Did You Know...
...that Thomas Edison's patent application on his phonograph was approved by the Patent Office in just seven weeks? In contrast, it took Gordon Gould, the inventor of the laser, 30 years to obtain his patent -- finally awarded in 1988!
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| Number | Title | Issue Date |
| 7273580 | Ferromagnetic resonance excitation and its use for heating substrates that are filled with particles Process for heating a substrate, which contains, relative to the total weight of the substrate, 0.1 to 70 wt. % of metallic, magnetic, ferrimagnetic, ferromagnetic, antiferromagnetic or superparamagnetic particles having an average particle size of between 1 and 500... | 09/25/2007 |
| 7271006 | Method and apparatus for automated coverslipping An apparatus and method for selecting and dispensing coverglasses over specimens on slides for the purpose of viewing specimens through a microscope. The selecting device contains a suctioning mechanism for picking up a coverglass from a stack of coverglasses. It al... | 09/18/2007 |
| 7270136 | Apparatus for cleaning the edges of wafers The invention concerns an apparatus for cleaning the edge of a wafer that may be relatively simply constructed with low cost, and prevent the wafer from being re-contaminated by the edge cleaning, thus resulting in increase of the yield rate of wafers. The apparatus... | 09/18/2007 |
| 7264996 | Method for separating wafers bonded together to form a stacked structure This invention relates to a method for separating at least two wafers (1, 2) bonded together to form a stacked structure. At least one bending force is applied to all or part of the stacked structure to separate the stacked structure into two parts along a re... | 09/04/2007 |
| 7263763 | Planarization method for a structure having a first surface for etching and a second surface A method is provided for planarization of structures which minimizes step heights, reduces process steps, improves cleanliness, and provides increased ease of debond. Structures are placed with working surfaces facing down onto an adhesive layer such that structures... | 09/04/2007 |
| 7261920 | Process for forming a patterned thin film structure on a substrate A process for forming a patterned thin film structure on a substrate is disclosed. A pattern is printed with a material, such as a masking coating or an ink, on the substrate, the pattern being such that, in one embodiment, the desired thin film structures will be f... | 08/28/2007 |
| 7255919 | Mold release layer transferring film and laminate film Provision of a releasing layer transfer film which can form, in a simple manner, a releasing layer on a COF flexible printed wiring board, the releasing layer preventing melt adhesion of an insulating layer to a heating tool, thereby enhancing productivity and relia... | 08/14/2007 |
| 7254886 | Interface device with a releasable mount In recapitulation, the present invention is a method and apparatus for the reliable removal and installation of a component feeding system, such as a direct die feeder, within a printed circuit board or similar assembly machine such as those used in the assembly of ... | 08/14/2007 |
| 7255772 | High pressure processing chamber for semiconductor substrate A high pressure chamber comprises a chamber housing, a platen, and a mechanical drive mechanism. The chamber housing comprises a first sealing surface. The platen comprises a region for holding the semiconductor substrate and a second sealing surface. The mechanical... | 08/14/2007 |
| 7251895 | Molding and name plate removal tool A multifunctional molding name plate removal tool includes a blade attached to a blade retainer having a drive arm and a threaded handle attached thereto. The threaded handle may be removed in order to enable a pneumatic tool to drive the tool. ... | 08/07/2007 |
| 7252734 | Process for manufacturing a headliner for the interior of an automobile and installation for use in the process A process for manufacturing a headliner for the interior of an automobile comprise the steps of: introducing at least one layer intended for constituting a support and one lining layer (200) in a press (300); applying pressure and heat on the layers an... | 08/07/2007 |
| 7252868 | Reinforced fibrous insulation product and method of reinforcing same An insulation product, and method of making the same, is provided comprising a mat containing randomly oriented fibers bonded by a binder, the mat having first and second major surfaces and a pair of side portions, and at least one flexible reinforcing layer bonded ... | 08/07/2007 |
| 7250374 | System and method for processing a substrate using supercritical carbon dioxide processing A method and system for processing a substrate in a film removal system. The method includes providing the substrate in a substrate chamber of a film removal system, where the substrate has a micro-feature containing a dielectric film on a sidewall of the micro-feat... | 07/31/2007 |
