Celebrity Inventors
Glam girl Heddy Lamar may have used her good looks to good effect on the silver screen, but she put her smarts to better use as an inventor. During World War II, she co-patented a frequency-switching system for torpedo guidance that was considered years ahead of its time.
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| Number | Title | Issue Date |
| 8182639 | Weight applicator for a wheel and method for utilizing the same A weight applicator for a wheel of a tire-wheel assembly is disclosed. The weight applicator includes an arm portion and an applicator portion connected to the arm portion. The applicator includes a radially-extending flange portion. The radially-extending flange po... | 05/22/2012 |
| 8092632 | Method for primerless adhesive bonding of metal or plastics substrates The invention relates to a method for bonding metal or plastic substrates, in which the substrate is freed from adhering impurities, a dual-component polyurethane adhesive is directly applied onto at least one substrate without prior application of a primer and the ... | 01/10/2012 |
| 7988808 | Bonding structure with buffer layer and method of forming the same A bonding structure with a buffer layer, and a method of forming the same are provided. The bonding structure comprises a first substrate with metal pads thereon, a protection layer covered on the surface of the substrate, a first adhesive metal layer formed on the ... | 08/02/2011 |
| 7947145 | Method for making carbon nanotube composite A method for making a carbon nanotube composite includes: (a) providing at least one carbon nanotube film and at least one polymer film; (b) forming a carbon nanotube film structure with the carbon nanotube film on a surface of the polymer film to obtain a carbon na... | 05/24/2011 |
| 7527704 | Method for preparing film structure comprising ferroelectric single crystal layer A film structure of a ferroelectric single crystal which can be beneficially used in the fabrication of high-performance electric or electronic parts or devices is prepared by adhering a ferroelectric single crystal plate to a substrate by a conductive adhesive or m... | 05/05/2009 |
| 7501038 | Assembling apparatus, assembling method and terminal cleaning apparatus A terminal cleaning apparatus integrated to an assembling apparatus for integrating a display panel by bonding an electronic part to an externally connecting terminal of a substrate in which substrates 5 respectively held by a first substrate holding portion ... | 03/10/2009 |
| 7459055 | Bonding structure with buffer layer and method of forming the same A bonding structure with a buffer layer, and a method of forming the same are provided. The bonding structure comprises a first substrate with metal pads thereon, a protection layer covered on the surface of the substrate, a first adhesive metal layer formed on the ... | 12/02/2008 |
| 7425243 | Method of joining two workpieces without extraneous materials and also workpiece joined by this method In a method of joining two workpieces (10, 16) without extraneous materials to produce a workpiece 25 which is joined over a joining area (24) which is formed by two fully adjoining surfaces (13, 13′) of the two workpieces (10, 16 | 09/16/2008 |
| 7402219 | Method and device for the production of a multi-layered three-dimensional component The invention relates to a method and a device (12, 13) for producing a multi-layered three-dimensional component (14). In a first step, a layered geometrical structure is formed, said structure consisting of at least two webs (16) of an at leas... | 07/22/2008 |
| 7351353 | Method for roughening copper surfaces for bonding to substrates The invention is directed to a method and composition for providing roughened copper surfaces suitable for subsequent multilayer lamination. A smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened... | 04/01/2008 |
| 7341923 | Substrate, manufacturing method therefor, and semiconductor device A step of forming the first substrate which has a separation layer and a Ge layer on the separation layer, and a step of forming a bonded substrate stack by bonding the first substrate to the second substrate through an insulating layer, and a step of dividing the b... | 03/11/2008 |
| 7327217 | Security methods, systems and articles of manufacture An identification badge is shown and includes a washable worker identification badge including a photograph of a worker using the garment, wherein an image from the photograph is sublimated or printed on the badge. In one embodiment the badge includes a security dev... | 02/05/2008 |
