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| Number | Title | Issue Date |
| 7550057 | Architectural laminate panel with embedded compressible objects and methods for making the same A decorative laminate panel comprises compressible objects embedded inside, wherein the compressible objects would be flattened in unnatural shapes under conventional processes. For example, an exemplary decorative laminate product comprises thatch reed, willow reed... | 06/23/2009 |
| 7413625 | Bonding method of ceramic honeycomb structure Respective pieces of the porous honeycomb segments (2) are stacked while interposing the adhesive layers between respective adhered surfaces (2a), and are bonded together by performing main pressurization (F1, F2) on the whole thro... | 08/19/2008 |
| 7341642 | Manufacturing method for electric device The present invention provides a method of manufacturing an electric device, wherein an adhesive applied on a flexible wiring board is heated to a first temperature to lower its viscosity to a sufficient level, after which a semiconductor chip is placed onto the adh... | 03/11/2008 |
| RE40145 | Ultra-thin flexible durable radio frequency identification devices and hot or cold lamination process for the manufacture of ultra-thin flexible durable radio frequency identification devices A ultra-thin flexible durable radio frequency plastic of other substrate identification device, such as cards, tags, badges, bracelets and labels including at least one electronic element embedded therein and a hot or cold lamination process for the manufacture of r... | 03/11/2008 |
| 7341086 | Automated fabric layup system and method To apply a resin impregnated fabric to a substrate, a device includes a surface having a layer of material and a first edge. The surface moves relative to the substrate and to conform to the substrate. The layer of material is compatible for use with the resin. The ... | 03/11/2008 |
| 7338570 | Method for producing inkjet head and inkjet head A method of producing an inkjet head includes producing a flow path unit that includes plural ink flow paths that reach inkjet nozzles through pressure chambers; producing an actuator unit that has a thermal expansion coefficient different from that of the flow path... | 03/04/2008 |
| 7332049 | Method for fabricating reinforced composite materials A method for fabricating a reinforced matrix composite comprising the step of providing a composite preform having a fibrous structure and applying matrix material onto the preform in locations along the preform. A barrier material is applied to at least a portion o... | 02/19/2008 |
| 7327041 | Semiconductor package and a method for producing the same A semiconductor package includes: a semiconductor chip having circuits formed on a surface, and having a thickness of 0.5 μm or more and 100 μm or less; and an adhesive resin layer provided so as to cover the surface of the semiconductor chip on which the circuits... | 02/05/2008 |
| 7306692 | Production forming, bonding, joining and repair systems for composite and metal components A method of repairing a composite component (1) having a damaged area including: laying a composite lay-up (7) over the damaged area; locating at least one pressure chamber (3, 4) over the damaged area, the pressure chamber including a displacea... | 12/11/2007 |
| 7303643 | Touchless TFT panel lamination fixture and process A method and apparatus for laminating a TFT panel with a glass support plate without the need to touch an active area of the TFT panel. To accomplish this result, a touchless vacuum lamination chuck secures the TFT panel by its outer margins that do not carry TFTs. ... | 12/04/2007 |
| 7247942 | Techniques for joining an opto-electronic module to a semiconductor package The present invention provides a low cost device that has a true die to external fiber optic connection. Specifically, the present invention relates to an optical device package joined to a semiconductor device package. In some cases, the combination is joined using... | 07/24/2007 |
| 7240424 | Method of laminating low temperature co-fired ceramic (LTCC) Material A method of forming an LTCC structure having at least one open cavity on each of first and second opposing sides is disclosed that includes the steps of forming a first LTCC structure including a first side having a plurality of cavities and a second side, subjectin... | 07/10/2007 |
| 7195686 | Method of manufacturing a decorative substrate and decorative substrate produced thereby A method of forming a composite article is disclosed that involves providing a press having first and second platens, a cellulosic fiber substrate having a first thickness, and a layer of material such as a wood veneer, foil, or non-creped paper, where the layer of ... | 03/27/2007 |
