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| Number | Title | Issue Date |
| 8070893 | Cu—Ni—Si—Co—Cr copper alloy for electronic materials and method for manufacturing same The invention provides Cu—Ni—Si—Co—Cr copper alloys for electronic materials having excellent characteristics such as dramatically improved strength and electrical conductivity. In one aspect, the invention is a Cu—Ni—Si—Co—Cr copper alloy for electr... | 12/06/2011 |
| 7947133 | Copper alloy strip material for electrical/electronic equipment and process for producing the same A copper alloy strip material for electrical/electronic equipment includes a copper alloy containing 2.0 to 5.0 mass % Ni, 0.43 to 1.5 mass % Si, and a remaining component formed of Cu and an unavoidable impurity. Three types of intermetallic compounds A, B, and C c... | 05/24/2011 |
| 7628873 | Beryllium copper alloy and method of manufacturing beryllium copper alloy A beryllium copper alloy is provided, having a thickness “t” in a range from 0.05 mm to 0.5 mm and having an alloy composition consisting by weight (or mass %), of Cu100−(a+b)NiaBeb, wherein 1.0≦a≦2.0, 0.15≦b≦0.35, and ... | 12/08/2009 |
| 7507305 | Wear-resistant copper-based alloy This aims to provide a wear-resistant copper-based alloy, which is advantages in not only enhancing wear resistance in a high temperature range but also enhancing crack resistance and machinability and which is especially suitable for forming a cladding layer. The w... | 03/24/2009 |
| 7431881 | Wear-resistant alloys particularly suited to aluminum-engine head-valve seats A thermally conductive, wear-resistant alloy is particularly suited to cladding aluminum engine head valve seats. In the preferred embodiments, the alloys are metallurgically compatible with the cast Al—Si alloy used for the engine head. Three alternative embodime... | 10/07/2008 |
| 7413619 | Copper alloy Raw materials for a copper alloy are melted in a high frequency smelter and cast, and milling, rolling, and annealing are carried out. Then, rolling is again carried out. Thereafter, the materials are heated at a temperature of 900° C. for one minute and are quench... | 08/19/2008 |
| 7360437 | Devices for evaluating material properties, and related processes A device for measuring at least one property of a material sample is disclosed. The device includes at least one sensor element which is formed by a direct-write technique. The device can be an instrument for measuring strain in the sample, or for measuring other pr... | 04/22/2008 |
| 7338631 | Copper alloy and method of manufacturing the same This copper alloy contains at least zirconium in an amount of not less than 0.005% by weight and not greater than 0.5% by weight, includes a first grain group including grains having a grain size of not greater than 1.5 μm, a second grain group including grains hav... | 03/04/2008 |
| 7291231 | Copper-nickel-silicon two phase quench substrate A copper-nickel-silicon quench substrate rapidly solidifies molten alloy into microcrystalline or amorphous strip. The substrate is composed of a thermally conducting alloy. It has a two-phase microstructure with copper rich regions surrounded by a discontinuous net... | 11/06/2007 |
| 7259460 | Wire bonding on thinned portions of a lead-frame configured for use in a micro-array integrated circuit package Aspects of the invention recite wire bonding on thinned portions of a lead-frame that is configured for use in an IC package. A harder lead-frame material, improved adhesive tape, and various structural features of the lead-frame itself, in various combinations or s... | 08/21/2007 |
| 7240973 | Crawler, crawler pin, crawler bush, and crawler manufacturing method A crawler having a crawler pin and a crawler bush having lubrication between the crawler pin and the crawler bush without lowering the strength of the crawler at the running time, thereby to prevent the creak or seizure, as might otherwise be caused at the running t... | 07/10/2007 |
| 7226894 | Superconducting wire, method of manufacture thereof and the articles derived therefrom Disclosed herein is method for making a wire comprising contacting a first end of a first superconducting wire with a second end of a second superconducting wire, wherein the superconducting wire comprises a superconducting filament having a superconducting composit... | 06/05/2007 |
| 7182823 | Copper alloy containing cobalt, nickel and silicon A copper alloy having an improved combination of yield strength and electrical conductivity consists essentially of, by weight, from 1% to 2.5% of nickel, from 0.5% to 2.0% of cobalt, from 0.5% to 1.5% of silicon, and the balance is copper and inevitable impurities.... | 02/27/2007 |
