Quotables
"One of the greatest labor saving inventions of today is tomorrow!"
Vincent T. Floss
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8088246 | Process for improving the adhesion of polymeric materials to metal surfaces An adhesion promoting composition and a process for treating metal surfaces with the adhesion promoting composition is described. The adhesion promoting composition comprises an oxidizer, an acid, a corrosion inhibitor, a source of halide ions and a material selecte... | 01/03/2012 |
| 7404848 | Humidifier and a method for producing the same A humidifier and a method for producing it can reduce gas leakage through inside the surfaces of humidifying membranes or through interfaces between the humidifying membranes and separators. The humidifier includes water permeable humidifying membranes and gas separ... | 07/29/2008 |
| 7365988 | Cycling LED heat spreader A graphite heat spreader is provided for use with a flash LED light source for a camera of a handheld device such as a cell phone. Dramatically reduced operating temperatures are provided at substantially increased power levels thus providing both improved lighting ... | 04/29/2008 |
| 7360867 | Adhesive agent and inkjet head and manufacturing method thereof Disclosed is an adhesive agent which is curable and has flexibility at low temperature, and further has resistant to solvent type ink. The adhesive agent includes a base and an activator, wherein the base includes at least any one of: bisphenol F epoxy compound; bis... | 04/22/2008 |
| 7320770 | Method for making a quasi-incompressible phase-change material, shear-thinned and with low heat conductivity The process according to the invention includes the combination, with a liquid phase change material (PCM), of a texturing agent chosen so as to greatly reduce the thermal convection and whose viscosity is decreased reversibly under shearing. The material formed has... | 01/22/2008 |
| 7303005 | Heat spreaders with vias Constructions for and methods of manufacturing graphite heat spreaders having thermal vias placed therethrough are provided. Thermal vias having one or two flanges are disclosed, as are flush thermal vias. Graphite heat spreaders having surface layers covering the g... | 12/04/2007 |
| 7232478 | Adhesion promotion in printed circuit boards An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is... | 06/19/2007 |
| 7224075 | Methods and systems for attaching die in stacked-die packages A system and a method for producing a multiple-die device by attaching a die to a substrate using a first die-attach material having a first processing temperature and attaching a subsequent die using a second die-attach material having a second processing temperatu... | 05/29/2007 |
| 7220688 | Fibrous web and a method for manufacturing a shaped article by impregnating said web with a liquid resin and a hardener therefor The invention is concerned with a fibrous web for making a shaped article reinforced with fibrous webbing by impregnating the web with a liquid resin and a hardener therefor, wherein said web comprises indicating means, which indicate the impregnation of the web wit... | 05/22/2007 |
| 7214424 | Heat-peelable pressure-sensitive adhesive sheet A heat-peelable adhesive sheet which shows small increase in the degree of contamination caused by a heat treatment for lowering an adhesive force is disclosed. The heat-peelable pressure sensitive adhesive sheet comprises a heat-expandable layer containing heat-exp... | 05/08/2007 |
| 7208105 | Adhesive for circuit connection, circuit connection method using the same, and circuit connection structure There are provided an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes thereon opposed to each other and to electrically connect the circuit electrodes on the substrates opposed to each other to the pressurizing directi... | 04/24/2007 |
| 7166182 | Adhesive and sealing layers for electrophoretic displays The invention is directed to methods and compositions for improving the adhesion properties and switching performance of an electrophoretic display. The methods and compositions comprise the use of a high dielectric polymer or oligomer and optionally a crosslinking ... | 01/23/2007 |
| 7147898 | Highly absorbent products and process of making such products The invention provides processes for coating the surface of substrates such as a sheet, film, foam, fiber, etc., with a curable liquid resin or solution of curable resin, then in one embodiment, stably attaching a superabsorbent polymeric powder to such resin, and t... | 12/12/2006 |