| 7247176 | Apparatus for removing fine particles during fabrication of a portable camera module An apparatus and a method adapted for shielding and removing fine particles for a portable camera module generated during a portable camera module fabricating process. The portable camera module includes an image sensor and an infrared ray filter. The apparatus incl... | 07/24/2007 |
| 7238543 | Methods for marking a bare semiconductor die including applying a tape having energy-markable properties A method used for marking a semiconductor wafer or device. The method and apparatus have particular application to wafers or devices which have been subjected to a thinning process, including backgrinding in particular. The present method comprises reducing the cros... | 07/03/2007 |
| 7238258 | System for peeling semiconductor chips from tape A system for peeling semiconductor chips from tape is provided with a nose on a housing. The nose has transverse dimensions smaller than the transverse dimensions of a target chip. Apertures are provided through the nose from the housing. Vacuum ports are provided i... | 07/03/2007 |
| 7238083 | Wafer carrier with pressurized membrane and retaining ring actuator A wafer carrier for controlling downward force and edge effect during chemical mechanical planarization. A retaining ring actuator is disposed within the retaining ring to control the height of the retaining ring relative to the bottom surface of the wafer carrier. ... | 07/03/2007 |
| 7234237 | Method for producing a protective cover for a device In a method for producing a protective cover for a device formed in a substrate, at first a sacrificial structure is produced on the substrate, wherein the sacrificial structure comprises a first portion covering a first area of the substrate including the device an... | 06/26/2007 |
| 7232738 | Device and method for cutting an assembly A method is presented for cutting an assembly that includes two layers of material having a first surface and a second surface. The method includes providing a weakened interface between the two layers that defines an interface ring about the periphery of the assemb... | 06/19/2007 |
| 7232500 | Method and device for producing products in web form This invention pertains to methods and devices for producing products in web form. In particularly advantageous embodiments, the instant invention relates to methods and devices for forming films by coating a coating mass formed from organic raw materials in an aque... | 06/19/2007 |
| 7226562 | Liquid analysis cartridge The present invention provides an apparatus and method for storing a particle-containing liquid. The storage apparatus comprises a microfluidic convoluted flow channel having a plurality of particle capture regions. The storage channel is preferably an isotropic spa... | 06/05/2007 |
| 7226521 | Laminae separating dispenser and method of use A method and apparatus for separating two laminae of a laminate. The apparatus has a separator extending into the path of the laminate as it travels through the apparatus. The separator may be shaped similar to a knife blade and be interposed between the two laminae... | 06/05/2007 |
| 7223319 | Semiconductor manufacturing apparatus and method of manufacturing semiconductor device A semiconductor manufacturing apparatus includes: a peeling mechanism to peel a pressure sensitive adhesive (PSA) tape from a semiconductor wafer constituted by a plurality of semiconductor chips which are separated therefrom, the semiconductor wafer having an eleme... | 05/29/2007 |
| 7223320 | Method and apparatus for expanding a semiconductor wafer Methods, systems, and apparatuses are described for expanding an area of a semiconductor wafer, an enhancing die transfer capability. A wafer is attached to a support structure. The wafer is separated on the support structure into a plurality of dies. An area of the... | 05/29/2007 |
| 7222772 | Flip chip bonder A flip chip bonder including a substrate holding mechanism and a chip die bonder for bonding a semiconductor chip having a plurality of electrodes projecting from its front surface to a substrate held on the substrate holding means. The flip chip bonder includes a c... | 05/29/2007 |
| 7219416 | Method of manufacturing a magnetic element The present invention provides a composite magnetic body containing metallic magnetic powder and thermosetting resin and having a packing ratio of the metallic magnetic powder of 65 vol % to 90 vol % and an electrical resistivity of at least 104 Ω·cm. W... | 05/22/2007 |
