Quotables
"Rail travel at high speeds is not possible because passengers, unable to breathe, would die of asphyxia."
Dionysius Lardner, Professor of Natural Philosophy and Astronomy at University College, London ; 1830
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| Number | Title | Issue Date |
| 8137499 | Method for reinforcing a fibre composite component and a vacuum mat and arrangement for producing a reinforced fibre composite component In a method for reinforcing a fiber composite component for aviation and space flight, a vacuum mat is configured with at least one receiving portion for reproducibly receiving at least one reinforcing element. The at least one reinforcing element is introduced into... | 03/20/2012 |
| 8137498 | System and method for completing lamination of rigid-to-rigid substrates by the controlled application of pressure The present invention is a process for performing rigid-to-rigid substrate lamination implementing pressure-sensitive adhesive (PSA). The process may include pressurizing a first sealed cavity to a first pressure. The process may further include creating a vacuum wi... | 03/20/2012 |
| 8123894 | 3-dimensional curved substrate lamination A method of laminating a surface of a flexible material to a surface of a rigid, curved material. The method includes pressing an area of the surface of the flexible material into the surface of the rigid, curved material with a holder to create a contact area while... | 02/28/2012 |
| 7943000 | Attaching device and method of fabricating organic light emmiting device using the same An attaching device and a method of fabricating an organic light emitting device using the same are disclosed. The attaching device includes a process chamber, first and second substrate supporters, a substrate detachable part, and an open-close valve. The first and... | 05/17/2011 |
| 7905979 | Method for holding substrate in vacuum In a method of the present invention for holding a substrate in a vacuum, a glass substrate (5) is held by an adhesive pad (20) or an adhesive sheet, both of which are made from a material containing a diene based resin, whereby an adhesive agent is pr... | 03/15/2011 |
| 7686915 | Vacuum-bagging process using PTFE beads Disclosed is a method of vacuum bagging parts being adhered with an epoxy. Polytetrafluoroethylene (PTFE) beads are disposed into a cavity defined by the parts to be adhered. These beads will flow to all of the areas of the parts and will not stick to the adhesive. ... | 03/30/2010 |
| 7594977 | Tape bonder, tape bonding method, and process for manufacturing electronic component A tape bonding device for bonding a tape member to a work piece: having a rubber sheet on the upper surface of which the work piece is mounted, a first vacuum chamber located on the side of the upper surface of the rubber sheet, a second vacuum chamber located on th... | 09/29/2009 |
| 7476289 | Vacuum elastomer bonding apparatus and method The present invention includes a method and apparatus for bonding a sputtering target to a backing plate. In one embodiment, a sputtering target is vacuum bonded to a backing plate using an elastomeric adhesive and a metal mesh. The vacuum pulls the backing plate an... | 01/13/2009 |
| 7438781 | System and method for vacuum bag fabrication A system and method for vacuum bag assembly fabrication via the vacuum bag method which reduces the amount of trapped air. The inventive system includes a chamber adapted to contain a vacuum bag and first and second evacuating mechanisms. The first evacuating mechan... | 10/21/2008 |
| 7435311 | Panel-to-panel lamination method for improved uniformity A method of adhering a first panel, such as an OLED assembly, to a second panel, such as a protective cover plate, is disclosed. An adhesive is applied to a face of at least one of the first and second panels. The first panel is positioned to be responsive to moveme... | 10/14/2008 |
| 7407559 | Method of producing liquid crystal display devices A method of producing a liquid crystal display device. A first substrate having a liquid crystal dripped thereon, and a second substrate, are arranged in a vacuum chamber. The first substrate is held by a first electrostatic chuck and the second substrate is held by... | 08/05/2008 |
| 7361252 | Methods for laminating films for SPD light valves and SPD light valves incorporating such laminated films The invention is directed to a method for laminating a suspended particle device (SPD) film which comprises forming a suspended particle device film; positioning the suspended particle device film within an unlaminated stack of components for forming a laminated sus... | 04/22/2008 |
