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| Number | Title | Issue Date |
| 7442267 | Anneal of ruthenium seed layer to improve copper plating A ruthenium-containing thin film is formed. Typically, the ruthenium-containing thin film has a thickness in a range of about from 1 nm to 20 nm. The ruthenium-containing thin film is annealed in an oxygen-free atmosphere, for example, in N2 forming gas, ... | 10/28/2008 |
| 7396424 | Method of manufacturing a hard precious metal alloy member A method of manufacturing a hard precious metal alloy member comprising casting a material consisting essentially of a gold alloy, which has a gold content of from 37.50 to 98.45 wt %, and contains gadolinium in an amount of not less than 50 ppm, but less than 1,500... | 07/08/2008 |
| 7381368 | Palladium-boron alloys and methods for making and using such alloys A palladium-boron composition and methods of making and using same are provided. In one aspect, the invention comprises an alloy comprising palladium and boron, the boron being in solid solution in the palladium and the alloy having a two-phase structure, wherein ea... | 06/03/2008 |
| 7285174 | Method for producing metallic strips A method for producing metallic strips having a high-grade cube texture based on nickel, copper, aluminum, silver or alloys of these metals including austenitic iron-nickel alloys makes it possible to obtain, during a subsequent annealing process and with lower tota... | 10/23/2007 |
| 7244367 | Metal alloy elements in micromachined devices A micromechanical device is provided, which includes at least one flexible member formed from an alloy, where the alloy is made up of one or more noble metals and one or more alloying elements, wherein each of the alloying elements has an equilibrium solid solubilit... | 07/17/2007 |
| 7131768 | Extended temperature range EMF device A sensor and method of manufacturing an extended temperature range EMF sensor that is cost effective and highly reliable, with a stable EMF output and with an operating range of up to 1700° C. in hostile environments. The sensor is formed of highly stable dispersio... | 11/07/2006 |
| 7048813 | Foil-form soldering metal and method for processing the same The present invention provides a processing method capable of continuously working an Au—Sn soldering metal having a foil form in room temperature. The foil-form soldering metal containing from 10% by weight to 90% by weight of Au and balance comprising Sn is subj... | 05/23/2006 |
| 7012492 | Contact construction for DC loads and switching device having the contact construction A contact construction and switching device for DC loads that can be repeatedly used while minimizing problems such as cut-off failure, locking and deposition due to an abnormal continuation of an arc between the contacts, burning and destruction of the contacts, an... | 03/14/2006 |
| 7001473 | Method for producing platinum alloys and alloys which can be obtained using this method Method for producing platinum/copper alloys which envisages the steps of melting platinum and copper parts and/or powders in a predetermined ratio in a controlled atmosphere, keeping the fusion product at the melting temperature for a given time period and subjectin... | 02/21/2006 |
| 6974923 | Electric contact and breaker using the same A high quality electrical contact that is made of a Cd free Ag alloy and can be applied to a breaker is provided. The electrical contact is made of an Ag alloy containing Sn and In each 1 to 9% by weight, and has a first layer as the surface layer and a secon... | 12/13/2005 |
| 6821406 | METHOD FOR SURFACE TREATMENT OF GOLD-PLATED BODY AND SURFACE-TREATED PRODUCT, AND PROCESS FOR PRODUCING GOLD-PLATED BODY AND GOLD-PLATED BODY, AND METHOD FOR IMMOBILIZATION OF SULFUR-CONTAINING MOLECULES The present invention provides a gold-plated body, a method for surface treatment of a gold-plated body, a surface-treated product, and an immobilization method which make it possible to immobilize a large number of sulfur-containing molecules. With the surface trea... | 11/23/2004 |
| 6764561 | Palladium-boron alloys and methods for making and using such alloys A palladium-boron composition and methods of making and using same are provided. In one aspect, the invention comprises an alloy comprising palladium and boron, the boron being in solid solution in the palladium and the alloy having a two-phase structure, wherein ea... | 07/20/2004 |
| 6723350 | Lubricious coatings for substrates The invention provides methods and kits to form water swellable gel coatings, preferably lubricious coatings, on substrates, and coated substrates thus formed. The coatings contain one or more antimicrobial metals formed with atomic disorder, together with one or mo... | 04/20/2004 |
