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Felix Hoffmann, a German chemist, was searching for something to relieve his father's arthritis. In doing so, he "rediscovered" acetylsalicylic acid and in 1900, patented a stable process for developing it. Hence, we have aspirin.
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| Number | Title | Issue Date |
| 8163127 | Process for manufacturing a packaging material A process for manufacturing a packaging material with at least two films (12,16) or foils bonded together via at least one adhesive layer (13) to form a multi-layer laminate (10) is such that at least one adhesive layer is an electron-beam-curab... | 04/24/2012 |
| 8097118 | Method for manufacturing liquid ejection head A method for manufacturing a liquid ejection head having an ejection port-forming member in which an ejection port configured to eject liquid is formed, includes the steps of preparing a substrate including a base substrate; a first layer composed of a resin composi... | 01/17/2012 |
| 7422651 | Apparatus and method for handling membranes A method for applying a pattern to a target surface includes the steps of applying a coating of membrane material over a selected portion of a substrate. The substrate imparts a pattern to the membrane material corresponding to a pattern to be applied to the target ... | 09/09/2008 |
| 7397045 | Exposure apparatus and method thereof An exposure apparatus includes a loading device, a first energy-producing device, and a second energy-producing device. The loading device comprises a plurality of supporting elements, supporting a panel. The first and second energy producing devices are disposed ab... | 07/08/2008 |
| 7371466 | Polymerisation initiators, polymerisable compositions, and uses thereof for bonding low surface energy substrates Quaternary boron salts are used as initiators of polymerisation in adhesive compositions for bonding low surface energy substrates such as polyolefins. The quaternary boron salts are of the formula I wherein R1 i... | 05/13/2008 |
| 7371801 | Vinyl ester and epoxide resins toughened with thermoplastic resin particles A material having a fracture toughness (K1c) of at least 1.2 Mpam.m1/2 as determined according to Standard ISO 13586:2000 comprises a vinyl ester and/or epoxide resin polymerizable at a temperature of less than 70° C. combined with thermoplast... | 05/13/2008 |
| 7365395 | Artificial dielectrics using nanostructures Artificial dielectrics using nanostructures, such as nanowires, are disclosed. In embodiments, artificial dielectrics using other nanostructures, such as nanorods, nanotubes or nanoribbons and the like are disclosed. The artificial dielectric includes a dielectric m... | 04/29/2008 |
| 7341642 | Manufacturing method for electric device The present invention provides a method of manufacturing an electric device, wherein an adhesive applied on a flexible wiring board is heated to a first temperature to lower its viscosity to a sufficient level, after which a semiconductor chip is placed onto the adh... | 03/11/2008 |
| 7273915 | Crosslinkable resin composition and resin formed body produced therefrom A crosslinkable resin composition is provided which can be a forming material having excellent adhesion to metals and excellent heat resistance. The crosslinkable resin composition comprises; a cycloolefin resin (A) obtained through metathesis polymerization of a cy... | 09/25/2007 |
| 7223378 | Preparation of barium titanate or strontium titanate having a mean diameter of less than 10 nanometers Process for preparing barium titanate or strontium titanate by reacting titanium alkoxides with barium hydroxide hydrate or strontium hydroxide hydrate in a C1–C8-alcohol or a glycol ether at from 50 to 150° C. ... | 05/29/2007 |
| 7224039 | Polymer nanocomposite structures for integrated circuits In accordance with certain embodiments consistent with the present invention, diamond nanoparticles are mixed with polymers. This mixture is expected to provide improved properties in interlayer dielectrics used in integrated circuit applications. This abstract is n... | 05/29/2007 |
| 7189463 | Polymerisation initiators, polymerisable compositions, and uses thereof for bonding low surface energy substrates Quaternary boron salts are used as initiators of polymerisation in adhesive compositions for bonding low surface energy substrates such as polyolefins. The quaternary boron salts are of the formula I wherein R | 03/13/2007 |
| 7176422 | Chip bonding heater with differential heat transfer A heater for flip chip bonding transfers more heat to the periphery of a die than to the center. This may result in a more even temperature profile along the die and may help prevent epoxy voiding problems. ... | 02/13/2007 |