| 7220619 | Process of cutting electronic package The present invention provides a cutting process for cutting connected electronic package structures. The connected electronic package structures are connected through a mother carrier. Each electronic package structures includes at least an electronic component and... | 05/22/2007 |
| 7217992 | Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device Semiconductor devices,-semiconductor wafers, and semiconductor modules are provided: wherein the semiconductor device has a small warp; damages at chip edge and cracks in a dropping test are scarcely generated; and the semiconductor device is superior in mounting re... | 05/15/2007 |
| 7217335 | Method of manufacturing a soft hearing aid A method of manufacturing a hearing aid preferably includes the steps of: placing a moldable material in the ear canal of a patient to cast a form; using the form to form a hollow shell with an outer surface that approximates the shape of the patient's ear canal, th... | 05/15/2007 |
| 7210987 | Wafer grinding method Methods for grinding low-K interlayer dielectric (ILD) wafers are described herein. In various embodiments, the method may include cutting and severing a semiconductor wafer into a plurality of portions, the cutting and severing being performed in a manner that allo... | 05/01/2007 |
| 7211168 | Substrate supporting plate and stripping method for supporting plate There is provided a supporting plate having a structure in which a solvent can be supplied to an adhesive layer between the supporting plate and a substrate such as a semiconductor wafer in a short period of time after the substrate is thinned, and also a method for... | 05/01/2007 |
| 7204290 | Apparatus for removing cover of golf ball from core A cover peeling machine includes a pair of rolls. The roll has an almost conical shape. Both of the rolls are rotated in a reverse direction. The direction of the rotation is an inward direction as seen from above. A golf ball is put close to a tip of the roll. In t... | 04/17/2007 |
| 7201852 | Method for removing defects from silicon bodies by a selective etching process A method for eliminating eruptions, impurities, and/or damage in a crystal lattice by selectively etching silicon elements of surface-plated and sawn-out parts of a silicon wafer. At least areas of the silicon elements are brought into contact with a gaseous etching... | 04/10/2007 |
| 7201808 | Method and apparatus for rotating a semiconductor substrate An apparatus that includes a rotatable single wafer holding bracket with one or more wafer supports disposed on the single wafer holding bracket, wherein the one or more wafer supports position a center of a wafer to be off-center from an axis of rotation of the sin... | 04/10/2007 |
| 7196872 | Sliders bonded by a debondable encapsulant comprising different polymers formed via in situ polymerization A slider assembly is provided comprising a plurality of sliders bonded by a debondable solid encapsulant comprised of different first and second polymers The solid encapsulant is comprised of a polymer prepared by polymerizing an encapsulant fluid comprising a homog... | 03/27/2007 |
| 7192843 | Method of fabricating semiconductor device The present invention is a method of fabricating a semiconductor device by transferring a semiconductor chip supported on a flexible support film to a mount member by means of a robot arm. This method comprises a film bending step of bending a support film so that s... | 03/20/2007 |
| 7189304 | Substrate layer cutting device and method An automatic high-precision layer cutting device for separating a layer from a semiconductor substrate. The cutting device includes a fixed positioning member for receiving at least a portion of a semiconductor substrate that has a weakened area therein and a periph... | 03/13/2007 |
| 7189631 | Semiconductor device and manufacturing method thereof It is an object of the present invention to provide a peeling method that causes no damage to a layer to be peeled and to allow not only a layer to be peeled with a small surface area but also a layer to be peeled with a large surface area to be peeled entirely. Fur... | 03/13/2007 |
| 7189938 | Process and system to package residual quantities of wafer level packages Various preferred processes and equipment are described herein that more efficiently handle residual semiconductor parts during packaging. The processes include picking and removing all of the bad parts from a wafer before picking the good parts and picking all of t... | 03/13/2007 |
| 7188405 | Pin removal structure used in printed circuit board drilling machine A pin removal structure used in printed circuit board drilling machine comprised of a main body, a first driving member, a first driving rod, a collet member, a lower mounting cover, a socket, a second driving member, a plurality of second driving rods, and an air p... | 03/13/2007 |
