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| Number | Title | Issue Date |
| 7981246 | Method and device for detaching a component which is attached to a flexible film The invention relates to a film (2) which comprises a component (1) to be detached therefrom. Said film is placed in the area of the component on a detaching tool (5) that is provided with at least one supporting element (6) for the film,... | 07/19/2011 |
| 7947150 | Multi-ply rolled paper separating device and method of use A device for use in connection with a multi-ply rolled paper holder to separate multi-ply rolled paper into distinct individual plies. The device includes at least one arm and at least one member. Each arm has an upper end portion that is configured to releasably co... | 05/24/2011 |
| 7938930 | Support board separating apparatus, and support board separating method using the same An aligned workpiece is mounted on and held by a holding table, and a support board separating mechanism separates a support board from a semiconductor wafer. Herein, a double-faced adhesive tape is left on one of the support board and the semiconductor wafer. Eithe... | 05/10/2011 |
| 7909959 | Method for releasing adhered article It is an object of the invention to provide a separation method of an adherend capable of easily and reliably separating an adherend stuck using an adhesive, a method for recovering an electronic part from an electronic part laminate, and a separation method of lami... | 03/22/2011 |
| 7828926 | Selective removal of resin coatings and related methods The present invention provides assemblies and methods for selectively removing resin coatings from a radiation detector. A method includes positioning a cutting edge on a resin coating formed on a radiation detector. The method further includes positioning a bonding... | 11/09/2010 |
| 7820006 | Die pickup apparatus for picking up semiconductor dies and methods for picking up semiconductor dies A die pickup apparatus facilitates picking up a semiconductor die in a manner such that, in a state in which a semiconductor die to be picked up is suctioned by a collet, a frontal end of a cover plate is caused to extend from a contact surface, and the cover plate ... | 10/26/2010 |
| 7771560 | Methods to prevent ECC (edge chipping and cracking) damage during die picking process A method for preventing edge chipping and cracking damage encountered by semiconductor chips in a die picking operation during separation from an adhesive sheet. Also provided is a device for preventing potential edge chipping and cracking damage encountered by a se... | 08/10/2010 |
| 7763146 | Disassembly method and reuse method of substrate mounting member An electrostatic chuck and a base member are separated from each other while heating up a substrate mounting member to a thermal decomposition temperature within a range from a thermal decomposition starting temperature to a thermal decomposition ending temperature ... | 07/27/2010 |
| 7763144 | Device and method for the detachment of a tube blank from a support core The invention relates to a method and a device for the removal of a tube blank (3) located on a support core (2). The tube blank (3) is detached from the support core (2) by means of the introduction of a medium through a device (10 | 07/27/2010 |
| 7763145 | System for removal of an integrated circuit from a mount material A system for removal of an integrated circuit from a mount material including holding and stretching the mount material using linear and rotary motion, and removing the integrated circuit from the mount material when the mount material is stretched by linear and rot... | 07/27/2010 |
| 7740735 | Tools and methods for disuniting semiconductor wafers A tool and method for disuniting two wafers, wherein at least one of the wafers is used in fabricating substrates for microelectronics, optoelectronics, or optics. The method includes the steps of temporarily affixing two gripper members to respective opposite faces... | 06/22/2010 |
| 7736460 | Method and system for film removal and sorting of coated resin products Disclosed is a film-removal/sorting method for coated resin products, which comprises a film removal step (S5) of feeding a target material comprising a mixture of plural types of coated resin products each having a different softening temperature in at least... | 06/15/2010 |
| 7713376 | Method and device for exposing electronic components A method of exposing components, which are carried by a carrier tape (2), arranged in sequence along the carrier tape (2) and covered by a cover (3). The cover is attached to the carrier tape having a lower surface facing the sequence of compone... | 05/11/2010 |