| 7115221 | Method for producing graphite powder with an increased bulk density A method for increasing the Scott density of synthetic and/or natural graphite powders of any particle size distribution, preferably of highly-pure graphite, by subjecting the graphite powder to an autogenous surface treatment. The powder is used, in particular, for... | 10/03/2006 |
| 7090920 | Poly(arylene ether) adhesive compositions A laminate, comprises a thermoplastic substrate, a conductive metal foil at least partially disposed on at least one side of the substrate, and an adhesive disposed between the substrate and the metal foil. The adhesive includes a blend of a poly(arylene ether), a t... | 08/15/2006 |
| 7071548 | Semiconductor coated with a mixture containing an adhesion promoter An article comprises a semiconductor substrate and a coating mixture on the semiconductor substrate. The coating mixture Is comprised of adhesion promoter and photopolymer. The adhesion promoter contains α-amino propyltriethoxysilane in organic solution. ... | 07/04/2006 |
| 7037594 | Electromagnetic wave shielding member and process for producing the same There is provided an electromagnetic wave shielding member which has see-through properties and electromagnetic wave shielding properties, is free from a change in color of an adhesive at the time of the formation of a mesh by etching, is improved in etchability, an... | 05/02/2006 |
| 7018490 | Method of binding binder treated particles to fibers A binder is applied to particles which are then combined with fibers to bind the particles to the fibers. The particles have functional sites for forming a hydrogen bond or a coordinate covalent bond. The fibers have hydrogen bonding functional sites. The binder com... | 03/28/2006 |
| 7016196 | Radiating structural body of electronic part and radiating sheet used for the radiating structural body A heat dissipating structure for a heat generating electronic component is characterized by comprising a heat dissipating sheet including a metal sheet and a heat conductive member having adhesion stacked thereon between the heat generating electronic component and ... | 03/21/2006 |
| 7014883 | Apparatus and method for forming a composite structure A method for forming a composite structure is disclosed. The method includes four steps. Step one calls for applying a primer (104) to a surface (102) of a tool (100). Step two requires applying a coating (106) to primer (104). Ste... | 03/21/2006 |
| 7000745 | Method to improve adhesion between pre-cured elastomer and metal surface The bond strength between a pre-cured elastomeric member and a metal surface is increased by applying a phosphate coating to the metal surface. This is particularly suitable for use in formation of torsional vibration dampeners wherein an elastomeric member is compr... | 02/21/2006 |
| 6998359 | Article and process for maintaining orientation of a fiber reinforced matt layer in a sandwiched urethane construction A multiple layer fiber reinforced material and method of constructing the same including the provision of a first layer of a roll lofted glass material. Optional variants include the pre-application of plywood, OSB or fiber reinforced cement board materials prior to... | 02/14/2006 |
| 6962754 | Structure comprising a fluoropolymer layer and a piperazine-based tie resin A structure made of a fluoropolymer layer and directly attached to one of its sides a tie layer based on a polyamide which results from the condensation of at least one diacid and at least one diamine of the following formula (1): | 11/08/2005 |
| 6956098 | High modulus polyimide compositions useful as dielectric substrates for electronics applications, and methods relating thereto The substrates of the present invention comprise a polyimide base polymer derived at least in part from collinear monomers together with crankshaft monomers. The resulting polyimide material has been found to provide advantageous properties, particularly for electro... | 10/18/2005 |
| 6918987 | Surface preparation of rubber for coatings or bonding The disclosure is directed to a treatment composition comprising a halogen bearing compound, a volatile siloxane fluid and at least one solvent. In another aspect, there is disclosed a method for treatment of molded rubber articles by applying a treatment compositio... | 07/19/2005 |
| 6869642 | Phase change thermal interface composition having induced bonding property An improved, more durable heat conductive composition for transferring heat from a heat-dissipating component to a heat dissipater and method of producing the same. The composition preferably comprises a base consisting of paraffin and, optionally, paraffin and petr... | 03/22/2005 |
