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Class 156/263 - Separate cutting of separate sheets or webs


Subclass of Class 156 - Adhesive bonding and miscellaneous chemical manufacture
Definition: Processes directed to independently cutting at least two
No. of patents: 169
Last issue date: 07/21/2009


1          
NumberTitleIssue Date
7563340System and method for manufacturing coins, storyboards, memory money, collectors items, and trophies
A system and method is provided for manufacturing a memory bill. The method can include the operation of creating a template for displayed face of the memory bill. Another operation can be cutting out the displayed face of the memory bill. Yet another operation can ...
07/21/2009
7374628Method for manufacturing a cell-driving-type micro pump member
A method for manufacturing a micro pump member, in which a plurality of cells formed in a base part are used as pressurizing chambers, and side walls forming the pressurizing chambers are constructed by piezoelectric/electrostrictive elements. The micro pump member ...
05/20/2008
7368031Laminate inlay process for sports boards
The present invention provides a method for inlaying a design into a laminate sheet and bonding the inlaid laminate sheet to a core structure or core substrate. The method of the present invention includes the steps of die cutting a preselected inlay design out of a...
05/06/2008
7364637Method and apparatus for manufacturing friction plate
A method for manufacturing a friction plate in which a plurality of frictional material segments are adhered to a substantially annular core plate. The method previously registers the frictional material segments to adhesion positions, and presses the core plate to ...
04/29/2008
7365006Semiconductor package and substrate having multi-level vias fabrication method
A semiconductor package and substrate having multi-level plated vias provide a high density blind via solution at low incremental cost. Via are half-plated atop a circuit pattern and then a second via half is added to complete the via after isolation of elements of ...
04/29/2008
7334326Method for making an integrated circuit substrate having embedded passive components
A method for making an integrated circuit substrate having embedded passive components provides a reduced cost and compact package for a die and one or more passive components. An insulating layer of the substrate is embossed or laser-ablated to generate apertures f...
02/26/2008
7312103Method for making an integrated circuit substrate having laser-embedded conductive patterns
A method for making an integrated circuit substrate having laser-embedded conductive patterns provides a high-density mounting and interconnect structure for integrated circuits. A dielectric material is injection-molded or laminated over a metal layer that is punch...
12/25/2007
7240413Process and device for producing clutch friction plate
A process for producing a clutch friction plate in which a plurality of friction material segments are bonded to an annular flat face of an annular core plate so that oil channels are formed between the segments, the process including: a step of forming a plurality ...
07/10/2007
7228571Method of making a helmet
A method of making a helmet comprises the steps of cutting a plurality of substantially rectangular, preferably square, blanks from a sheet of resin-impregnated fabric, making curved cuts (1) in each blank to form a crown portion (5) and lobe portions ...
06/12/2007
7225050Method and apparatus for precisely fitting, reproducing, and creating 3-dimensional objects from digitized and/or parametric data inputs using computer aided design and manufacturing technology
A high-technology method for creating, reproducing, and or precisely fitting custom appendages to topographically complex structures. The method comprises a combination of novel measurement techniques in conjunction with computerized modeling and machining processes...
05/29/2007
7211164Lamination apparatus for ceramic green sheet and lamination method
In a method and apparatus for manufacturing ceramic green sheets, first and second long ceramic green sheets are selectively drawn out by means of first and second draw-out rollers into a commonly used punching station. In the punching station, predetermined areas o...
05/01/2007
7211900Thin semiconductor package including stacked dies
A semiconductor package and method for fabricating the same is disclosed. In one embodiment, the semiconductor package includes a circuit board, at least two semiconductor chips, electric connection means, an encapsulant, and a plurality of conductive balls. The cir...
05/01/2007
7198471Wind turbine blade
The invention relates to a wind turbine blade comprising a number of pre-fabricated strips arranged in a sequence along the outer periphery. The strips consist of a fibrous composite material, preferably carbon fibres, and consist of a wooden material, preferably pl...
04/03/2007
7195690Roll-good fuel cell fabrication processes, equipment, and articles produced from same
Fabricating roll-good fuel cell material involves laminating first and second bonding material webs having spaced apart windows to first and second surfaces of a fuel cell membrane web. First and second active regions of the membrane web are positioned within the re...
03/27/2007
7185426Method of manufacturing a semiconductor package
A semiconductor package including top-surface terminals for mounting another semiconductor package provides a three-dimensional circuit configuration that can provide removable connection of existing grid-array packages having a standard design. A semiconductor die ...
03/06/2007
7165664Wet-type segmented friction material and its manufacturing method
A wet-type segmented friction material has a tape-like friction material substrate which is passed through and pressed between a roller having a dent at a center and a flat roller. At the same time, the friction material substrate is heated from an inside and an out...
01/23/2007
7148529Semiconductor package
A semiconductor package includes (a) an interposer, (b) a wiring layer containing conductors formed adjacent to each other at intervals that cause no short circuit among the conductors, the wiring layer covering a given area of the interposer, to block light from pa...
12/12/2006
7145238Semiconductor package and substrate having multi-level vias
A semiconductor package and substrate having multi-level plated vias provide a high density blind via solution at low incremental cost. Via are half-plated atop a circuit pattern and then a second via half is added to complete the via after isolation of elements of ...
12/05/2006
7108650Procedure of attaching sheets and padded envelope
The envelope comprises layers of plain un-coated kraft paper and of bubble-wrap polyethylene. A stack of the layers is joined at the marginal edges of the envelope by squeezing the stack between a pair of points-dies, which are formed with points that puncture the k...
09/19/2006
7102892Modular integrated circuit chip carrier
An apparatus and method is disclosed that allows for the arranging in a three dimensional array semiconductor chips on a circuit board. A unique chip carrier is disclosed on which any IC chip can be positioned on above the other on a circuit board. Additionally, the...
