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Actor Marlon Brando has four patents, all named "Drumhead tensioning device and method."
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| Number | Title | Issue Date |
| 8118970 | Soft magnetic metal strip laminate and process for production thereof A soft magnetic metal strip laminate that has high adhesion strength between metal strips, free from delamination, an excellent magnetic property, a high space factor, and a process for production thereof. A process for production of a soft magnetic metal strip lami... | 02/21/2012 |
| 7397045 | Exposure apparatus and method thereof An exposure apparatus includes a loading device, a first energy-producing device, and a second energy-producing device. The loading device comprises a plurality of supporting elements, supporting a panel. The first and second energy producing devices are disposed ab... | 07/08/2008 |
| 7271227 | Adhesive compositions free of metallic catalyst The present invention generally relates to curable compositions free of metallic catalysts. The inventive compositions are capable of curing when applied to a metal substrate. The inventive compositions provide improved thermal performance and enhanced cure strength... | 09/18/2007 |
| 7267886 | Polymerisation initiators, polymerisable compositions, and uses thereof for bonding low surface energy substrates Quaternary boron salts are used as initiators of polymerisation in adhesive compositions for bonding low surface energy substrates such as polyolefins. The quaternary boron salts are of the formula I ... | 09/11/2007 |
| 7268183 | Reactive polyurethane hotmelts with large PSA range Reactive polyurethane hotmelts comprising crystallizing polyesterpolyols based on fumaric acid and 1,6-hexanediol. These hotmelts exhibit good pressure-sensitive adhesive (PSA) properties over a very broad temperature range. The reactive polyurethane hotmelts are pr... | 09/11/2007 |
| 7250091 | Method of forming a seating system The present invention discloses a seating system that includes a seat back (20) with one or more plastic panels (22) that extend across a lateral distance of the seat back (20). The seat back (20) preferably includes one or more reinforce... | 07/31/2007 |
| 7247388 | Vulcanizable adhesive composition A vulcanizable adhesive composition, which comprises 100 parts by weight of phenolxylylene resin or phenolbiphenyl resin, 10 to 1,000 parts by weight of resol-type phenol resin, 0 to 1,000 parts by weight of novolak-type phenol resin, 10 to 1,000 parts by weight of ... | 07/24/2007 |
| 7189457 | Use of PET film primed with polyallylamine coatings in laminated glass glazing constructions The present invention is a laminate comprising at least one layer of an polyallylamine-based coating that is and in direct contact with at least one other polymeric layer. ... | 03/13/2007 |
| 7166651 | Two-part self-adhering dental compositions A shelf-stable two-part self-adhering dental composition and method. The composition comprises (a) at least one acidic compound containing at least one acidic moiety selected from the group consisting of | 01/23/2007 |
| 7071576 | Semiconductor device and method of manufacturing the same A semiconductor device includes a semiconductor substrate, a first wiring arranged on the semiconductor substrate, a first electrode pad electrically connected to the first wiring, and a porous organic resin film covering the front surface of the semiconductor subst... | 07/04/2006 |
| 7060759 | Urethane polymer compositions A moisture-reactive hot-melt adhesive composition is provided. Particularly, a composition that includes a polyol, an anhydride-functional polymer, and a polyisocyanate. Also provided are a method for forming the adhesive composition and a method for bonding substra... | 06/13/2006 |
| 7060327 | Corrosion protective methacrylate adhesives for galvanized steel and other metals Compositions for bonding galvanized surfaces are disclosed. The compositions include either (i) a first part that includes at least one (meth)acrylate component in combination with a free radical inhibitor component and a phosphate ester component and a second part ... | 06/13/2006 |
| 7025853 | Reactive hot-melt adhesive compositions with improved green strength A moisture-reactive hot-melt composition, useful as an adhesive, is provided that has improved balance of open time and green strength. In particular, the composition is made from a polyol, a polyisocyante, and an acrylic polymer. Also provided are a method for maki... | 04/11/2006 |