| 7098279 | Non-flammable and non-combustible adhesive bonding systems having adherence to low energy surfaces This invention relates to (meth)acrylate based polymerizable compositions and adhesive systems prepared therefrom, which include an initiator system comprising a complex of an organoborane with a complexing agent, an aziridine-containing compound, and a carrier mate... | 08/29/2006 |
| 7090738 | Method of manufacturing membrane electrode assembly A membrane electrode assembly having excellent electric power generating capability is produced from a base coated with first polymer electrolytic solution to form an undried first polymer electrolytic membrane. Undried first polymer electrolytic membrane is coated ... | 08/15/2006 |
| 7087126 | Mounting apparatus and mounting method A mounting apparatus includes: a heater head for bonding a liquid crystal display and a flexible printed circuit board by thermocompression; a cylinder as a heater head driving means for driving heater head to compress the liquid crystal display and flexible printed... | 08/08/2006 |
| 7066532 | Ultrathin structural panel with rigid insert An ultrathin covered structural panel includes a panel body made from a relatively lightweight moldable material such as expanded polypropylene (EPP), expanded polystyrene (EPS), expanded polypropylene with added strengtheners (XPP), polystyrene/polyphenylene ether ... | 06/27/2006 |
| 7025851 | Contact metathesis polymerization A method for bonding a material to a first substrate surface that includes providing a catalyst at the first substrate surface and then contacting that surface with a material that undergoes a metathesis reaction to bond the material to the first substrate surface. ... | 04/11/2006 |
| 6986827 | Method for bonding non-magnetic members A method for bonding a plurality of non-magnetic members includes the steps of (1) mating the non-magnetic members via an uncured adhesive interposed between their surfaces to be bonded; (2) applying pressure to their mated portions between a pressing magnet jig and... | 01/17/2006 |
| 6960272 | Contact metathesis polymerization A method for bonding a material to a first substrate surface that includes providing a catalyst at the first substrate surface and then contacting that surface with a material that undergoes a metathesis reaction to bond the material to the first substrate surface. ... | 11/01/2005 |
| 6940053 | Chip bonding heater with differential heat transfer The invention provides a heater for flip chip bonding. The heater transfers more heat to the periphery of a die than to the center. This results in a more even temperature profile along the die and helps prevent epoxy voiding problems. ... | 09/06/2005 |
| 6939932 | Initiator systems, polymerisable compositions, and uses thereof for bonding low surface energy substrates Use of an initiator system comprising: a combination of an organoborane and a polyaziridine, in a ratio of aziridine groups to boron atoms of greater than 1.3:1, as an initiator of polymerisation in an ad... | 09/06/2005 |
| 6926796 | Electronic parts mounting method and device therefor A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive par... | 08/09/2005 |
| 6923882 | Compliant pre-form interconnect An assembly having a thermosetting layer pierced by a plurality of conductors is formed on a release sheet and subsequently sandwiched between an IC and a PWB or other supporting surface and subsequently cured. The release sheet is removed either before or during cu... | 08/02/2005 |
| 6863767 | Paste-bond clevis joint A method is provided for using a three-dimensional, Pi-shaped, woven preform to assemble first and second composite components. The preform is infused with resin, and at least one surface of the preform is adhered to at least one surface of the first component using... | 03/08/2005 |
| 6855393 | Fire barrier panel A fire barrier panel of the kind suitable for lining car decks and engine rooms of high speed aluminum ferries is described. The panel (10) includes a relatively thin layer of inorganic insulating material (12) adhered to a lightweight support structur... | 02/15/2005 |
| 6837949 | Heat tack application for use with the manufacture generator rotor coils and other components A heat tack application involves arranging an adhesive between a strand of conductive material and a strand of insulation material; applying a temperature of about 100-300° C. and a pressure of about 5-100 psi for about 5-120 seconds to tack the adhesive. A stack c... | 01/04/2005 |