09/05/2006
7087133Methods for application of adhesive tape to semiconductor devices
A method and apparatus for application of adhesive tape to semiconductor devices are discolsed. A first adhesively coated tape material length is supplied to a first die associated with a cutting and application mechanism. A second length of adhesively coated tape m...
08/08/2006
7081180Roll-to-roll process for fabricating passive matrix plastic displays
A process for fabricating passive plastic displays, comprising the steps of: adopting a roll-to-roll coating machine for fabricating a bottom substrate having a fist patterned conducting line, fabricating a top substrate having a second patterned conducting line and...
07/25/2006
7013943Automatic prepreg laminating method and apparatus for carrying out the same
A first parting film is held on a first flat laminating table in close contact with the first flat laminating table, and then wide prepregs are laid for plane lamination on the first parting film to form a large prepreg-laminate having a large area. A second parting...
03/21/2006
6984284Piezoelectric composites and methods for manufacturing same
A method is described for making a composite, such as a piezoelectric composite, having a predetermined volume ratio. Initially, a pair of base slabs are diced to form slot having uniform pitch spacing such that a material portion of one diced base slab may be recei...
01/10/2006
6972144Composite structural material and method of making same
A composite structural material suitable, for example, as a replacement for wooden boards, is disclosed. It comprises a dimensionally stable core material ensheathed in a dimensionally stable, laminar covering that is adherent to the core material. The laminar cover...
12/06/2005
6968721Method of manufacturing blade retainer and manufacturing devices therefor
A method of manufacturing a turbine blade retainer using a material cutting device and a material bending device includes steps for suspending a bar stock material between a polyurethane shock absorber and a bore of a cutting jig support, moving the cutting punch do...
11/29/2005
6951595Polyester film laminate with enhanced impact and tear resistance and method for its production
A method of forming a reinforced polymer film structure is disclosed that includes the steps of slitting a biaxially oriented polymer film web having a top face and a bottom face into a first portion and a second portion, identifying the first portion and the second...
10/04/2005
6938332Method for manufacturing multilayer ceramic substrates
A method for manufacturing multilayer ceramic substrates in accordance with a multiple formation method using a non-shrinkage process allows the multilayer ceramic substrates to be smoothly formed by dividing a sintered multilayer mother substrate, and in addition, ...
09/06/2005
6939426Notepad and process and apparatus for making same
The invention relates to a notepad and to a process for manufacturing a notepad comprising providing a paper supply; sequentially feeding single pages from said paper supply to a printing and cutting station; printing on images on pad region of each single page; mak...
09/06/2005
6915829Apparatus and method for cutting and placing limp pieces of material
Apparatus and method for cutting and placing limp pieces of material on an article component. The apparatus, which is particularly constructed for positioning the relative placement of two cut piece, includes a vacuum conveyor which holds the article component in a ...
07/12/2005
6899783Method of manufacturing friction plate for wet clutch
In order to manufacture a friction plate for a wet clutch including a core plate and a friction member bonded to at least one of annular flat surfaces of the core plate, each friction member including friction member segments, an oil groove being provided between ad...
05/31/2005
6878228Veneer face plywood flooring and method of making the same
The present invention provides a wood board for use as flooring panels and a method of making the wood board. The wood board has the strength and outer surface finish of hardwood boards, increased flexibility, and a lower cost than hardwood boards. The wood board of...
04/12/2005
6860957Automatic prepreg laminating method and apparatus for carrying out the same
A first parting film is held on a first flat laminating table in close contact with the first flat laminating table, and then wide prepregs are laid for plane lamination on the first parting film to form a large prepreg-laminate having a large area. A second parting...
03/01/2005
6852190Method for producing an absorbent article
A process for manufacturing an absorbent article includes continuously feeding a first web (1) along a travelling path, said first web(1) including a first and a second opposing strip (9, 10) extending in the longitudinal direction and a first p...
02/08/2005
6848488Apparatus for attaching polarizing plate
The apparatus of attaching a polarizing plate includes a base body, a first cutting out module, a first protection sheet strip module and a first polarizing plate attaching module. The first cutting out module cuts out a first polarizing plate from a first mother po...
02/01/2005
6797092Method and apparatus for manufacturing monolithic ceramic electronic component
A method for manufacturing a monolithic ceramic electronic component formed by using a laminate allows a plurality of types of ceramic green sheets to be laminated with ease and efficiency. The method enables a reduction in space for lamination. This method includes...
09/28/2004
6773538Method of making countertops
An improved method of countertop manufacture having a laminate or veneer horizontal upper surface and a laminate or veneer vertical face with a corner element with an arcuate surface that smoothly fairs into both the upper surface and the face. The countertop is man...
08/10/2004
6770159Method of fabricating an RF substrate with selected electrical properties
The method includes selecting two or more types of ceramic materials (202, 204), each having a distinct set of electrical properties different from the other of the types of ceramic materials. A substrate pattern can also be selected. The substrate pattern ca...
08/03/2004
6749711Apparatus and methods for coverlay removal and adhesive application
Apparatus and methods for synchronously removing coverlay film from an adhesive film and applying an adhesive strip cut from the adhesive film to cover one or more reject die sites and/or functional die sites on semiconductor package support elements are disclosed. ...
06/15/2004
6702918Intermittent material feed type variable-lamination rapid prototyping process and apparatus using linear thermal cutting system
A rapid prototyping process and apparatus that provides an intermittent material feed type variable-lamination rapid prototyping using a linear thermal cutting system, wherein intermittently fed materials are cut to have variable lengths, widths, and late...
03/09/2004
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