Did You Know...
...Chester Carlson was a patent agent who tired of having to make multiple copies of patent applications using the only duplication method available at the time: carbon paper. In 1959 he came up with a new copying system and took it to IBM for evaluation. The "experts" at IBM determined potential sales to be only 5,000 units because people wouldn't want to use a bulky machine when they had carbon paper. Carlson's invention was the xerography process, the company founded on the system is Xerox.
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| Number | Title | Issue Date |
| 7998306 | Substrate processing apparatus The present invention provides a substrate processing apparatus for processing substrates by immersing the substrates in a processing liquid. This substrate processing apparatus includes a processing tank having a pair of side walls arranged to be opposed to each ot... | 08/16/2011 |
| 7807017 | Etching apparatus for substrates An etching apparatus for substrates includes an etching tank including an etching solution, a cassette having a plurality of substrates mounted therein and which is installed inside the etching tank, a porous plate installed on a lower surface of the cassette and a ... | 10/05/2010 |
| 7582180 | Systems and methods for processing microfeature workpieces Systems and methods for processing microfeature workpieces are disclosed herein. In one embodiment, the system comprises a processing chamber having a workpiece processing site configured to receive a microfeature workpiece and a main inlet through which a processin... | 09/01/2009 |
| 7531060 | Integrated tool assemblies with intermediate processing modules for processing of microfeature workpieces An intermediate module comprising a dimensionally stable mounting module and a first device attached to the dimensionally stable mounting module. The dimensionally stable mounting module can include a front docking unit with front alignment elements for connecting t... | 05/12/2009 |
| 7476290 | Substrate processing apparatus and substrate processing method The present invention provides a substrate processing apparatus and a substrate processing method suitable for use in an etching apparatus which etches a thin film formed on a peripheral portion of a substrate. The present invention also provides a substrate process... | 01/13/2009 |
| 7427333 | Resist removing method and resist removing apparatus In an inventive resist removing method, sulfuric acid and hydrogen peroxide water are supplied to a surface of a substrate to remove a resist from the substrate surface. Thereafter, hydrogen peroxide water is supplied to the substrate surface to remove the sulfuric ... | 09/23/2008 |
| 7399713 | Selective treatment of microelectric workpiece surfaces This invention provides a process for treating a workpiece having a front side, a back side, and an outer perimeter. In accordance with the process, a processing fluid is selectively applied or excluded from an outer peripheral margin of at least one of the front or... | 07/15/2008 |
| 7393431 | Bubble plate for etching and etching apparatus using the same An etching apparatus is disclosed, in which a bubble plate includes a plurality of air tubes having a plurality of holes being arranged in a straight line, and a straight frame having an air path and being connected to both ends of the air tube. The etching apparatu... | 07/01/2008 |
| 7377991 | Ultrasonic assisted etch using corrosive liquids An ultrasonic etching apparatus for chemically-etching a workpiece is disclosed. The apparatus includes an outer tank at least partially filled with an aqueous solution, an inner tank at least partially disposed within the outer tank and in contact with aqueous solu... | 05/27/2008 |
| 7370796 | Laser processing system A laser processing system including a laser processing machine capable of operating along an inherent control axis, an axis driving section driving the control axis of the laser processing machine, a laser oscillator supplying a laser beam to the laser processing ma... | 05/13/2008 |
| 7361610 | Method of etching a glass substrate The present invention discloses an etching apparatus comprising an etching bath having an etchant; an etchant recycling part in the etching bath; a DI and undiluted etchant supply part for supplying a DI water and a undiluted etchant; an etchant mixing part for mixi... | 04/22/2008 |
| 7357115 | Wafer clamping apparatus and method for operating the same A wafer clamping apparatus is provided to secure a wafer within a chamber during wafer processing. The wafer clamping apparatus creates a pressure differential between a top surface and a bottom surface of the wafer. The pressure differential serves to pull the wafe... | 04/15/2008 |