| 6700199 | Gold-silver bonding wire for semiconductor device A gold-silver alloy bonding wire for a semiconductor device is provided. The bonding wire contains: a Au-Ag alloy including 5-40% Ag by weight in Au having a purity of 99.999% or greater; at least one element of a first group consisting of Pd, Rh, Pt, and... | 03/02/2004 |
| 6663728 | Gold-free platinum material dispersion-strengthened by small, finely dispersed particles of base metal oxide A gold-free platinum material that is dispersion-strengthened by small, finely dispersed particles of base metal oxide. The base metal is either 0.01-0.5 wt. % Sc or a mixture/alloy of Sc and at least one metal from the group consisting of Zr, Y, and Ce w... | 12/16/2003 |
| 6562158 | Heat-treatable platinum-gallium-palladium alloy for jewelry A method of making jewelry comprising formulating a platinum alloy of at least 95 weight percent platinum, 1 to 5 weight gallium and palladium in an amount of less than about 3 weight percent, heat treating this alloy to increase the Vickers hardness by a... | 05/13/2003 |
| 6531039 | Anode for plating a semiconductor wafer An anode for use in electroplating semiconductor wafers, comprising a metal plate formed from a generally continuous casting process that is essentially free of voids or cracks, the casting being thermo-mechanically worked until the anode has an average g... | 03/11/2003 |
| 6413649 | Silver-copper-nickel infiltration brazing filler metal and composites made therefrom The present invention is directed to brazing filler metals that can be used in the infiltration brazing of porous matrix materials without the need for a flux. The brazing filler metals contain two different Group II metals and a third metal of Group 9 an... | 07/02/2002 |
| 6406561 | One-step noble metal-aluminide coatings A "one-step" method of forming diffused noble metal-aluminide coatings with or without minor incorporations of Si, Cr, Mn, Hf, La, and Y, is disclosed. With the inventive method, two or more powdered metals or metal alloys are applied and diffused into th... | 06/18/2002 |
| 6372363 | Method of improving and optimizing the hydrogen permeability of a palladium-copper membrane and novel membranes manufactured thereby Novel heat treatment techniques for improving and optimizing the hydrogen permeability of thin palladium-copper alloy foil membranes and, in particular, Pd/40%Cu alloy membranes.... | 04/16/2002 |
| 6277218 | Probe card treatment method A probe card treatment method, which is applicable on a probe card comprising multiple probe needles, is described. A thermal treatment is conducted on the probe card by placing the probe card in a closed heating device, wherein the temperature of the the... | 08/21/2001 |
| 6248190 | Process of making composite stents with gold alloy cores A body compatible stent is formed of multiple filaments arranged in two sets of oppositely directed helical windings interwoven with one another in a braided configuration. Each of the filaments is a composite including a central core (24) and a case (26)... | 06/19/2001 |
| 6242106 | Fine wire made of a gold alloy, method for its production, and its use A fine wire made of an alloy of gold which contains 0.6 to 2 weight % of nickel, or an alloy of gold which contains 0.1 to 2 weight % of nickel, 0.0001 to 0.1 weight % of alkaline earth metal and/or rare earth metal, and optionally 0.1 to 1.0 weight % of ... | 06/05/2001 |
| 6187119 | Process for the preparation of an alloy of gold and the alloy produced by the process A process for the production of an alloy based on gold, the titer of gold being between 8 and 22 karats, comprises three phases. In the first phase, copper and titanium are subjected to fusion forming a first fused product. In the second phase, the metall... | 02/13/2001 |
| 6176945 | Coating technique Disclosed herein is a method of coating a substrate with a zinc dialkyldithiophosphate (ZDDP) material, comprising the steps of selecting a substrate which is reactive with said ZDDP material; providing an atmosphere containing said ZDDP material at a pre... | 01/23/2001 |
| 6129997 | Method for manufacturing a welded shaped body dispersion-hardened platinum material A method is provided for manufacturing a welded shaped body of platinum material dispersion-hardened by finely divided small particles of base metal oxide, especially such a body provided with at least one inside wall, such as a tube. The base metal oxide... | 10/10/2000 |
| 6103028 | Method of fabricating thinned free-standing metallic hydrogen-selective palladium-bearing membranes and novel pin-hole-free membranes formed thereby A new method of creating thin free-standing pin hole-free hydrogen-selective palladium-bearing membranes that comprises thinning cold-rolled membranes by chemical etching or electrochemically electrolyzing of at least one membrane surface, and novel membr... | 08/15/2000 |