| 7355841 | Configurations and methods for making capacitor connections An exemplary capacitor has a capacitor stack positioned in a case with a conductor positioned between the case and a lid. In one embodiment the conductor is positioned between the lid and an upper rim of the case and is welded to the lid and case. In one aspect, a c... | 04/08/2008 |
| 7347880 | Flat capacitor having staked foils and edge-connected connection members A method of joining a connection member to a capacitor foil using a staking tool having a tip of less than 0.030″ (0.762 mm) in diameter. Another embodiment couples multiple connection members of a capacitor together by edge-connecting each connection member to it... | 03/25/2008 |
| 7334375 | Evacuated panel for thermal insulation of a body having non-planar surfaces An evacuated panel is provided for thermal insulation of a body (3, 4) having non-planar surfaces, the panel having two main faces and comprising a flexible envelope (1), made of one or more barrier sheets, and a filling material formed of at least two... | 02/26/2008 |
| 7314536 | Disc pairing in optical disc replication In a pairing arrangement, a first half-disc and a second half-disc of an optical disc are bonded together by dispensing a bonding material onto the second half-disc and the first half-disc and second half-disc are placed in a chamber. The pressure within the chamber... | 01/01/2008 |
| 7311795 | Method for the bonding of disk-shaped substrates and apparatus for carrying out the method A first substrate (11a) is positioned on a support surface (7) in a vacuum chamber with an upward-facing first bonding surface (12a) spin-coated with adhesive while a second substrate (11b) is held with downward-facin... | 12/25/2007 |
| 7311961 | Method of making coated articles and coated articles made thereby An article includes a first substrate, a functional coating deposited over at least a portion of the substrate, and a protective coating deposited over the functional coating. The functional coating and the protective coating define a coating stack. A polymeric mate... | 12/25/2007 |
| 7303643 | Touchless TFT panel lamination fixture and process A method and apparatus for laminating a TFT panel with a glass support plate without the need to touch an active area of the TFT panel. To accomplish this result, a touchless vacuum lamination chuck secures the TFT panel by its outer margins that do not carry TFTs. ... | 12/04/2007 |
| 7300532 | Method for manufacturing bonded substrate A method for bonding a first substrate with a second substrate in a treatment chamber, wherein the treatment chamber accommodates a first holding unit that attracts the first substrate and a second holding unit that attracts the second substrate. The method includes... | 11/27/2007 |
| 7294220 | Methods of stabilizing and/or sealing core material and stabilized and/or sealed core material The present invention relates to methods of stabilizing and/or sealing core and stabilized and/or sealed core for manufacturing molded composite structures. In particular, the present invention relates to methods of stabilizing and/or sealing core and stabilized and... | 11/13/2007 |
| 7294531 | Wafer level chip stack method Provided is a method by which differently-sized chips may be stacked at the wafer level. The wafer level chip stack method utilizes first and second wafer assemblies that support first and second wafers on adhesive tapes. One or both of the supported wafers may be s... | 11/13/2007 |
| 7282104 | Method of fixing a sealing object to a base object A sealing-object (4) is fixed to a base-object (10). The sealing-object comprises a through-hole (5). The objects are fixed to each other in the following manner. In a preparation step, a fixing layer (1, 2, 3) is provided between the bas... | 10/16/2007 |
| 7279056 | Method for avoiding air pockets in a joint between two structural components When two structural components are to be joined, for example, when an aircraft skin section is to be secured to a stringer by an adhesive bonding, it is important that the joining surface areas are well-fitted to each other to avoid the formation of air inclusions i... | 10/09/2007 |
| 7258533 | Method and apparatus for scavenging energy during pump operation A pump comprises a body for at least partially defining a pumping chamber (28); a pump member which undergoes displacement when acting upon a fluid in the pumping chamber; and a piezoelectric element which responds to the displacement of the pump member to ge... | 08/21/2007 |
| 7259450 | Double-packaged multi-chip semiconductor module A plurality of semiconductor die is packaged into one component. The inventive design comprises devices which have been singularized, packaged and thoroughly tested for functionality and adherence to required specifications. A plurality of packaged devices is then r... | 08/21/2007 |
