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| Number | Title | Issue Date |
| 7806996 | Copper-based alloy, and cast ingot and liquid-contacting part each using the alloy A copper-based alloy essentially includes 5.0 to 10.0 wt % of Zn, 2.8 to 5.0 wt % of Sn, 0.4 to 3.0 wt % of Bi, 0 | 10/05/2010 |
| 7776163 | Lead-free free-cutting aluminum brass alloy and its manufacturing method The present invention provides a lead-free free-cutting aluminum brass alloy and its manufacturing method. The alloy comprises: 57.0˜63.0 wt % Cu, 0.3˜0.7 wt % Al, 0.1˜0.5 wt % Bi, 0.2˜0.4 wt % Sn, 0.1˜0.5 wt % Si, 0.01˜0.15 wt % P, at least two elements selec... | 08/17/2010 |
| 7740721 | Copper alloy sputtering target process for producing the same and semiconductor element wiring Provided is a copper alloy sputtering target containing 0.01 to (less than) 0.5 wt % of at least 1 element selected from Al or Sn, and containing Mn or Si in a total amount of 0.25 wtppm or less. The above copper alloy sputtering target allows the formation of a wir... | 06/22/2010 |
| 7695578 | Bronze alloy, and ingot and liquid-contacting part using the alloy A copper-based alloy that has the soundness of alloy enhanced by restraining the concentrated occurrence of microporosities while suppressing the lead content and an ingot and a liquid-contacting part using the alloy are provided. The copper-based alloy has the soun... | 04/13/2010 |
| 7608157 | Heat resistance copper alloy materials The present invention discloses a heat resistance copper alloy material characterized in that said copper alloy material comprises 0.15 to 0.33 mass percent of Co, 0.041 to 0.089 mass percent of P, 0.02 to 0.25 mass percent of Sn, 0.01 to 0.40 mass percent of Zn and... | 10/27/2009 |
| 7351372 | Copper base alloy and method for producing same As a raw material of a copper base alloy containing at least one of 0.2 to 12 wt % of tin and 8 to 45 wt % of zinc, at least one of a copper base alloy having a large surface area and containing carbon on the surface thereof, a copper base alloy having a liquidus li... | 04/01/2008 |
| 7338631 | Copper alloy and method of manufacturing the same This copper alloy contains at least zirconium in an amount of not less than 0.005% by weight and not greater than 0.5% by weight, includes a first grain group including grains having a grain size of not greater than 1.5 μm, a second grain group including grains hav... | 03/04/2008 |
| 7337660 | Method and system for reservoir characterization in connection with drilling operations A method for analyzing reservoir fluids in connection with a drilling operation includes determining composition and isotopes of injection fluids injected into a wellbore during a drilling operation and production fluids recovered from the wellbore during the drilli... | 03/04/2008 |
| 7297215 | Copper base alloy, and cast ingot and parts to be contacted with liquid By exactly comprehending the true properties of the rare elements (such as Bi and Se) which are alternative components for Pb, the alloy is enabled to secure machinability equal to the bronze alloy (CAC406) generally used hitherto and acquire mechanical properties a... | 11/20/2007 |
| 7291231 | Copper-nickel-silicon two phase quench substrate A copper-nickel-silicon quench substrate rapidly solidifies molten alloy into microcrystalline or amorphous strip. The substrate is composed of a thermally conducting alloy. It has a two-phase microstructure with copper rich regions surrounded by a discontinuous net... | 11/06/2007 |
| 7237422 | Method of drawing a composite wire An apparatus and method is disclosed for drawing continuous metallic wire having a first diameter to a metallic fiber having a reduced second diameter. A feed mechanism moves the wire at a first linear velocity. A laser beam heats a region of the wire to an elevated... | 07/03/2007 |
| 7182823 | Copper alloy containing cobalt, nickel and silicon A copper alloy having an improved combination of yield strength and electrical conductivity consists essentially of, by weight, from 1% to 2.5% of nickel, from 0.5% to 2.0% of cobalt, from 0.5% to 1.5% of silicon, and the balance is copper and inevitable impurities.... | 02/27/2007 |
| 7172662 | Copper alloy material for parts of electronic and electric machinery and tools A copper alloy material for parts of electronic and electric machinery and tools contains 1.0 to 3.0 mass % of Ni, 0.2 to 0.7 mass % of Si, 0.01 to 0.2 mass of Mg, 0.05 to 1.5 mass % of Sn, 0.2 to 1.5 mass % of Zn, and less than 0.005 mass % (including 0 mass %) of ... | 02/06/2007 |