| 6869497 | Two-part structural adhesive systems and laminates incorporating the same A two-part adhesive systems exhibiting improved fixture and open times are disclosed. In one embodiment, the system includes (a) an adhesive part being a mixture formed from (I) an ethylenically unsaturated monomer, (II) a metal molybdate, (III) a metal salt of an e... | 03/22/2005 |
| 6852193 | Semi-solid one- or two-part compositions A composition including at least one anaerobically polymerizable compound; and at least one condensation product of an aldehyde and or ketone/with a polyol. The invention also provides a composition as described above which is in the form of a soft solid, for exampl... | 02/08/2005 |
| 6805764 | Method for adhesively bonding laminates and composite structures Disclosed are composite structures prepared using a hemicellulose-based adhesive. In a preferred embodiment, a laminate composed of plural laminae which have been bonded to one another using a hemicellulose-based adhesive is provided. The laminate is useful as a sep... | 10/19/2004 |
| 6787244 | Adhesively bonded chip-and wafer stacks The present invention describes the use of poly-o-hydroxy amides (PHAs) for adhesively bonding articles or materials, especially components used in the semiconductor industry, such as chips and wafers, a process for adhesively bonding materials, especially chips and... | 09/07/2004 |
| 6734268 | Metal salt modifiers for bonding compositions The invention provides bonding compositions and reactive two-part bonding compositions that are useful, for example, in bonding low surface energy substrates (e.g., polyethylene, polypropylene and polytetrafluoroethylene). Bonding compositions of the invention inclu... | 05/11/2004 |
| 6730385 | Perfluororubber laminate and processes for producing the same A laminate, which is in the form of an O-ring, a square ring, a rubber roll, a diaphragm, a rubber hose, a rubber tube or a vial stopper, comprising a layer of a perfluororubber, a layer of other rubber and an adhesive layer containing a polyfunctional compound whic... | 05/04/2004 |
| 6670442 | Hot melt adhesives based on polyamides Hot melt adhesives are prepared using thermoplastic polyamides derived from polymerized fatty acid components. The adhesives are particularly useful for bonding nonpolar substrates such as poly--olefins.... | 12/30/2003 |
| 6669953 | Block copolymer Cross-linked block copolymers are disclosed which have drug retention properties, comprising hard and soft segments, with cross-linking between the soft segments. The block copolymers can be based upon (meth)acrylic monomers, and some possess adhesive pro... | 12/30/2003 |
| 6666947 | Method for producing an inkjet printhead element; and an inkjet printhead element A method for producing an inkjet printhead element comprises providing a thinfilm die and a barrier layer thereon, wherein the barrier layer comprises a thermoplastic component and a thermoset component. The barrier layer is heated such that the barrier l... | 12/23/2003 |
| 6652705 | Graphitic allotrope interface composition and method of fabricating the same An improved, more durable heat conductive composition for transferring heat from a heat-dissipating component to a heat dissipater and method of producing the same. The composition preferably comprises a base consisting of paraffin having particles of gra... | 11/25/2003 |
| 6652970 | Degradable crosslinkers, compositions therefrom, and methods of their preparation and use The present invention is directed toward compositions that are chemically different after application to a substrate as compared to the composition prior to its application. A method of the invention comprises a method of transitioning a crosslinked polym... | 11/25/2003 |
| 6622428 | Method for containing organic debris A method of containing organic debris such as leaves in piles or layers is disclosed. The method comprises the utilization of a chemical composition for coating the generally upward facing leaves in order to bond them together into larger sections. Once t... | 09/23/2003 |
| 6613184 | Stable interfaces between electrically conductive adhesives and metals The electrical properties of the bond formed between a metal substrate and an electrically conductive adhesive is improved, especially in high humidity conditions, by applying to the metal substrate an organic coupling agent prior to application of the el... | 09/02/2003 |
| 6607631 | Adhesive compositions with reduced coefficient of friction A polymerizable monomer adhesive composition includes a 1,1-disubstituted ethylene monomer and at least one slip additive, where the slip additive causes a polymer film formed from the monomer to have a lower coefficient of friction than in an absence of ... | 08/19/2003 |