| 7155816 | Method for producing a multilayer ceramic substrate A method for producing a multilayer ceramic substrate having a cavity formed therein includes punching a through opening corresponding to the cavity in green sheets constituting a laminate, and printing a conductor at a predetermined position of the green sheets, la... | 01/02/2007 |
| 7135086 | Method for manufacturing display panel A glass substrate of a display panel onto which an organic electroluminescence (EL) element or the like is formed is sealed by affixing the glass substrate and a sealing glass via an adhesive therebetween. During this process, a pressure is applied between the glass... | 11/14/2006 |
| 7093641 | Robotic tape applicator and method A method of fastening a first curved part to a second curved part comprises placing the second part into a specified orientation in relation to a robotically controlled tape applicator, applying two-sided adhesive tape along a non-linear path over the surface of the... | 08/22/2006 |
| 7082980 | Adhesive applicator in a page printing and binding process A binding process includes the application of respective parts of a two-part binding adhesive as strips at either side of a page to be bound. Part A of a two-part adhesive is applied to one side of a page and Part B of the two-part adhesive is applied to the reverse... | 08/01/2006 |
| 7051431 | Component mounting control method In a mounting system where a chip component is mounted by a small component mounting apparatus on paste solder applied onto a board and the mounting state is inspected by a mounting inspection apparatus, and when the mounting inspection apparatus confirms that a chi... | 05/30/2006 |
| 7022199 | Method for fabricating LCD A method for fabricating an LCD includes the steps of loading a first substrate having liquid crystal dropped thereon and a second substrate having sealant coated thereon on a bonding chamber, aligning the first and second substrates, bonding the first and second su... | 04/04/2006 |
| 7018496 | Curable mechanical fasteners Curable mechanical fasteners of the invention comprise a fastening surface comprising a curable material, wherein the fastening surface is capable of being repeatedly attached and unattached to a complementary fastening surface, and when attached to the complementar... | 03/28/2006 |
| 6991699 | LCD bonding machine and method for fabricating LCD by using the same A bonding machine for fabricating an liquid crystal display (LCD) panel to which a liquid crystal dropping method been performed includes a bonding chamber of a one pieced body for carrying out bonding of substrates, at least two or more than two air extraction tube... | 01/31/2006 |
| 6982021 | Method and apparatus for making a trim component with a foam core having a smoothly varying thickness A trim component includes a foam backing layer and a foam pad insert laminated between a cover material and a substrate. The foam pad insert provides an area of enhanced cushioning, and has smoothly tapered edges to ensure a smooth surface contour without a visible ... | 01/03/2006 |
| 6972065 | Process for production of a dielectric multi-layered reflecting coating A method of producing a dielectric multilayer mirror coating is characterized with a view to increasing the coefficient of reflection by the following steps: to begin with, at least two dielectric layers of predetermined initial thicknesses are produced. Subsequentl... | 12/06/2005 |
| 6935135 | Beaded fashion accessories for use on the body A beaded fashion accessory designed in a variety of lengths, such as 1″, 2″, 6″, 12″ and 18″. The beads may be strung on a thread or string in a straight line, or a combination of straight lines or woven into a pattern. They are then applied to the body in... | 08/30/2005 |
| 6926796 | Electronic parts mounting method and device therefor A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive par... | 08/09/2005 |
| 6913667 | Composite structural panel and method A composite structural panel (10) is provided, where the composite structural panel (10) includes a central honeycomb layer (16) having a plurality of box-like channels extending therethrough along a vertical direction. The honeycomb layer (1... | 07/05/2005 |
| 6893530 | Method and system of drying materials and method of manufacturing circuit boards using the same A method and system of cleaning to remove cutting dust and the like generated and adhering to a board material (1a) during drilling for electrical connection, and drying the board material, in a process of manufacturing a circuit board for small electr... | 05/17/2005 |