| 6835261 | Adhesive-infused 3-D woven textile preforms for structural joints A method for using a three-dimensional, woven preform to assemble two components. The woven preform is infused with an adhesive, and at least one surface of the preform is bonded to at least one surface of one of the components using the adhesive within the preform.... | 12/28/2004 |
| 6833180 | Adhesive for semiconductor part An adhesive for semiconductor parts, comprising, as a base polymer, at least one cyclic structure-containing thermoplastic polymer selected from the group consisting of (a) a cycloolefin polymer and (b) an aromatic-condensed polymer having a repeating unit of an aro... | 12/21/2004 |
| 6825298 | Amine organoborane complex initiated polymerizable compositions containing siloxane polymerizable components In one embodiment the invention is a polymerizable composition comprising a) an organoborane amine complex; b) one or more of monomers, oligomers or polymers having olefinic unsaturation which is capable of polymerization by free radical polymerization; c) one or mo... | 11/30/2004 |
| 6824851 | Panels utilizing a precured reinforced core and method of manufacturing the same A mass transit flooring assembly including a plurality of sandwich panels. The sandwich panels (30) include a top skin (54), a bottom skin (58), a perimeter defining closeout (46), and a core (50) between the top (54) and bo... | 11/30/2004 |
| 6808788 | Method for strengthening wood products and modified unsaturated polyester resins therefor The strength of wood composites, including hybrid composites comprising wood members bonded to reinforced polyester members, is improved by modifying the polyester components with a polyisocyanate. Wood composites adhesively bonded with polyester resins modified acc... | 10/26/2004 |
| 6808579 | Bonding elastomeric articles An improved method of bonding at least two cured or uncured elastomeric layers is disclosed. The method comprising placing an uncured elastomeric component (22) between the two elastomeric layers, and curing the elastomeric component to bond the elastomeric l... | 10/26/2004 |
| 6802930 | Method of making a laminated structure A first substrate, a second substrate, an intermediate and a plurality of particles form a laminated structure. The first substrate has a first conjunction portion and a second conjunction portion, and the second substrate has a third conjunction portion and a fourt... | 10/12/2004 |
| 6777512 | Amine organoborane complex initiated polymerizable compositions containing siloxane polymerizable components In one embodiment the invention is a polymerizable composition comprising a) an organoborane amine complex; b) one or more of monomers, oligomers or polymers having olefinic unsaturation which is capable of polymerization by free radical polymerization; c) one or mo... | 08/17/2004 |
| 6770164 | Method for attaching a semiconductor die to a substrate An improved method of attaching a semiconductor die to an organic substrate and an improved semiconductor package are herein disclosed. The die package comprises a die secured to a printed circuit board (PCB) with an adhesive tape. The adhesive tape may be of ingle ... | 08/03/2004 |
| 6736925 | Methods of bonding metal surfaces, and components therefor The bonding of steel locating hinge washers to a hinge assembly to facilitate doors-off/door-on processing through an automotive trim shop. The adhesive bonding system cures during the cathodic electro-coat primer bake cycle. The adhesive maintains an intimate, posi... | 05/18/2004 |
| 6723763 | Cure accelerators for anaerobic adhesive compositions The present invention provides a new class of materials effective as accelerators for curing anaerobic adhesives. The addition of these materials into anaerobic adhesives as a replacement for conventional curatives, such as APH and/or toluidines, surprisingly provid... | 04/20/2004 |
| 6719871 | Method for bonding heat sinks to overmolds and device formed thereby A method for bonding heat sinks to packaged electronic components comprises the steps of: (a) exposing to a plasma a surface of a molded polymer formed on a substrate; (b) allowing the plasma to at least partially convert silicon-containing residue on the surface to... | 04/13/2004 |
| 6691407 | Methods for retaining assembled components A method to retain an assembled component on one side of a double-sided printed circuit board. In one embodiment, an adhesive body, in a solid state, is coupled with a component by disposing a coupling member extending from said component within a channel... | 02/17/2004 |
