...Daniel Webster invented a "bull plow" to pull out tree stumps. It didn't catch on because it was huge and required four oxen to pull it!
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7083759 | Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directions A material for a semiconductor-mounting heat dissipation substrate comprises a copper-molybdenum rolled composite obtained by impregnating melted copper into a void between powder particles of a molybdenum powder compact to obtain a composite of molybdenum and coppe... | 08/01/2006 |
| 7001473 | Method for producing platinum alloys and alloys which can be obtained using this method Method for producing platinum/copper alloys which envisages the steps of melting platinum and copper parts and/or powders in a predetermined ratio in a controlled atmosphere, keeping the fusion product at the melting temperature for a given time period and subjectin... | 02/21/2006 |
| 7001471 | Method and apparatus for low-temperature annealing of metallization microstructures in the production of a microelectronic device A method for filling recessed microstructures at a surface of a microelectronic workpiece, such as a semiconductor wafer, with metallization is set forth. In accordance with the method, a metal layer is deposited into the microstructures with a process, such as an e... | 02/21/2006 |
| 6800151 | Method of modifying properties of high-strength, high-conductivity Cu-Ag alloy plate, and method of producing high-strength, high conductivity Cu-Ag alloy plate The present invention provides a method of modifying conductivity- and strength-related properties of a Cu—Ag alloy plate produced by predetermined annealing and cold rolling, composed of 4 to 32% by atom of Ag and Cu accounting for the balance, wherein the plate ... | 10/05/2004 |
| 6773513 | Method for residual stress relief and retained austenite destabilization A method using of a magnetic field to affect residual stress relief or phase transformations in a metallic material is disclosed. In a first aspect of the method, residual stress relief of a material is achieved at ambient temperatures by placing the material in a m... | 08/10/2004 |
| 6746553 | Process for producing sputtering target materials The invention includes methods of reducing grain sizes of materials, and methods of forming sputtering targets. The invention includes a method for producing a sputtering target material in which a metallic material is subjected to plastic working at a processing pe... | 06/08/2004 |
| 6723350 | Lubricious coatings for substrates The invention provides methods and kits to form water swellable gel coatings, preferably lubricious coatings, on substrates, and coated substrates thus formed. The coatings contain one or more antimicrobial metals formed with atomic disorder, together with one or mo... | 04/20/2004 |
| 6627055 | Manufacture of fine-grained electroplating anodes A continuously cast copper ingot is made by a procedure in which turbulence is imparted to the metal/solid interface during the casting operation. The ingot is then hot worked to form a billet having a smaller average grain size and a larger diameter than... | 09/30/2003 |
| 6588218 | Cryogenic tempering process for dynamoelectric devices A process for treating a conductor winding component of a dynamoelectric device incorporates a cryogenic cycle having a ramp down phase during which the conductor winding component is ramped down from at least about -100° F. in a dry cryogenic environmen... | 07/08/2003 |
| 6531039 | Anode for plating a semiconductor wafer An anode for use in electroplating semiconductor wafers, comprising a metal plate formed from a generally continuous casting process that is essentially free of voids or cracks, the casting being thermo-mechanically worked until the anode has an average g... | 03/11/2003 |
| 6475635 | Sliding material made of copper alloy, method of producing same, and sliding bearing A copper alloy sliding material which can bring about superior resistance to fatigue as well as good anti-seizure property without containing any Pb. The copper alloy sliding material is made to have the structure in which both of the hard copper alloy ph... | 11/05/2002 |
| 6464806 | Method of forming extruded structures from polycrystalline materials and devices formed thereby A method of forming extruded structures from a polycrystalline material and structures formed thereby. The method generally entails forming a structure that comprises a polycrystalline material constrained by a second material in all but one direction, wi... | 10/15/2002 |
| 6428638 | Process for producing sputtering target materials The invention includes methods of reducing grain sizes of materials, and methods of forming sputtering targets. The invention includes a method for producing a sputtering target material in which a metallic material is subjected to plastic working at a pr... | 08/06/2002 |
| 6332969 | Inert electrode containing metal oxides, copper and noble metal A cermet composite material is made by treating at an elevated temperature a mixture comprising a compound of iron and a compound of at least one other metal, together with an alloy or mixture of copper and a noble metal. The alloy or mixture preferably c... | 12/25/2001 |
| 6277218 | Probe card treatment method A probe card treatment method, which is applicable on a probe card comprising multiple probe needles, is described. A thermal treatment is conducted on the probe card by placing the probe card in a closed heating device, wherein the temperature of the the... | 08/21/2001 |
