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| Number | Title | Issue Date |
| 8157950 | Aldimine and composition containing aldimine Aldimines of Formula (I), which can be used as latent curing agents in curing compositions, for example, in moisture-curing polyurethane compositions that have isocyanate groups. The aldimines are compounds that can be liquid at room temperature, can have a hardly n... | 04/17/2012 |
| 7588659 | Bonding aid for polyamide resin and method of bonding with the same It is a joining auxiliary agent for a polyamide resin with which a predetermined joining face of a polyamide resin molded article is coated to ensure the joining strength between the predetermined joining face and another polyamide resin when they are joined togethe... | 09/15/2009 |
| 7342053 | Resin composition, adhesive film using the same and multilayer printed circuit board Producing a printed circuit board, by coating a resin composition comprising an aromatic cyanate compound having two or more cyanato groups in a molecule and a radical-polymerizable resin on a circuit substrate, photo-curing the resin composition, and thermally curi... | 03/11/2008 |
| 7268183 | Reactive polyurethane hotmelts with large PSA range Reactive polyurethane hotmelts comprising crystallizing polyesterpolyols based on fumaric acid and 1,6-hexanediol. These hotmelts exhibit good pressure-sensitive adhesive (PSA) properties over a very broad temperature range. The reactive polyurethane hotmelts are pr... | 09/11/2007 |
| 7259207 | Single-component polyurethane adhesive A pasty single component polyurethane adhesive is provided. The NCO terminated polyurethane prepolymer is substantially linear, contains from 2.0% to 8.0% based on the weight of the prepolymer, of highly disperse silica and up to 10% by weight, based on the weight o... | 08/21/2007 |
| 7255897 | Use of aqueous polyurethane dispersions is formulations for sports floor coverings The invention relates to the use of aqueous, isocyanate-free, polyurethane dispersions with a solid content of ≧30 wt. % and a solvent content of ≦10 wt. % in sports floor coverings. The inventive polyurethane dispersions are particularly suitable for use as bon... | 08/14/2007 |
| 7252735 | Formaldehyde-free lignocellulosic adhesives and composites made from the adhesives Method for making lignocellulosic composites by adhering lignocellulosic substrates together. A first variant of the method involves using an adhesive composition that comprises a reaction product of (i) first ingredient selected from a soy protein or lignin and (ii... | 08/07/2007 |
| 7189793 | Iodine/iodide-containing hot melt coatable adhesive, methods and uses therefor An iodine/iodide-containing hot melt coatable adhesive is provided. This adhesive is prepared by mixing iodine and an iodide salt, individually or in combination, with solubilizing liquids. The iodine and iodide salt are combined with a pre-adhesive composition in a... | 03/13/2007 |
| 7186311 | Process for producing substrate for flexible circuit board The invention provides a process for producing a substrate for flexible circuit boards which comprises: providing a multilayered insulating resin layer comprising an insulating layer and an adhesive layer; and laminating a metal foil to the insulating layer of the m... | 03/06/2007 |
| 7175887 | Method of coating a fluorocarbon resin A first member is configured to undergo sliding contact with a surface of a second member. The surface of the first member is roughened by irradiating the surface of the first member with a laser to form first recesses in the surface of the first member. The surface... | 02/13/2007 |
| 7112631 | Moisture cured reactive hot melt adhesive with monofunctional reactants as grafting agents High green strength reactive hot melt adhesives are prepared using crystalline monofunctional reactants. ... | 09/26/2006 |
| 7101456 | Ion triggerable, cationic polymers, a method of making same and items using same The present invention is directed to ion triggerable, water-dispersible cationic polymers. The present invention is also directed to a method of making ion triggerable, water-dispersible cationic polymers and their applicability as binder compositions. The present i... | 09/05/2006 |
| 7087696 | Uv-curable epoxy acrylates Epoxy acrylates of the formulae (A), (B) and epoxy acrylate mixtures comprising at least one of the compounds (A) or (B) are novel and find use in coating materials or adhesives featuring high UV stability ... | 08/08/2006 |