| 7022804 | Moisture-crosslinkable hot-melt adhesive based on polyurethane prepolymer The invention relates to a moisture-crosslinkable hot-melt adhesive which is composed of a polyurethane prepolymer obtained by polyaddition of at least one polyol to at least one isocyanate chosen from the group of diisocyanates trimerized as isocyanurates and react... | 04/04/2006 |
| 6998011 | Epoxy adhesive having improved impact resistance In the preparation of an improved adhesive composition, an epoxy-based prepolymer is obtained by the reaction of one or more epoxy resins with amino-terminated polyethers and/or carboxyl-terminated butadiene-nitrile rubbers. In one embodiment of the invention, both ... | 02/14/2006 |
| 6986948 | Polyester-based dimethacrylates designed for laminating applications A laminate formed from a first fiber-reinforced ply joined by a laminating resin composition to a second fiber-reinforced ply. The laminating resin composition is the cured residue of a polyester resin being end-terminated with an alkyl acrylate group and diluted wi... | 01/17/2006 |
| 6962754 | Structure comprising a fluoropolymer layer and a piperazine-based tie resin A structure made of a fluoropolymer layer and directly attached to one of its sides a tie layer based on a polyamide which results from the condensation of at least one diacid and at least one diamine of the following formula (1): | 11/08/2005 |
| 6958368 | Cure accelerators for anaerobic curable compositions The present invention relates to new cure accelerators for anaerobic curable compositions. These anaerobic cure accelerators are generally sulfinimides and oxygen and sulfur derivatives thereof, sulfonimides and oxygen and sulfur derivatives thereof, sulfonamides an... | 10/25/2005 |
| 6956098 | High modulus polyimide compositions useful as dielectric substrates for electronics applications, and methods relating thereto The substrates of the present invention comprise a polyimide base polymer derived at least in part from collinear monomers together with crankshaft monomers. The resulting polyimide material has been found to provide advantageous properties, particularly for electro... | 10/18/2005 |
| 6916686 | Method of manufacturing a semiconductor device A contact collect is provided to prevent damage to the top surface of a semiconductor chip at the time of die bonding the semiconductor chip. A protection tape is pasted to the top surface of the semiconductor chip before die bonding of the semiconductor chip is exe... | 07/12/2005 |
| 6908528 | Laminate composite fabric A laminated composite fabric material used for example in the manufacture of automobile air bags has at least one thermoplastic coating layer that is pressure laminated to a pre-treated fabric using an adhesive. The fabric, pre-treated with a curing agent such as an... | 06/21/2005 |
| 6883413 | Visible and UV/visible light anaerobic curable primer mix coating This invention relates to a visible light or UV/visible light and anaerobically curable composition for encapsulating the surface of the primer mix disposed in the primer cup, particularly for use in center fire ammunition. ... | 04/26/2005 |
| 6884315 | Method for bonding DVD layers A method for bonding DVD layers which comprises EB bonding at least two layers of a DVD with an EB curable adhesive composition which consists essentially of at least one epoxy resin and at least one aryl iodonium salt (cationic) photoinitiator and DVDs produced by ... | 04/26/2005 |
| 6844080 | Metal alkyl borphydride polymerisation initiators, polymerisable compositions, and uses thereof Metal alkyl borohydrides are used as initiators of polymerisation, particularly in adhesive compositions for bonding a wide range of substrates including low surface energy substrates such as polyolefins. As described, the metal alkyl borohydrides are of the formula... | 01/18/2005 |
| 6835762 | Cure accelerators for anaerobic curable compositions The present invention provides a new class of materials effective as cure accelerators for anaerobic curable compositions. The addition of these materials into anaerobic adhesives as a replacement for conventional curatives, such as acetyl phenyl hydrazine and malei... | 12/28/2004 |
| 6833043 | Elastomer compositions for bonding to fluoropolymers A method for increasing the adhesion of a first layer comprising a fluoropolymer substantially free of interpolymerized units derived from vinylidene fluoride to a second layer comprising a curable elastomer is described. The method comprises adding a dehydrofluorin... | 12/21/2004 |