| 7029760 | Plated material and method of manufacturing the same, terminal member for connector, and connector A plated material reduces insertion and withdrawal forces when used in a connector. A terminal member for a connector and a connector therewith are also provided. The plated material comprises a substrate 3 made of Cu or a Cu alloy and a metal plating layer | 04/18/2006 |
| 6949150 | Connector copper alloys and a process for producing the same Copper alloy having the basic composition Cu—Zn—Sn contains 23-28 wt % Zn and 0.3-1.8 wt % Sn and satisfies the relation 6.0≦0.25X+Y≦8.5 (where X is the addition of Zn in wt % and Y is the addition of Sn in wt %). The alloy is cast into an ingot by melting a... | 09/27/2005 |
| 6946039 | Physical vapor deposition targets, and methods of fabricating metallic materials The invention includes a physical vapor deposition target composed of a face centered cubic unit cell metal or alloy and having a uniform grain size less than 30 microns, preferably less than 1 micron; and a uniform axial or planar texture. Also described is a... | 09/20/2005 |
| 6926779 | Lead-free copper-based coatings with bismuth for swashplate compressors A surface of aluminum alloy or iron alloy coated, on at least a part, with a lead-free copper-based coating layer comprising, by weight, 0.2–15% bismuth, and at least one metal selected from the group consisting of 5–40% nickel, 1–20% chromium, 1–20% iron, a... | 08/09/2005 |
| 6908691 | Metal strip for epitaxial coatings and method for the production thereof The aim of the invention is to provide a metal strip for epitaxial coating with a biaxially textured layer, this metal strip, however, being able to be produced in an uncomplicated manner and having a high tensile strength, low magnetic losses and/or a high electric... | 06/21/2005 |
| 6896748 | Ultrafine-grain-copper-base sputter targets The sputter target has a composition selected from the group consisting of high-purity copper and copper-base alloys. The sputter target's grain structure is at least about 99 percent recrystallized; and the sputter target's face has a grain orientation ratio of at ... | 05/24/2005 |
| 6881281 | High-strength, high conductivity copper alloy excellent in fatigue and intermediate temperature properties The present invention provides a Cu—Cr—Zr alloy material excellent in fatigue and intermediate temperature characteristics, which comprises 0.05 to 1.0% by mass of Cr and 0.05 to 0.25% by mass of Zr with a balance of Cu and inevitable impurities. The alloy compr... | 04/19/2005 |
| 6866818 | Method of using a spray formed copper-nickel-manganese alloy A method for the manufacture of tools and components for the offshore field and the mining industry, in particular, for drilling installations, using a spray formed Cu—Ni—Mn alloy of 10 to 25% Ni, 10 to 25% Mn, the remainder being copper and common impurities. D... | 03/15/2005 |
| 6811623 | Copper-nickel-manganese alloy, products made therefrom and method of manufacture of products therefrom A Cu-Ni-Mn alloy which consists of 15 to 25% Ni; 15 to 25% Mn; 0.001 to 1.0% of a chip-breaking additive (lead, carbon, etc.), the remainder being copper and common impurities. The alloy can preferably be used as a replacement material for Be-containing copper mater... | 11/02/2004 |
| 6790297 | Retainer A brass is a base material, and a material containing Mn and Si is cast to make a ring material. Ametallic structure in the cross section of the ring material is under a condition where an intermetallic compound Mn5Si3 is uniformly and finely s... | 09/14/2004 |
| 6783611 | Phosphorized copper anode for electroplating A phosphorized copper anode used for electroplating, including: 20-800 ppm of phosphorus; between 0.1 and less than 2 ppm of oxygen, and the balance being high purity copper having a purity of 99.9999% by mass or higher, wherein the average grain size of the copper ... | 08/31/2004 |
| 6764556 | Copper-nickel-silicon two phase quench substrate A copper-nickel-silicon quench substrate rapidly solidifies molten alloy into microcrystalline or amorphous strip. The substrate is composed of a thermally conducting alloy. It has a two-phase microstructure with copper rich regions surrounded by a network of nickel... | 07/20/2004 |
| 6716541 | Material for a metal strip The material for a metal strip for manufacturing electrical contact component parts has, expressed in percent by weight, the following composition: | 04/06/2004 |