| 6830647 | Method for laminating disc-shaped substrates A high quality optical disc with extremely tiny bubbles or bubble less present in both disc-shaped substrates when they are laminated by means of an adhesive sheet in a operation process. The method includes bonding the adhesive agent to the surface of the lower dis... | 12/14/2004 |
| 6743327 | Solid surface products A flat non-porous unitary solid surface product comprised of: (a) a flat non-porous unitary matrix made of polymethylmethacrylate, polyvinyl chloride, polycarbonate, or combinations thereof; and (b) a visible decorative object that is permanently fixated in the matr... | 06/01/2004 |
| 6743511 | Method of manufacturing a PTFE preform using thermal fusion This invention relates to methods for manufacturing large PTFE parts by compression molding followed by sintering. The method comprises layering modified and unmodified PTFE in a mold, and compressing the layers to form a preform part. Once the preform parts are for... | 06/01/2004 |
| 6682619 | Composite pre-preg ply having tailored dielectrical properties and method of fabrication thereof A structural dielectrically tailored prepreg panel includes structural materials having desired electrical qualities in one or more desired areas without loss of structural integrity or the addition of parasitic weight. In one method of manufacture an app... | 01/27/2004 |
| 6673191 | Method of and system for displaying cards A card display system of the present invention includes a transparent first shell part and a transparent second shell part. The first shell part has a perimeter that includes a flange that extends outwardly of the inner surface of the first shell part. Th... | 01/06/2004 |
| 6620488 | Skin material, skinned cushion, and process for producing skinned cushion A skin material which can be precisely and easily bonded to a cushion main body while preventing the working atmosphere from becoming worse due to solvent volatilization; a skinned cushion excellent in air permeability and cushioning properties in the sea... | 09/16/2003 |
| 6592696 | Method for fabricating a multilayered structure and the structures formed by the method A method for fabricating a multilayered structure out of sheets of green-tape without the application of high pressures includes the step of applying an adhesive to the sheets of green-tape. Selection of an adhesive with a polymer that decomposes at a hig... | 07/15/2003 |
| 6551428 | Process for assembly of a flexible panel on an open structure and installation for use of this process Process for assembly of a flexible panel on an open structure, and installation to make use of this process. According to the invention, a flexible panel (12) is attached to an open structure (10) by pre-assembling these two parts by cold gluing before th... | 04/22/2003 |
| 6533889 | Method of manufacturing chipboards, fibre boards and the like boards A method of manufacturing plates, such as chipboards, fibre boards and the like boards, where the raw material in form of biomass particles, such as wood chips, wood fibres and the like applied with a thermosetting binder is spread onto a preforming band ... | 03/18/2003 |
| 6527903 | Substrate bonding method, bonded product, ink jet head, and image forming apparatus A satisfactory bonding is implemented at low cost. In a step, a resin layer is formed on a bonding surface side of a silicon wafer on which portion are formed electro-thermal transducers. In a later step, the silicon wafer and another silicon wafer are al... | 03/04/2003 |
| 6472067 | Non-flammable polymer composite panels Non-flammable, fibrous-siloxane cured composites derived from the polymerization of dialkoxysilanes, trialkoxysilanes and tetraalkoxysilanes, in an aqueous medium, to obtain viscous polysiloxane resins. These siloxane resins are used to impregnate or coat... | 10/29/2002 |
| 6458236 | Apparatus and method for mounting electrical parts An electrical part mounting apparatus includes a pressure measuring member for measuring the pressure of a pressure head, and a moving speed control member for controlling the moving speed of the pressure head. Accordingly, the electrical part mounting ap... | 10/01/2002 |
| 6441736 | Ultra-thin flexible durable radio frequency identification devices and hot or cold lamination process for the manufacture of ultra-thin flexible durable radio frequency identification devices A ultra-thin flexible durable radio frequency plastic of other substrate identification device, such as cards, tags, badges, bracelets and labels including at least one electronic element embedded therein and a hot or cold lamination process for the manuf... | 08/27/2002 |