| 7303943 | Method of manufacturing electric device In a method of manufacturing an electric device, moisture in a film substrate is reduced by heating the film substrate at a temperature in the range of 80° C. to 100° C. Thereafter, an IC is mounted on the film substrate. ... | 12/04/2007 |
| 7301226 | Conductor substrate, semiconductor device and production method thereof A conductor substrate for mounting a semiconductor element, at least a portion thereof mounting the semiconductor element being sealed with an insulating resin, wherein an uppermost surface layer of the conductor substrate comprises copper or an alloy thereof, and t... | 11/27/2007 |
| 7294222 | External pipe cleaner Disclosed is a pipe cleaner apparatus that is attached to a pipe fusion machine. The pipe cleaner removes dirt, snow, mud, and other debris from the outer surface of pipe sections prior to the butt fusion process. The pipe cleaner may be a wiper through which the pi... | 11/13/2007 |
| 7276134 | Methods and systems for sealing liquid cooled stator bar end connections for a generator A method includes blasting the interior surfaces of the fitting to stator bar strand joint with CO2 pellets to remove loose copper oxide which otherwise would interfere with proper sealing between an epoxy and the copper surfaces of the joint. After clean... | 10/02/2007 |
| 7252100 | Systems and methods for processing a set of circuit boards A circuit board processing system includes a wash tank configured to contain cleaning fluid, and a positioning subsystem configured to immerse a set of circuit boards into the wash tank. The system further includes a flow control subsystem having (i) a first set of ... | 08/07/2007 |
| 7244327 | Method and apparatus for substantially lifting erasable marked images from a marking surface or the like A method for substantially lifting dry-erasable marked images (4) from a whiteboard surface (2) includes providing a rolled transparent adhesive film sheet (6) for lifting the image, a rolled paper sheet (8) having a shade or color that i... | 07/17/2007 |
| 7235461 | Method for bonding semiconductor structures together A method for bonding semiconductor structures together is described. The technique includes providing a bonding surface on each of two semiconductor structures, brushing a bonding surface of at least one of the structures to remove contaminants and to activate hydro... | 06/26/2007 |
| 7201823 | High throughput plasma treatment system A method for the plasma treatment of parts. The method includes sending loading signals from an electronic control to a transfer mechanism and loading the parts from a position outside of the treatment chamber to a plurality of treatment positions within the treatme... | 04/10/2007 |
| 7201819 | Process for producing a sealed water-soluble package Process for producing a sealed water-soluble package of improved aesthetic appearance by treating at least part of the outer surfaces of the sealed package with a plasticizer composition and applying heat thereto, a package obtainable thereby and a specified use of ... | 04/10/2007 |
| 7172671 | Method of manufacturing friction plate A core plate 1, which has been punched in a core plate punching step 20, is conducted a surface roughing step 30 and a cleaning step 40. After coating both surfaces of the core plate 1 with adhesive in an adhesive coating step 5... | 02/06/2007 |
| 7172681 | Process for producing rubber-based composite material Disclosed is a process for producing a rubber-based composite material, including the steps of forming, by sputtering, an adhesion film on a substrate to be mated with a rubber for constituting the composite material, laminating a rubber composition on the adhesion ... | 02/06/2007 |
| 7166540 | Method for reducing assembly-induced stress in a semiconductor die A method and apparatus for mounting semiconductor die and integral heat spreader are disclosed. In one embodiment, thermal expansion of the integral heat spreader is restricted by physical constraints during the process of heating interface material that bonds the i... | 01/23/2007 |
| 7153445 | Method for roughening copper surfaces for bonding to substrates The invention is directed to a method and composition for providing roughened copper surfaces suitable for subsequent multilayer lamination. A smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened... | 12/26/2006 |
| 7146660 | Patient support pad with repositionable pressure source An apparatus for supporting a patient includes a pad having a first side, a second side, and a fluid chamber configured to receive fluid under pressure. The apparatus also has a pressure source operable to deliver pressurized fluid to the fluid chamber and a pouch c... | 12/12/2006 |