| 7258828 | Infusion joining of composite structures A method of joining two components utilizes a fibrous preform at the joint. The preform has two lateral portions and a longitudinally extending flow path. The preform is sandwiched between the two components and enclosed within a vacuum bag. Resin is introduced at a... | 08/21/2007 |
| 7254853 | Air mattress An air mattress is disclosed, which comprises an upper raw material member which has a coating layer at an upper surface of the same; a lower raw material which is spaced and installed at a lower side of the upper raw material member and has a coating layer at a low... | 08/14/2007 |
| 7250330 | Method of making an electronic package A method of making an electronic package is described, wherein a substrate is provided with a pattern of conductive pads and a portion of solder positioned on selected ones of the pattern of copper pads. The solder is then reflowed to form partial hemispherically sh... | 07/31/2007 |
| 7247217 | Vacuum and fluid-pressure method for helmet construction A method for helmet construction by applying vacuum and fluid-pressure technologies is disclosed. Different types and sizes of exterior and interior helmet shells are press-formed from general engineering plastics. Conventional adhesive is applied on the inside surf... | 07/24/2007 |
| 7232615 | Coating stack comprising a layer of barrier coating A coating composition that contains at least one degradable coating layer and at least one layer of barrier coating is disclosed. The coating composition can be used to make a coated substrate having improved performance over conventional coated substrates after exp... | 06/19/2007 |
| 7228611 | Method of transferring large uncured composite laminates A method of transferring an uncured composite laminate skin from a lay-up surface of a male mandrel tool to a female cure tool includes defining multiple vacuum zones on the lay-up surface, each zone corresponding to one of a multiple of portions into which the skin... | 06/12/2007 |
| 7226559 | Method for molding structures A method for molding composite structures whereby a material stack including a core having first and second opposing sides is prepared. The preparing of the material stack includes applying a fibrous support layer on at least one of the first side and the second sid... | 06/05/2007 |
| 7222981 | EL display device and electronic device A cover member is adhered onto a substrate on which an EL element is formed with a filler as an adhesive. Further, a sealing member is provided so as to cover a side surface (an exposing surface) of the filler, and a frame member is adhered using the sealing member.... | 05/29/2007 |
| 7208060 | Low temperature joining of phosphate glass A method for the low temperature joining of similar and/or different phosphate glass by mating at low temperature glass components by an aqueous solution containing phosphorus. In preferred embodiments, the phosphate glasses are polished, cleaned, and brought togeth... | 04/24/2007 |
| 7208057 | Method for avoiding air pockets in a joint between two structural components When two structural components are to be joined, for example, when an aircraft skin section is to be secured to a stringer by an adhesive bonding, it is important that the joining surface areas are plane to avoid the formation of air inclusions in the joint because ... | 04/24/2007 |
| 7204949 | Method of manufacturing a plastic laminate body A manufacturing method of a plastic laminate body, the plastic laminate body having at least one plastic laminate member that is laminated on a plastic substrate, which plastic substrate is pre-processed in advance so as to have a substantially final configuration, ... | 04/17/2007 |
| 7204951 | Method of assembling a single piece co-cured structure A method for manufacturing a composite structure is disclosed herein. The process uses a frame and selectively pressurizable forms. The forms define the interior members of the composite structure and frames define the exterior surface of the composite structure. Co... | 04/17/2007 |
| 7191503 | Method of manufacturing a piezoelectric actuator A method for making a piezoelectric actuator comprises coating at least one of a first surface and a second surface of a piezoelectric element with a polyimide adhesive. The piezoelectric element is then heated to dry the adhesive. Afterwards, the piezoelectric elem... | 03/20/2007 |
| 7182118 | Pick and place assembly for transporting a film of material The invention provides a pick and place assembly for transferring a film of material. The assembly comprises a collet having a substantially convex contact surface for contacting the film, the collet including a vacuum suction device operative to generate a force to... | 02/27/2007 |