| 7341634 | Apparatus for and method of processing substrate A workpiece is processed uniformly, e.g., a uniform plated film is formed on a workpiece, by a processing liquid, e.g., a plating solution, which is maintained in an optimum state while minimizing the amount of the processing liquid to be used. An apparatus for proc... | 03/11/2008 |
| 7338909 | Micro-etching method to replicate alignment marks for semiconductor wafer photolithography A method and apparatus for locally etching a substrate area the method including providing a substrate comprising a process surface; depositing a material layer over the process surface; and, applying a wet etchant to cover a targeted etching portion of the process ... | 03/04/2008 |
| 7332054 | Etch apparatus In a process using a hot phosphoric acid etchant (12) to etch silicon nitride on a semiconductor wafer (15) submerged in a tank (11) of the etchant (12), a recirculating path is established for the etchant (12). A porous filter ( | 02/19/2008 |
| 7304706 | IPS liquid crystal display device with edge of the pixel electrode, common electrode, and signal line having stairwise stepped portions In an IPS liquid crystal display device, a reduction in optical leakage from the outer peripheral portion of an electrode pattern in flexed configuration and an improvement in the contrast of display on a screen are intended. The IPS liquid crystal display device ha... | 12/04/2007 |
| 7294040 | Method and apparatus for supporting a microelectronic substrate relative to a planarization pad A method and apparatus for planarizing a microelectronic substrate. In one embodiment, one surface of the microelectronic substrate is engaged with a planarizing pad and the opposite surface of the microelectronic substrate is positioned proximate to a substrate sup... | 11/13/2007 |
| 7275749 | Substrate supporting apparatus A substrate supporting apparatus for supporting a substrate or wafer in a non-contact state by Bernoulli theorem is disclosed. The substrate supporting apparatus 1 comprises a housing 2, a rotatable chuck 3 which is disposed in the housing 2 | 10/02/2007 |
| 7267742 | Etching apparatus, a method of controlling an etching solution, and a method of manufacturing a semiconductor device An etching apparatus includes a chamber containing an etching solution including first and second components and water, a concentration of the water in the etching solution is at a specified level or lower; a circulation path circulating the etching solution; a conc... | 09/11/2007 |
| 7262140 | Method of smoothing waveguide structures A semiconductor based structure containing substantially smoothed waveguides having a rounded surface is disclosed, as well as methods of fabricating such a structure. The substantially smoothed waveguides may be formed of waveguide materials such as amorphous silic... | 08/28/2007 |
| 7252778 | Etching method and etching device An etching method and etching device are provided, enabling uniform rendering of the thickness of a film for processing on a wafer regardless of the film thickness profile thereof, and thereby enabling global planarizing of the wafer surface. In an etching method, t... | 08/07/2007 |
| 7229521 | Etching system using a deionized water adding device An etching system (3) includes an etching chamber (31), an etchant solution tank (32) connected with the etching chamber, a heater (34) set in the tank, and a deionized water (DIW) adding device. The DIW adding device includes a DIW feedi... | 06/12/2007 |
| 7226842 | Fabricating strained channel epitaxial source/drain transistors The mobility of carriers may be increased in strained channel epitaxial source/drain transistors. Doped silicon material may be blanket deposited after removing ion implanted source/drain regions. The blanket deposition forms amorphous films over non-source/drain ar... | 06/05/2007 |
| 7217662 | Method of processing a substrate There is disclosed a method of processing a substrate, which comprises applying a surfactant or a water soluble polymer agent onto a surface of a substrate to be processed, and sliding a circumferential portion of the substrate and a polishing member against each ot... | 05/15/2007 |
| 7172674 | Device for liquid treatment of wafer-shaped articles A device for liquid treatment of a defined area of a wafer-shaped article, especially of a wafer, in which a mask is kept at a defined short distance to the wafer-shaped article such that liquid can be retained between the mask and the defined area of the wafer-shap... | 02/06/2007 |
| 7169253 | Process sequence for photoresist stripping and/or cleaning of photomasks for integrated circuit manufacturing A method and system for cleaning and/or stripping photoresist from photomasks used in integrated circuit manufacturing comprising a process and means of introducing a mixture of sulfuric acid and ozone (or a mixture of sulfuric acid and hydrogen peroxide) to the sur... | 01/30/2007 |