| 6699337 | Copper-base alloys having improved punching properties on press and a process for producing them An ingot of a copper-base alloy containing a total of 0.01-30 wt % of at least one element selected from among Sn, Ni, P, Zn, Si, Fe, Co, Mg, Ti, Cr, Zr and Al, with the balance being Cu and incidental impurities, is homogenized by annealing, subjected to... | 03/02/2004 |
| 6679955 | Copper base alloy casting, and methods for producing casting and forging employing copper base alloy casting In the present invention, forming is carried out by employing casting to rapidly solidify molten material comprising a copper base alloy containing 3 to 20% Ag (mass % hereinafter), 0.5 to 1.5% Cr and 0.05 to 0.5% Zr. Next, an aging treatment for precipit... | 01/20/2004 |
| 6605371 | Brazing alloy for stainless steel, structure braze-assembled with the brazing alloy, and brazing material for stainless steel A brazing alloy according to the present invention has a melting point equivalent to that of a copper brazing filler and is excellent in corrosion- and oxidation-resistance. The brazing alloy consists essentially of Mn, Ni and Cu, and has a composition in... | 08/12/2003 |
| 6602362 | Copper-alloy foil to be used for suspension member of hard-disc drive Conductors, which are formed on a suspension member of the hard-disc drive suspension, are subject to thermal expansion and shrinkage during the laminating process with a substrate via a polyimide binder. The tracking width of the suspension member is inf... | 08/05/2003 |
| 6585833 | Crimpable electrical connector An electrical connector made from a Be-Cu alloy can be crimped at room temperature without localized annealing of the crimp section first. Sufficient ductility and tensile strength are imparted to the alloy by cold working the alloy, after final solution ... | 07/01/2003 |
| 6565681 | Age-hardenable copper alloy casting molds A method for manufacturing casting molds, in particular continuous casting molds which are used with an electromagnetic rabbling mechanism in the continuous casting of steel, is provided. The method comprises selecting a specified age-hardenable copper al... | 05/20/2003 |
| 6531003 | Abrasion resistant copper alloy, copper alloy powder for build-up cladding, and engine cylinder head A valve seat (2) is formed by build-up cladding by irradiating a laser beam on a copper alloy powder (4) provided in the rim of a port (3) formed in an engine cylinder head (1). The copper alloy powder (4) consists of copper (Cu), 6-9 wt % nickel (Ni), 1-... | 03/11/2003 |
| 6458223 | Alloy materials An alloy that contains at least two metals and can be used as a substrate for a superconductor is disclosed. The alloy can contain an oxide former. The alloy can have a biaxial or cube texture. The substrate can be used in a multilayer superconductor, whi... | 10/01/2002 |
| 6428635 | Substrates for superconductors An alloy capable of forming a (100) [001] cube-texture by thermo-mechanical techniques has 5 to 45 atomic percent nickel with the balance being copper. The alloy is useful as a conductive substrate for superconducting composites where the substrate is coa... | 08/06/2002 |
| 6391163 | Method of enhancing hardness of sputter deposited copper films The present invention provides a method and apparatus for forming a copper layer on a substrate, preferably using a sputtering process. The sputtering process involves bombarding a conductive member of enhanced hardness with ions to dislodge the copper fr... | 05/21/2002 |
| 6348114 | Copper alloy and sliding bearing having improved seizure resistance A sliding bearing having improved seizure resistance has the following structure: (a) A bearing layer (2). It comprises a copper alloy containing in a Cu matrix Ag, Sn, Sb, In, Mn, Fe, Bi, Zn, Ni and/or Cr. (b) A first sub-layer (3) of the bearing layer (2). F... | 02/19/2002 |
| 6334915 | Copper alloy sheet for electronic parts A copper alloy sheet comprises 0.4 to 2.5 wt % of Ni, 0.05 to 0.6 wt % of Si, 0.001 to 0.05 wt % of Mg, and the balance being Cu and inevitable impurities wherein an average grain size in the sheet is in the range of 3 to 20 μm and a size of an intermeta... | 01/01/2002 |
| 6254702 | Copper base alloys and terminals using the same A copper alloy for terminals of the Cu--Ni--Sn--P system or Cu--Ni--Sn--P--Zn system and that has a tensile strength of at least 500 N/mm2, a spring limit of at least 400 N/mm2, a stress relaxation of no more than 10%, a conductivity... | 07/03/2001 |
| 6241831 | Copper alloy The present invention relates to copper-magnesium-phosphorous alloys. In a first embodiment, copper-magnesium-phosphorous alloys in accordance with the present invention consist essentially of magnesium in an amount from about 0.01 to about 0.25% by weigh... | 06/05/2001 |