| 7037594 | Electromagnetic wave shielding member and process for producing the same There is provided an electromagnetic wave shielding member which has see-through properties and electromagnetic wave shielding properties, is free from a change in color of an adhesive at the time of the formation of a mesh by etching, is improved in etchability, an... | 05/02/2006 |
| 7005031 | Pressure sensitive adhesives having quaternary ammonium functionality, articles, and methods A pressure sensitive adhesive composition is provided that includes a pressure sensitive adhesive polymer. The polymer includes: at least one copolymerized monoethylenically unsaturated (meth)acrylic acid ester monomer, wherein the (meth)acrylic acid ester monomer, ... | 02/28/2006 |
| 7004375 | Pre-applied fluxing underfill composition having pressure sensitive adhesive properties The present invention relates to a pressure sensitive fluxing underfill composition that may be pre-applied to electronic components, such as CSP's, in order to increase the reliability of the component against mechanical stresses such as impact and bending. The com... | 02/28/2006 |
| 6962754 | Structure comprising a fluoropolymer layer and a piperazine-based tie resin A structure made of a fluoropolymer layer and directly attached to one of its sides a tie layer based on a polyamide which results from the condensation of at least one diacid and at least one diamine of the following formula (1): | 11/08/2005 |
| 6956098 | High modulus polyimide compositions useful as dielectric substrates for electronics applications, and methods relating thereto The substrates of the present invention comprise a polyimide base polymer derived at least in part from collinear monomers together with crankshaft monomers. The resulting polyimide material has been found to provide advantageous properties, particularly for electro... | 10/18/2005 |
| 6939432 | Aqueous vacuum forming laminating adhesive composition, substrates and methods related thereto The present invention provides an aqueous adhesive composition including a resinous phase dispersed in an aqueous medium, the resinous phase containing (a) a polychloroprene, (b) optionally, a halogenated polyolefin different from (a), and (c) optionally, an aminopl... | 09/06/2005 |
| 6939936 | Iodine/iodide-containing hot melt coatable adhesive, methods and uses therefor An iodine/iodide-containing hot melt coatable adhesive is provided. This adhesive is prepared by mixing iodine and an iodide salt, individually or in combination, with solubilizing liquids. The iodine and iodide salt are combined with a pre-adhesive composition in a... | 09/06/2005 |
| 6924336 | Polymer dispersion comprising particles of polyurethane and a copolymer or terpolymer produced by emulsion polymerization of olefinically unsaturated monomers A polymer dispersion comprising an aqueous, continuous phase and dispersed particles of polyurethane, which is based on organic, non-aromatic isocyanates with a functionality of at least 2, said polyurethane having a high degree of crystallinity and whose crystallin... | 08/02/2005 |
| 6872278 | One part woodworking adhesive composition An adhesive composition that includes a) an emulsion that includes a multi-stage polymer that includes a first stage polymer having a Tg from −20° C. to 90° C. and including from about 0.5% by weight to about 3% by weight latent crosslinking monomer based on the... | 03/29/2005 |
| 6858295 | Pressure sensitive adhesive comprising vinylpyrrolidone A pressure sensitive adhesive comprising a mixture of: a radiation-crosslinkable polymer A) composed of at least 40% by weight of C1 to C18 alkyl (meth)acrylates, and a polymer B) composed of at least 20% by w... | 02/22/2005 |
| 6838143 | Peelable protective film Adhesive-coated, peelable protective films and peelable labels, wherein the adhesive contains a copolymer that is capable of undergoing free-radical polymerization and which comprises, to an extent of from 0.1 to 10 wt %, based on the copolymer, a compound A compoun... | 01/04/2005 |
| 6833043 | Elastomer compositions for bonding to fluoropolymers A method for increasing the adhesion of a first layer comprising a fluoropolymer substantially free of interpolymerized units derived from vinylidene fluoride to a second layer comprising a curable elastomer is described. The method comprises adding a dehydrofluorin... | 12/21/2004 |
| 6833017 | Filter assembly and method with polyimide A filter assembly and method includes a filter media attached to a perimeter frame using a polyimide material. ... | 12/21/2004 |
| 6828382 | Polyacrylate joint sealants This invention relates to a jointing compound of an acrylate/acrylonitrile copolymer containing 2 to 8 carbon atoms in the alcohol component as binder and fatty compounds as plasticizer and also fillers and auxiliaries. Epoxystearic acid methyl ester in particular m... | 12/07/2004 |
