A supporting surface for supporting the lower face of a placement table is provided at an inner circumferential portion of the upper end of a support column. A circumferentially extend...
07/31/2007
7244335Substrate processing system and substrate processing method
A substrate processing system is provided with an ozone generator capable of generating an ozone-containing gas by discharging electricity in an oxygen-containing gas, and a plurality of processing chambers each capable of holding substrates therein to process the s...
07/17/2007
7244315Microelectronic device drying devices and techniques
Improved methods of rinsing and drying microelectronic devices by way of an immersion processing apparatus are provided for effectively cleaning microelectronic devices. Methods and arrangements control the separation of one or more microelectronic devices from a li...
07/17/2007
7225820High-pressure processing chamber for a semiconductor wafer
A processing chamber having an improved sealing means is disclosed. The processing chamber comprises a lower element, an upper element, and a seal energizer. The seal energizer is configured to maintain the upper element against the lower element to maintain a proce...
06/05/2007
7205034Method and device for generating uniform high-frequency plasma over large surface area used for plasma chemical vapor deposition apparatus
A plasma generation device for generating plasma uniformly over a large surface area by very high frequency (VHF), which is installed in a plasma chemical vapor deposition apparatus. A first and a second power supply section are installed on both ends of the dischar...
04/17/2007
7204886Apparatus and method for hybrid chemical processing
A method and apparatus for performing multiple deposition processes is provided. In one embodiment, the apparatus includes a chamber body and a gas distribution assembly disposed on the chamber body. In one embodiment, the method comprises positioning a substrate su...
04/17/2007
7198677Low temperature wafer backside cleaning
A ring is provided that, together with a wafer, separates a processing chamber into an upper portion and a lower portion so that one side of the wafer, such as the backside, can be cleaned or otherwise processed with little or no interaction to the frontside of the ...
04/03/2007
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