| 6126761 | Process of controlling grain growth in metal films A process for controlling grain growth in the microstructure of thin metal films (e.g., copper or gold) deposited onto a substrate. In one embodiment, the metal film is deposited onto the substrate to form a film having a fine-grained microstructure. The ... | 10/03/2000 |
| 5882448 | Contact material for vacuum valve and method of manufacturing the same A contact material for a vacuum valve including, a conductive constituent including at least copper, an arc-proof constituent including at least chromium and an auxiliary constituent including at least one selected from the group consisting of tungsten, m... | 03/16/1999 |
| 5858136 | Process for the manufacture of wires with a brass surface, for the purpose of wire electroerosion Copper wire coated with a layer of zinc is heated to a temperature (T1) sufficient for the formation of a brass phase ଲ, and the temperature is maintained until complete diffusion of the zinc. The thickness of the zinc covering can be cho... | 01/12/1999 |
| 5651839 | Process for engineering coherent twin and coincident site lattice grain boundaries in polycrystalline materials A process for producing coherent twin, incoherent twin, low angle tilt, high angle tilt or CSL grain boundaries in materials is described. A planar material or a planar substrate coated with the polycrystalline material is heated in selected areas so as t... | 07/29/1997 |
| 5626689 | Method of generating heat using catalytic material This invention relates to a catalytic fuel composition capable of reducing pollutants in the combustion gasses generated upon combustion of the same. A catalytic material is combined with a liquid, petroleum-based fuel, mixed and solid particles are separ... | 05/06/1997 |
| 5567382 | Dispersion strengthened copper A dispersion strengthened copper alloy and a method for producing the alloy are provided. The alloy preferably comprises aluminum, titanium and hafnium as alloying elements that are internally oxidized under controlled conditions to produce a dispersion s... | 10/22/1996 |
| 5421085 | Extrusion nozzle with annealed end dam A process is disclosed for fabricating an extrusion die including providing hard brass stock, machining the stock to form a thick rigid machined die end dam having a sharp corner, annealing the machined die end dam, providing a die body having at least on... | 06/06/1995 |
| 5294270 | Heat-treated wire-mesh EMI/RFI shielding gasket A wire-mesh gasket fashioned from heat-treatable materials such as beryllium copper alloy wire is knitted or braided into a tubular structure. Plural wires may be used. Various cross-sectional configurations such as circular, teardrop, double lobed, and f... | 03/15/1994 |
| 5271777 | High efficiency coil fabrication process Mill annealed commercial insulated copper wire 20 used to fabricate high Residual Resistivity Ratio (RRR) windings 12 is unwound from a supply spool 22 and wound onto an annealing spool 24, annealed on the annealing spool 24, and unwound from the annealin... | 12/21/1993 |
| 5198044 | Copper alloy and process for its preparation Process for the preparation of a substantially homogeneous alpha phase copper-nickel-tin alloy comprising copper and 4-18% by weight of nickel and 3-13% by weight of tin, comprising atomizing a molten alloy having the before-indicated composition and coll... | 03/30/1993 |
| 5196074 | Copper alloys capable of spinodal decomposition and a method of obtaining such alloys A method is disclosed for manufacturing a finished product which consists at least partially of a copper nickel and tin based alloy which has undergone spinodal decomposition. A liquid bath of the Cu Ni Sn based alloy is prepared containing also titanium ... | 03/23/1993 |
| 5073209 | Process embodiments for improving the electrical properties of conductors In one embodiment this invention provides a process for decreasing the resistivity of an electrical conductor. The process involves the application of high temperature and an external field to a conductor to induce a current flow and physicochemical trans... | 12/17/1991 |
| 5004520 | Method of manufacturing film carrier There is provided a film carrier comprising a resin base film and a rolled copper foil laminated thereon, said rolled copper foil forming leads for mounting semiconductor chips or other electronic components in place, characterized in that said rolled cop... | 04/02/1991 |
| 4531980 | Corrosion resisting copper alloy A corrosion resisting copper alloy, especially suitable for use in fabricating heat exchangers, comprises 25 to 38% by weight zinc, 0.005 to 0.04% by weight phosphorus, the remainder of the alloy being copper, the alloy having a recrystallized grain size ... | 07/30/1985 |
| 4404023 | Process for the production of a metal or metal alloy powder A process for the production of a metal or metal alloy powder with flake-shaped particles comprises mechanically crushing a ductile starting material. A foreign substance which forms a separate phase between the crystallites of the starting material is ad... | 09/13/1983 |
| 4151014 | Laser annealing A selected portion of a nonferrous, metallic workpiece, such as a copper or copper alloy workpiece, is annealed to a controlled degree of temper by irradiating the selected portion of the workpiece with a pulsed laser beam, while so regulating a parameter... | 04/24/1979 |
| 4059437 | Oxygen-free copper product and process An improved copper product and process of making it, wherein oxygen-free copper contains small amounts of manganese above normal impurity levels, and has enhanced grain size control during annealing, high electrical conductivity, and increased ductility a... | 11/22/1977 |