| 7131471 | Compressed wood product and manufacture The invention described is a method for compressing wood products in a manner which achieves fixation of compression deformation. The method includes two compression stages. In between those stages the wood is coated and impregnated with a fatty acid. The wood, afte... | 11/07/2006 |
| 7115182 | Anodic bonding process for ceramics A method of bonding components comprising the following steps. At least a first ceramic component and a second ceramic component are provided. A first conductive layer is formed over the upper surface of the first ceramic component. An intermediate film is formed ov... | 10/03/2006 |
| 7111751 | Plastic lined concrete tanks equipped with waterstop systems A plastic lined concrete tank includes a floor, an upright wall having a lower edge adjacent the floor, a plastic wall lining on an interior surface of the wall, and a plastic waterstop structure inhibiting penetration of water between said floor and said lower edge... | 09/26/2006 |
| 7108795 | Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under con... | 09/19/2006 |
| 7087134 | System and method for direct-bonding of substrates A method of bonding substrates and devices having bonded substrates are disclosed. The method of bonding substrates includes depositing a layer of bonding substrate material onto a bonding surface of a first substrate. A bonding site density of at least one of the l... | 08/08/2006 |
| 7082868 | Lightweight armor with repeat hit and high energy absorption capabilities A lightweight armor with repeat hit capability includes at least one layer of material that absorbs energy upon being impacted by an object through a reversible phase change and/or an elastic strain deformation of at least 5%. Once the energy of the object has been ... | 08/01/2006 |
| 7066232 | Apparatus and method of manufacturing laminated steel sheet An apparatus for manufacturing a laminated steel sheet by treating surfaces of a base steel sheet so that the adhesive strength between a base steel sheet and lamination sheets is increased. The apparatus comprises an uncoiler for unwinding a coiled base steel sheet... | 06/27/2006 |
| 7048867 | Method of increasing the area of a useful layer of material transferred onto a support The invention relates to a method of increasing the area of a useful layer of material coming from a source substrate and which is effectively transferred onto a support substrate. The dimensions of the outer outline of one of the source and support substrates, refe... | 05/23/2006 |
| 7041191 | Method for manufacturing membrane electrode assembly of fuel cell by printing processes A method for manufacturing membrane electrode assembly of fuel cell includes positioning an ion exchange membrane that is cleaned and trimmed to a predetermined size in advance to a base plate, mounting the base plate to a printing platform, attaching a printing pla... | 05/09/2006 |
| 7032261 | Patient transfer apparatus A transfer device is provided for transferring a patient from a first support surface to an adjacent second support surface. The device includes a plurality of elongated side-by-side first bladders arranged to be placed under the patient on the first support surface... | 04/25/2006 |
| 7029552 | Method of manufacturing self-adhering footwear A method of manufacturing self-adhering footwear including the steps of a) cleaning at least an upper surface portion of the mat with MEK solvent; b) applying a first adhesive to the cleaned surface; c) applying a second adhesive to the cleaned surface; d) applying ... | 04/18/2006 |
| 7005319 | Global planarization of wafer scale package with precision die thickness control In accordance with the present invention, a method for producing at least two different chips with a controlled total chip thickness such that when these chips are placed into a corresponding pocket of a plurality of pockets located in a wafer chip carrier wherein e... | 02/28/2006 |
| 6972071 | High-speed symmetrical plasma treatment system A plasma treatment system (10) and related methods for rapidly treating a workpiece (56) with ions from a plasma having an ion density that is reproducibly uniform and symmetrical. The processing chamber (12) of the plasma treatment system (1... | 12/06/2005 |
| 6969557 | Surface-treated copper foil low-dielectric substrate and copper-clad laminate and printed wiring board using the same The invention provides a surface-treated copper foil which can sufficiently ensure adhesive strength with a low-dielectric substrate used in forming a printed wiring board for high-frequency applications and can minimize transmission losses. There is provided a surf... | 11/29/2005 |