| 7166183 | Apparatus and method for treating edge of substrate An apparatus for treating an edge of a semiconductor substrate includes an etchant supply nozzle for supplying a first etchant to the edge of the semiconductor substrate. The apparatus further includes a shielding cover for preventing an etchant from flowing to a sh... | 01/23/2007 |
| 7153370 | Method of cleaning semiconductor wafer The present application discloses a method of cleaning a semiconductor wafer by mounting a wafer to a chuck, positioning a gas guard, defining therein a chamber having an open bottom, immediately above the layer of water, spraying de-ionized water onto the wafer whi... | 12/26/2006 |
| 7138014 | Electroless deposition apparatus An apparatus and a method of depositing a catalytic layer comprising at least one metal selected from the group consisting of noble metals, semi-noble metals, alloys thereof, and combinations thereof in sub-micron features formed on a substrate. Examples of noble me... | 11/21/2006 |
| 7132034 | Apparatus for etching a glass substrate In an apparatus for etching a glass substrate according to the present invention, impurities that are attached to the surface of a glass substrate, which are formed by assembling a color filter substrate and a TFT substrate provided in the etching bath filled with e... | 11/07/2006 |
| 7100306 | Wafer guides for processing semiconductor substrates A wafer guide includes a horizontal support panel and at least three vertical panels attached on one surface of the support panel. Each of the vertical panels has a vertical body panel and a plurality of protrusions upwardly extended from a top surface of the vertic... | 09/05/2006 |
| 7097784 | Etching method and apparatus for semiconductor wafers A method for etching semiconductor wafers in an etching apparatus including an etching bath filled with an etchant and capable of setting liquid temperature and process sequence, comprises selecting a predetermined etching program suitable for etching of the semicon... | 08/29/2006 |
| 7091132 | Ultrasonic assisted etch using corrosive liquids An ultrasonic etching apparatus for chemically-etching a workpiece is disclosed. The apparatus includes an outer tank at least partially filled with an aqueous solution, an inner tank at least partially disposed within the outer tank and in contact with aqueous solu... | 08/15/2006 |
| 7077727 | Process for chemical-mechanical polishing of metal substrates Abrasive composition for the chemical-mechanical polishing in one stage of substrates used in the microelectronics semiconductors industry containing at least one metal layer and one insulator layer, comprising an acid aqueous suspension of individualized particles ... | 07/18/2006 |
| 7074278 | Removable lid and floating pivot A semiconductor processing system includes a chamber adapted to process a wafer, the chamber having an opening to facilitate access to the interior of the chamber. The system has a lid coupled to the chamber opening, the lid having an open position and a closed posi... | 07/11/2006 |
| 7071077 | Method for preparing a bonding surface of a semiconductor layer of a wafer A method for preparing a bonding surface of a semiconductor layer of a wafer is described. The method includes treating the bonding surface to oxidize contaminants, and then cleaning the bonding surface to remove essentially all remaining contaminants. Ozone is then... | 07/04/2006 |
| 7067033 | Chemical liquid processing apparatus for processing a substrate In this disclosure, air flow is formed above chemical liquid film and a move of the chemical liquid is generated by making the air flow into a contact with the surface of chemical liquid. Further, a negative pressure is generated in a space between a processing obje... | 06/27/2006 |
| 7048824 | Device for treating silicon wafers A device (1) for treating objects, in particular silicon wafers (2), with a fluid (3), comprising a container (4) that holds the fluid (3); a rotatable carrying arrangement (5) for accommodation of the objects to be treated,... | 05/23/2006 |
| 7045072 | Cleaning process and apparatus for silicate materials A method for treating a surface of a quartz substrate includes preparing a substrate to provide a working surface having an initial roughness; and then ultrasonically acid-etching the working surface to increase the roughness of the working surface by at least about... | 05/16/2006 |
| 7026210 | Method for forming a bottle-shaped trench The invention provides a method for forming a bottle-shaped trench. A semiconductor substrate having a pad stack layer and a trench formed thereon is provided. Sidewall protective layers are then formed on the upper sidewalls of the trench. A masking layer is formed... | 04/11/2006 |