| 6824642 | Phenyl-linked oxazole cyanates as dielectrics having good adhesive and filling properties The following invention relates to phenyl-linked polybenzoxazoles having terminal, aryl- or heteroaryl-attached cyanate groups which can be used for adhesive bonding and as dielectrics, especially for electronic components, and to a process for preparing them. ... | 11/30/2004 |
| 6787244 | Adhesively bonded chip-and wafer stacks The present invention describes the use of poly-o-hydroxy amides (PHAs) for adhesively bonding articles or materials, especially components used in the semiconductor industry, such as chips and wafers, a process for adhesively bonding materials, especially chips and... | 09/07/2004 |
| 6749940 | Moistureproof multilayered film A moistureproof multilayer film, including a composite film having a non-moisture absorbing resin layer and a vapor deposited film of an inorganic oxide or a metal formed on at least one side of the non-moisture absorbing resin layer, the multilayer film having such... | 06/15/2004 |
| 6700185 | Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method for manufacturing semiconductor device An adhesive film for semiconductor, which comprises at least one resin layer, and, after bonded to a lead frame, has at 25° C. a 90°-peel strength of at least 5 N/m between the resin layer and the lead frame, and, after a lead frame is bonded to the adh... | 03/02/2004 |
| 6679963 | Process for the preparation of acrylic end-products for external use A process is described for the preparation of end-products made of acrylic fiber, for external use, by the joining of one or more sheets with a copolyamide adhesive, resistant to solar light, the above junction been effected by the melting of said adhesiv... | 01/20/2004 |
| 6670442 | Hot melt adhesives based on polyamides Hot melt adhesives are prepared using thermoplastic polyamides derived from polymerized fatty acid components. The adhesives are particularly useful for bonding nonpolar substrates such as poly--olefins.... | 12/30/2003 |
| 6558500 | Method of producing a lead frame with composite film attached, and use of the lead frame Disclosed is a composite film, a method of producing a lead frame with the composite film attached, and a method of bonding a semiconductor chip to this lead frame having the composite film attached. The composite film includes a base film and an adhesive... | 05/06/2003 |
| 6534179 | Halogen free triazines, bismaleimide/epoxy polymers, prepregs made therefrom for circuit boards and resin coated articles, and use A halogen-free dielectric resin mixture is described for use in microvia and other similar applications. The resin mixture contains a cyanate ester monomer or prepolymer a bismaleimide, an epoxy and a flame inhibiting compound selected from the group cons... | 03/18/2003 |
| 6517949 | Polyacetal composite and process for producing the same A polyacetal composite according to the invention includes a polymer unit (A) composed of a polyacetal resin, and a polymer unit (B) composed of a thermoplastic resin or elastomer having an acidic group, and the polymer unit (A) and the polymer unit (B) d... | 02/11/2003 |
| 6451406 | Solventless node adhesive for honeycomb A solventless node adhesive for use in bonding honeycomb layers together. The node adhesive includes thermoset resin and thermoplastic particles dispersed in the adhesive. The node adhesive is applied to the honeycomb node lines while the thermoplastic pa... | 09/17/2002 |
| 6441092 | Wet-stick adhesives A wet-skin adhesive includes a pressure-sensitive adhesive component that includes at least one monoethylenically unsaturated (meth)acrylic acid ester comprising an alkyl group having at least 4 carbons on average and at least one monoethylenically unsatu... | 08/27/2002 |
| 6436498 | Reactive silicone/alkyleneimine barrier laminating adhesives having bis-silane additives A method of laminating two substrates by coating at least one side of a substrate with a laminating adhesive, bringing a coated side of the substrate into contact with a second substrate to form a three layer film, and treating the three layer film with a... | 08/20/2002 |
| 6372080 | Process for fabricating a crack resistant resin encapsulated semiconductor chip package A heat-resistant adhesive is provided for use in an adhesive member for the fabrication of a semiconductor package by bonding a semiconductor chip to a lead frame with the adhesive member and sealing at least the semiconductor chip and a bonded part betwe... | 04/16/2002 |