| 7160401 | Use of a low-alloyed copper alloy and hollow profile component made therefrom Use of a low-alloyed, phosphorus-deoxidized copper alloy (DHP-Cu) for manufacturing hollow profile components by internal high-pressure forming, the copper alloy having the following composition: 0.030 to 0.080 wt-% of at least one element of a group including tin (... | 01/09/2007 |
| 7153375 | Precious metal solder Platinum, silver and gold solder compositions for repairing, assembling, or sizing jewelry. Platinum compositions having about 90% to about 95% by weight platinum. Silver compositions having at least 92.5% by weight silver. Gold solder compositions having about 25% ... | 12/26/2006 |
| 7140728 | Method of forming magnetic eyeglass appliance An eyeglass accessory frame includes an auxiliary frame. The auxiliary frame includes a heat-treated magnetic alloy. The heat-treated magnetic alloy of the auxiliary frame is configured to magnetically couple the auxiliary frame to a primary frame having magnetizabl... | 11/28/2006 |
| 7090732 | High-mechanical strength copper alloy A high-mechanical strength copper alloy, which comprises Ni 1.0 to 4.5% by mass, Si 0.2 to 1.0% by mass, Mg 0.01 to 0.20% by mass, Sn 0.05 to 1.5% by mass, Zn 0.2 to 1.5% by mass, and S less than 0.005% by mass (including 0% by mass), with the balance being made of ... | 08/15/2006 |
| 7084509 | Electronic package with filled blinds vias The density of electronic packaging and the electrical reliability of the sub-assemblies utilizing stacked blind vias are improved by providing a blind, landless via in a first dielectric layer laminated to a conductive metal core serving as a ground plane or a powe... | 08/01/2006 |
| 7078107 | Contact material, composite sintered component and method of producing same A contact material which provides improved wear resistance as well as reduced adhesion utilizing the features of an intermetallic compound having an ordered phase, with the intention of (i) improving the seizure resistance and/or wear resistance of an implement bear... | 07/18/2006 |
| 6974509 | Brass Brass consists essentially of Cu, Sn, Bi, Fe, Ni and P in weight ratios respectively of 58.0-63.2%, 0.3-2.0%, 0.7-2.5%, 0.05-0.3%, 0.10-0.50% and 0.05-0.15% plus the balance of Zn and unavoidable impurities to exhibit excellent tolerance for dezincification, hot for... | 12/13/2005 |
| 6949150 | Connector copper alloys and a process for producing the same Copper alloy having the basic composition Cu—Zn—Sn contains 23-28 wt % Zn and 0.3-1.8 wt % Sn and satisfies the relation 6.0≦0.25X+Y≦8.5 (where X is the addition of Zn in wt % and Y is the addition of Sn in wt %). The alloy is cast into an ingot by melting a... | 09/27/2005 |
| 6946039 | Physical vapor deposition targets, and methods of fabricating metallic materials The invention includes a physical vapor deposition target composed of a face centered cubic unit cell metal or alloy and having a uniform grain size less than 30 microns, preferably less than 1 micron; and a uniform axial or planar texture. Also described is a... | 09/20/2005 |
| 6942742 | Copper-based alloy excellent in dezincing resistance A copper-based alloy excellent in dezincing resistance comprises, in percentage by weight, Cu: 57-69%, Sn: 0.3-3%, Si: 0.02-1.5%, Bi: 0.5-3%, and Pb: not more than 0.2%, where the ratio of Si/Sn expressed in weight percentage is in the range of 0.05-1 and apparent z... | 09/13/2005 |
| 6896748 | Ultrafine-grain-copper-base sputter targets The sputter target has a composition selected from the group consisting of high-purity copper and copper-base alloys. The sputter target's grain structure is at least about 99 percent recrystallized; and the sputter target's face has a grain orientation ratio of at ... | 05/24/2005 |
| 6893514 | High-mechanical strength copper alloy A high-mechanical strength copper alloy, which comprises Ni 3.5 to 4.5% by mass, Si 0.7 to 1.0% by mass, Mg 0.01 to 0.20% by mass, Sn 0.05 to 1.5% by mass, Zn 0.2 to 1.5% by mass, and S less than 0.005% by mass (including 0% by mass), with the balance being made of ... | 05/17/2005 |
| 6881281 | High-strength, high conductivity copper alloy excellent in fatigue and intermediate temperature properties The present invention provides a Cu—Cr—Zr alloy material excellent in fatigue and intermediate temperature characteristics, which comprises 0.05 to 1.0% by mass of Cr and 0.05 to 0.25% by mass of Zr with a balance of Cu and inevitable impurities. The alloy compr... | 04/19/2005 |