| 6833017 | Filter assembly and method with polyimide A filter assembly and method includes a filter media attached to a perimeter frame using a polyimide material. ... | 12/21/2004 |
| 6797107 | Solid cyanoacrylate adhesive composition and method for its use A solid cyanoacrylate adhesive composition is disclosed which can be applied to a substrate in solid form and which polymerizes into an adhesive polymer upon liquefying. Preferably the solid cyanoacrylate composition liquefies at temperatures slightly above room tem... | 09/28/2004 |
| 6787244 | Adhesively bonded chip-and wafer stacks The present invention describes the use of poly-o-hydroxy amides (PHAs) for adhesively bonding articles or materials, especially components used in the semiconductor industry, such as chips and wafers, a process for adhesively bonding materials, especially chips and... | 09/07/2004 |
| 6667108 | Wearprotected wood veneer A resin impregnated overlay is applied to a wood veneer, which in turn may be adhered to a substrate.... | 12/23/2003 |
| 6613438 | Single component adhesive with an adaptable open joint time The invention relates to a one-component epoxy resin adhesive which is elasticated with silicone rubber and whose open joint time is adaptable to whichever production process it is being used in by the concentration of UV initiator and/or the duration and... | 09/02/2003 |
| 6586496 | Photocurable resin composition for sealing material and method of sealing A photo-curable resin composition for sealing material, which is superior in the photo-curing performance and in the prompt curing property and is better in the adhesive property, in the resistance to moisture permeation and in the heat resistance, the ph... | 07/01/2003 |
| 6582791 | Pressure sensitive adhesives for use on low energy surfaces A vinyl graphic marking film or label coated with a pressure sensitive acrylic adhesive designed to achieve high or permanent adhesion to polymeric low energy surfaces is disclosed. In addition to good adhesion to low energy surfaces, the graphic marking ... | 06/24/2003 |
| 6538095 | Solvent-free two-component curable adhesive composition The solvent-free two-component adhesive composition of the present invention comprises a polyol component (A) and a polyisocyanate component (B), and the viscosity of the mixture at 80° C. immediately after the point of time the components (A) and (B) ar... | 03/25/2003 |
| 6498210 | Silylated polyurethanes for adhesives and sealants with improved mechanical properties The silylated polyurethane polymer includes a polyurethane prepolymer having between greater than about 50 to about 95% of NCO groups terminated with silane capping agents. The polymer has an improved mechanical properties. The polymer can also have betwe... | 12/24/2002 |
| 6492028 | Adhesive for glass The present invention provides the following adhesive which is good in durability in bonding a glass plate and a resin composition containing a butyl type rubber. The present invention provides the following adhesive which is particularly suitable as an a... | 12/10/2002 |
| 6478920 | Chip-type circuit component and method of manufacturing the same A chip-type circuit component comprising a chip body which is formed by bonding first and second substrates with each other. A polyimide adhesion layer is provided between the first and second substrates and a thin film circuit pattern is formed on at lea... | 11/12/2002 |
| 6460464 | Adhesive for ring seal in center fire ammunition The present invention provides UV/anaerobic dual cure adhesives, particularly well-suited for sealing the ring around the primer cup in center fire ammunition by UV cure and the primer cup in the cartridge by anaerobic cure.... | 10/08/2002 |
| 6451406 | Solventless node adhesive for honeycomb A solventless node adhesive for use in bonding honeycomb layers together. The node adhesive includes thermoset resin and thermoplastic particles dispersed in the adhesive. The node adhesive is applied to the honeycomb node lines while the thermoplastic pa... | 09/17/2002 |
| 6447915 | Interlaminar insulating adhesive for multilayer printed circuit board In order to provide a multilayer printed circuit board having a fine pitch circuit, the interlaminar insulating adhesive used therein must have heat resistance and low thermal expansion coefficient so that required accuracy can be obtained during circuit ... | 09/10/2002 |