| 6077366 | Process for producing a high-purity hard gold alloy A process for producing a hard high purity gold alloy comprising (a) casting a high purity gold alloy consisting essentially of from 50 to 3000 ppm Gd and balance being gold, the gold having a purity of at least 99.7%, (b) solution treating the alloy at a... | 06/20/2000 |
| 6063213 | High-purity hard gold alloy and method of manufacturing same A method of manufacturing a high-purity gold alloy for making an electronic member, a dental member or a decorative member. The method includes subjecting a high-purity gold alloy having a Gd content of 1 to 49.9 ppm contained in 99.98 weight % or more go... | 05/16/2000 |
| 6045635 | High-purity hardened gold alloy and a process of producing the same A high-purity hard gold alloy containing 50 ppm or more of Gd and one or more of other additional elements in Au having a purity of 99.7% by weight or more, such that a total content of the additional elements is 100 to 3000 ppm. The high-purity gold allo... | 04/04/2000 |
| 6036741 | Process for producing high-purity ruthenium A process comprises forming ruthenium tetroxide by blowing ozone-containing gas into crude ruthenium powder while hypochlorous acid is being added to the powder, allowing a hydrochloric acid solution to absorb the ruthenium tetroxide, evaporating the solu... | 03/14/2000 |
| 6024807 | Process for manufacturing an electrode for an electrochemical device The present invention aims at improving the catalytic activity of the metallic platinum deposited on the substrate of the counterelectrode (i.e., the cathode), so as to obtain a high value of the catalytic activity on the reduction reaction of triiodide t... | 02/15/2000 |
| 5961753 | Enhancement of mechanical properties for selective platinum group metal alloy systems by age hardening A method for increasing the toughness of a platinum-based binary alloy system through heat treatment. An additional embodiment concerns a method whereby the material is first annealed and then heated appropriately to achieve an increase in tensile strengt... | 10/05/1999 |
| 5846352 | Heat treatment of a platinum-gallium alloy for jewelry A platinum alloy containing 1 to 9 percent gallium and minor amounts of property enhancing additives, eg. up to 3% Pd. This alloy can be heat-treated to a Vickers hardness that is increased by at least over 25% beyond its initial, untreated value and typi... | 12/08/1998 |
| 5837068 | Magnetoresistance effect material, process for producing the same, and magnetoresistive element A bulk magnetoresistance effect material of a composition represented by the general formula: T100-A MA (wherein T is at least one element selected between Cu and Au; M is at least one element selected from the group consisting of Co... | 11/17/1998 |
| 5635131 | Palladium white gold alloy ring settings and method of making same A ring setting is made from a nickel-free palladium white gold alloy that contains 7-12% by weight palladium; 50-65% by weight gold; 25-32% by weight silver; and 1-5% by weight zinc. Such ring settings are resistant to chemical or stress corrosion crackin... | 06/03/1997 |
| 5578177 | Method of manufacturing fully annealed metal anodes Methods of manufacturing fully annealed metal anodes are disclosed. The methods contemplate supplying metal and heating the metal until it has obtained a molten state. The molten metal is permitted to flow into a die and transported therethrough where it ... | 11/26/1996 |
| 5503691 | The aesthetic enhancement or modification of articles or components made of non-ferrous metals A method of enhancing the appearance of a polished surface of an artifact is provided in which the artifact is formed from a non-ferrous alloy, in particular, but not exclusively, a precious metal alloy, chosen to exhibit a martensitic and a parent phase ... | 04/02/1996 |
| 5422065 | Silver-based contact material for use in power-engineering switchgear, and a method of manufacturing contacts made of this material The contact material in particular for contacts in low-voltage switches consists of silver and further active components. In accordance with the invention, iron (Fe) in proportions of between 1 and 50% by weight and rhenium (Re) in proportions of between ... | 06/06/1995 |
| 5358585 | Process of producing silver-or silver-copper alloy-metal oxide composite material A silver-metal oxide composite material comprising a silver matrix or silver-copper alloy matrix containing 50% by weight or less of copper, (a) from 0.5 to 25% by weight, in terms of elemental metal, of an oxide of at least one element selected from the ... | 10/25/1994 |