| 6863746 | White gold compositions without nickel and palladium The present invention discloses a white gold composition consisting essentially of copper, silver, zinc, and manganese, and further consisting of small amounts of tin, cobalt, silicon/copper and boron/copper. More particularly, the white gold composition of the pres... | 03/08/2005 |
| 6858102 | Copper-containing sputtering targets, and methods of forming copper-containing sputtering targets The invention includes a sputtering target containing copper of a purity of at least about 99.999 wt. %, and at least one component selected from the group consisting of Ag, Sn, Te, In, B, Bi, Sb, and P dispersed within the copper. The total of Ag, Sn, Te, In, B, Bi... | 02/22/2005 |
| 6790297 | Retainer A brass is a base material, and a material containing Mn and Si is cast to make a ring material. Ametallic structure in the cross section of the ring material is under a condition where an intermetallic compound Mn5Si3 is uniformly and finely s... | 09/14/2004 |
| 6783611 | Phosphorized copper anode for electroplating A phosphorized copper anode used for electroplating, including: 20-800 ppm of phosphorus; between 0.1 and less than 2 ppm of oxygen, and the balance being high purity copper having a purity of 99.9999% by mass or higher, wherein the average grain size of the copper ... | 08/31/2004 |
| 6749699 | Silver containing copper alloy A copper alloy that consists essentially of, by weight, from 0.15% to 0.7% of chromium, from 0.005% to 0.3% of silver, from 0.01% to 0.15% of titanium, from 0.01% to 0.10% of silicon, up to 0.2% of iron, up to 0.5% of tin, and the balance copper and inevitable impur... | 06/15/2004 |
| 6716541 | Material for a metal strip The material for a metal strip for manufacturing electrical contact component parts has, expressed in percent by weight, the following composition: | 04/06/2004 |
| 6716292 | Unwrought continuous cast copper-nickel-tin spinodal alloy An unwrought continuous cast Cu—Ni—Sn spinodal alloy and a method for producing the same is disclosed. The Cu—Ni—Sn spinodal alloy is characterized by an absence of discontinuous γ′ phase precipitate at the grain boundaries, ductile fracture behavior duri... | 04/06/2004 |
| 6699337 | Copper-base alloys having improved punching properties on press and a process for producing them An ingot of a copper-base alloy containing a total of 0.01-30 wt % of at least one element selected from among Sn, Ni, P, Zn, Si, Fe, Co, Mg, Ti, Cr, Zr and Al, with the balance being Cu and incidental impurities, is homogenized by annealing, subjected to... | 03/02/2004 |
| 6695934 | Copper alloy and process for obtaining same A copper base alloy consisting essentially of tin in an amount from about 0.1 to about 1.5% by weight, phosphorous in an amount from about 0.01 to about 0.35% by weight, iron in an amount from about 0.01 to about 0.8% by weight, zinc in an amount from abo... | 02/24/2004 |
| 6679955 | Copper base alloy casting, and methods for producing casting and forging employing copper base alloy casting In the present invention, forming is carried out by employing casting to rapidly solidify molten material comprising a copper base alloy containing 3 to 20% Ag (mass % hereinafter), 0.5 to 1.5% Cr and 0.05 to 0.5% Zr. Next, an aging treatment for precipit... | 01/20/2004 |
| 6652675 | Copper alloy sliding material Disclosed is a copper alloy sliding material having a metal structure wherein intermetallic compounds exist adjacently to Pb-phase islands and/or Bi-phase islands. Because intermetallic compounds exist between the matrix and the Pb phase and/or the Bi pha... | 11/25/2003 |
| 6632300 | Copper alloy having improved stress relaxation resistance A copper alloy having improved stress relaxation resistance is formed from a copper base alloy that consists, by weight, essentially of 1.8%-3.0% iron, 0.01%-1.0% zinc, 0.001 %-0.25% phosphorus, 0.1 %-0.35% magnesium and the balance is copper and unavoida... | 10/14/2003 |
| 6627009 | Extrafine copper alloy wire, ultrafine copper alloy wire, and process for producing the same In an extrafine or ultrafine copper alloy wire having an outer diameter of not more than 0.1 mm, the copper alloy wire is formed of a heat treated copper alloy comprising 0.05 to 0.9% by weight in total of at least one metallic element selected from the g... | 09/30/2003 |
| 6482276 | Copper alloy with punchability, and a manufacturing method thereof A copper alloy with excellent punchability, comprising 0.2 to 0.35 wt % of Cr, 0.1 to 0.5 wt % of Sn, and 0.1 to 0.5 wt % of Zn, the balance being made of Cu and unavoidable impurities, wherein, in a Cu matrix, a precipitation phase A of Cr or a Cr compou... | 11/19/2002 |