| 7686916 | Sheet peeling apparatus and peeling method There is provided a sheet peeling apparatus and a peeling method using a plurality of peeling units. A sheet peeling apparatus for peeling off a sheet stuck on the surface of a semiconductor wafer by using an adhesive tape of a width narrower than that of the sheet,... | 03/30/2010 |
| 7674349 | Method for continuous production of a functional film There is provided a method for continuous production of a functional membrane whereby a functional membrane in which a functional polymer is filled into the micropores of a porous resin sheet can be obtained both continuously and efficiently. The method for c... | 03/09/2010 |
| 7670452 | Separation apparatus and method An apparatus and method are provided for separating two objects attached to each other in a sandwich structure, such as a stamp and a substrate pressed together in an imprint process. The apparatus includes a support structure, carrying first fastening means having ... | 03/02/2010 |
| 7655109 | Floor covering lifting and removal hand tool A floor covering lifting and removal hand tool for lifting an edge and removing a floor covering that is secured to a floor surface. An arcuate lifting base is formed with a grip end spaced from an opposite end and optionally including load distribution flanges acro... | 02/02/2010 |
| 7641760 | Method of thermal adherend release and apparatus for thermal adherend release A method of thermal adherend release, wherein a part of adherends adherent to a heat-peelable pressure-sensitive adhesive sheet having a heat-expandable layer containing a foaming agent are selectively released from the pressure-sensitive adhesive sheet by partly he... | 01/05/2010 |
| 7638015 | Paint masking for corners employing “L-shaped” masking employing only single hand application A paint mask particularly adapted for masking corner areas of a demarcation zone to facilitate painting of an area of a workpiece disposed on the other side of the demarcation zone is formed of a thin, flexible sheet having opposite faces. The paint mask includes a ... | 12/29/2009 |
| 7632374 | Method and apparatus for picking up semiconductor chip and suction and exfoliation tool used therefor In an adhesive sheet exfoliation process in a pick-up operation for a thin-type chip 6 adhered to the adhesive sheet 5, a suction exfoliation tool 22 provided at its adhesion surface 22a with plural suction grooves 22b | 12/15/2009 |
| 7591921 | Heat-decaying materials, transfer sheet using the same, and patterning method Provided is a heat-decaying material that hardly deteriorates and decomposed at ordinary service temperatures, but decays within a short period of time when heated at relatively low temperatures. This comprises a polyoxyalkylene resin as the principal ingredient the... | 09/22/2009 |
| 7520954 | Method and apparatus for separating disc-shaped substrates A method for separating bonded substrates and a respective apparatus used for that method is disclosed. The method comprises positioning the bonded substrates (1) in an evacuable chamber (2) by respective means, detaching a space (10) from that ... | 04/21/2009 |
| 7507312 | Using laser shock loads to debond structures A method of disassembling at least a portion of a structure that includes parts which are bonded together. The method includes selecting a subsurface depth within the structure at which it is desired to cause debonding of the structure. A laser beam diameter, pulse ... | 03/24/2009 |
| 7501040 | Pneumatic tire and method of scrapping the same A pneumatic tire which facilitates separation of a rubber layer and is excellent in recyclability and retreadability and a method of scrapping the same. A pneumatic tire comprises a partition layer buried adjacent to a rubber layer, the partition layer including at ... | 03/10/2009 |
| 7468116 | Conduit and method of forming A thin ribbon spirally wound polymer conduit and method of forming, wherein a helical reinforcing bead is interposed adjacent overlapping layers of ribbon. Further, a method of continuously forming spirally wound conduit wherein a sacrificial layer, preferably havin... | 12/23/2008 |
| 7445688 | Method and apparatus for picking up work piece and mounting machine A work piece pickup method is for sucking and holding a work piece attached on an adhesive sheet by means of a suction collet that is disposed above the work piece attached on the adhesive sheet in such a way as to be movable up and down for sucking and holding the ... | 11/04/2008 |
| 7431819 | Method and apparatus for releasing metal-resin joint A method for separating a metal-resin joint including the steps of: (1) immersing an article including a metal-resin joint with a counter electrode in an alkaline solution; and (2) applying a voltage over a certain time period between the metal portion of the joint ... | 10/07/2008 |
| 7430795 | Method of making a slider A method of making a slider includes the steps of laminating the bottom-facing surface of a third layer to the upper-facing surface of a fourth layer, laminating the bottom-facing surface of a second layer to the upper-facing surface of the third layer in a heat-com... | 10/07/2008 |
| 7416008 | Automatic waste-area removal apparatus An apparatus and laminate allow removal of at least one sub-area of a face layer sheet from a laminate composed of a backing layer with the face layer sheet adhering thereto to leave at least one product area of the face layer sheet in place on the backing layer. Th... | 08/26/2008 |
| 7416012 | Apparatus for detaching supporting fabric from elastomeric material An apparatus for detaching a supporting fabric from a substantially-elongated piece of elastomeric material includes at least one plane for supporting the piece, first rollers located close to an exit edge of the plane, at least one second roller, and at least one a... | 08/26/2008 |
| 7416628 | Label applicator system with a peel inhibiting apparatus for RFID labels An apparatus and method for inhibiting the peeling of labels from a web is disclosed. A web with a plurality of labels is pulled towards a peeling edge. An antenna examines at least one of the labels. Based at least in part on the antenna's examination of at least o... | 08/26/2008 |
| 7413626 | Adhesive film removal method and apparatus The present invention provides adhesive film removal methods and apparatus. The removal methods and apparatus involve apply tension over the width of the adhesive film, thereby removing the film from the substrate along the release line that extends over the width o... | 08/19/2008 |
| 7412999 | Label remover The present invention relates to a hand held label removal apparatus, which provides a safe and easy removal of otherwise hard to remove labels that are affixed to various types of containers such as carton packaging, plastic products and similar materials. The dist... | 08/19/2008 |
| 7407704 | Process for adhesive separation of bonded joints The reversible separation of bonded joints by applying alternating electromagnetic fields is described. The bonded joint consists of at least one primer layer which contains nanoscale particles which have ferromagnetic, ferrimagnetic, superparamagnetic or piezoelect... | 08/05/2008 |
| 7406994 | Substrate layer cutting device and method An automatic high-precision layer cutting device for separating a layer from a semiconductor substrate. The device includes a fixed positioning member for receiving at least a portion of a semiconductor substrate that has a weakened area therein and a peripheral ann... | 08/05/2008 |
| 7406759 | Releasing method and releasing apparatus of work having adhesive tape In a method for releasing a work having an adhesive tape from a holding member which sucks and holds the work having the adhesive tape, the work having the adhesive tape is released from the holding member while supplying a gas which reduces a holding force of the h... | 08/05/2008 |
| 7404870 | Methods for forming an assembly for transfer of a useful layer Methods for transferring of a useful layer from a support are described. In an embodiment, the method includes for facilitating transfer of a useful layer from a support by providing an interface in a first support to define a useful layer; and forming a peripheral ... | 07/29/2008 |
| 7383869 | Film peeling method and film peeling device A film peeling device for peeling a film which has been stuck onto a film sticking face of a wafer including: a wafer sucking means for sucking the wafer so that the film sticking face of the wafer can become an upper face; a peeling tape feeding means for feeding a... | 06/10/2008 |
| 7384498 | Carpet removal system and method A carpet removal or stripping method and system (machine) employs a common dolly. The backside of the dolly member has a plurality of teeth. A motorized winching system is coupled to the front side of the dolly member. A dual purpose safety shield covers the teeth d... | 06/10/2008 |
| 7380581 | Tape feeder and tape feeding and recovering modules therefor Provided are tape feeding and recovering modules for a tape feeder, and a tape feeder including the tape feeding module and the recovering module. The tape feeding module feeds a tape storing a plurality of electronic components in a predetermined pitch by driving a... | 06/03/2008 |
