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| Number | Title | Issue Date |
| 7883588 | Pb-free bearing used for fuel-injection pump In a Cu—Bi based sintered alloy, to which hard particles, such as Fe3P, are added, the main constituent components of the microstructure are a Cu matrix, Bi phase and the hard particles. In the sintering method of the present invention, the flow of the ... | 02/08/2011 |
| 7819992 | Copper alloy water supply member A member for water works is proposed in which the content of lead is limited to a very small values while maintaining its mechanical properties, castability, machinability, pressure resistance, etc. to levels equivalent to those of conventional copper alloys contain... | 10/26/2010 |
| 7789977 | Rolled copper foil and manufacturing method thereof A rolled copper foil applied with a recrystallization annealing after a final cold rolling step and having a crystal grain alignment satisfying a ratio of [a]/[b]≧3, where [a] and [b] are normalized average intensities of a {111}Cu plane diffraction of ... | 09/07/2010 |
| 7744705 | Group I-III-VI quaternary or higher alloy semiconductor films This invention relates to group IB-IIIA. VIA quaternary or higher alloys. More particularly, this invention relations to group IB-IIIA-VIA quaternary or pentenary alloys which are suitable for use as semiconductor films. More specifically, the invention relates to q... | 06/29/2010 |
| 7736448 | Nano icrystals copper material with super high strength and conductivity and method of preparing thereof The present invention relates to a nanocrystalline metallic material, particularly to nano-twin copper material with ultrahigh strength and high electrical conductivity and its preparation method. High-purity polycrystalline Cu material with a microstructure of roug... | 06/15/2010 |
| 7510615 | Age-hardening copper alloy as material for producing casting molds An age-hardening copper alloy made of—as expressed in each case in weight %—0.4% to a maximum of 2% cobalt which is partially replaceable by nickel, 0.1% through 0.5% beryllium, optionally 0.03% through 0.5% zirconium, 0.005% through 0.1% magnesium and possibly ... | 03/31/2009 |
| 7507304 | Copper alloy sputtering target and semiconductor element wiring Provided is a first copper alloy sputtering target comprising 0.5 to 4.0 wt % of Al and 0.5 wtppm or less of Si; a second copper alloy sputtering target comprising 0.5 to 4.0 wt % of Sn and 0.5 wtppm or less of Mn; the first or the second alloy sputtering target fur... | 03/24/2009 |
| 7422994 | Platinum-copper-tungsten fuel cell catalyst A composition for use as a catalyst in, for example, a fuel cell, the composition comprising platinum, copper and tungsten, or an oxide, carbide and/or salt of one or more of platinum, copper and tungsten, wherein the sum of the concentrations of platinum, copper an... | 09/09/2008 |
| 7404866 | Sliding member and method for manufacture thereof A sliding member includes a superficial portion forming a sliding surface. The superficial portion includes an oxygen-containing alloy containing at least one metallic element selected from the group consisting of molybdenum and tungsten in an amount of from 2 to 80... | 07/29/2008 |
| 7393586 | Highly oxidation-resistant copper powder for conductive paste and process for producing the powder A highly oxidation-resistant copper powder for conductive paste, which is a copper powder containing not more than 5 wt % of Si, is characterized in that substantially all of the Si is adhered to the surfaces of the copper particles as SiO2-system gel coa... | 07/01/2008 |
| 7360488 | Single phase tungsten alloy A single phase metal alloy usually for forming a shaped charge liner for a penetrating jet or explosively formed penetrator forming warhead consists essentially of from a trace to 90%, by weight, of cobalt, from 10% to 50% by weight, of tungsten, and the balance nic... | 04/22/2008 |
| 7338631 | Copper alloy and method of manufacturing the same This copper alloy contains at least zirconium in an amount of not less than 0.005% by weight and not greater than 0.5% by weight, includes a first grain group including grains having a grain size of not greater than 1.5 μm, a second grain group including grains hav... | 03/04/2008 |
| 7278353 | Reactive shaped charges and thermal spray methods of making same Shaped charge liners are made of reactive materials formed by thermal spray techniques. The thermally sprayed reactive shaped charge materials have low porosity and high structural integrity. Upon detonation, the reactive materials of the shaped charge liner undergo... | 10/09/2007 |
| 7268413 | Bipolar transistors with low-resistance emitter contacts Many integrated circuits include a type of transistor known as a bipolar junction transistor, which has an emitter contact formed of polysilicon. Unfortunately, polysilicon has a relatively high electrical resistance that poses an obstacle to improving switching spe... | 09/11/2007 |
| 7261760 | Member having separation structure and method for manufacture thereof A member having a separated structure made by an alloy consisting of two regions having different compositions with each other is formed by casting a molten alloy into a prescribed shape, or by spray-quenching the same from a temperature of Tc+10° C. or more, where... | 08/28/2007 |
| 7210411 | 4.6 mm small arms ammunition A round of ammunition for firing from a gun having a rifled barrel, especially a small arms weapon. The projectile (1) forming a part of the round is of steel or other material having a Vickers Hardness value not less than 550, and has a coating (13) o... | 05/01/2007 |
| 7163753 | Arc-resistant terminal, arc-resistant terminal couple and connector or the like for automobile An arc-resistant terminal, couple, and connecter are provided. In an embodiment, a metal-based electrical contact portion thereof includes at least one of Cu, Ni or Sn, and not more than 0.06 mass % P, wherein the arc-resistant terminal capable of suppressing arc di... | 01/16/2007 |
| 7161807 | Heat spreader module A heat spreader module includes a base, a heat spreader member arranged on the base, a thermal conductive layer arranged on the heat spreader member, a first joining member interposed between the base and the heat spreader member, and a second joining member interpo... | 01/09/2007 |
| 7161246 | Interconnect alloys and methods and apparatus using same Integrated circuit interconnect alloys having copper, silver or gold as the major constituent element. The resulting reduction in melting temperature allows for improved coverage of high aspect ratio features with reduced deposition pressure. The alloys are used to ... | 01/09/2007 |
| 6949150 | Connector copper alloys and a process for producing the same Copper alloy having the basic composition Cu—Zn—Sn contains 23-28 wt % Zn and 0.3-1.8 wt % Sn and satisfies the relation 6.0≦0.25X+Y≦8.5 (where X is the addition of Zn in wt % and Y is the addition of Sn in wt %). The alloy is cast into an ingot by melting a... | 09/27/2005 |
| 6946039 | Physical vapor deposition targets, and methods of fabricating metallic materials The invention includes a physical vapor deposition target composed of a face centered cubic unit cell metal or alloy and having a uniform grain size less than 30 microns, preferably less than 1 micron; and a uniform axial or planar texture. Also described is a... | 09/20/2005 |
| 6932938 | Method and apparatus for containing and ejecting a thixotropic metal slurry A container system including a vessel for holding a thixotropic semi-solid aluminum alloy slurry during its processing as a billet and an ejection system for cleanly discharging the processed thixotropic semi-solid aluminum billet. The crucible is preferably formed ... | 08/23/2005 |
| 6929726 | Sputtering target, Al interconnection film, and electronic component A sputtering target consists essentially of 0.1 to 50% by weight of at least one kind of element that forms an intermetallic compound with Al, and the balance of Al. The element that forms an intermetallic compound with Al is uniformly dispersed in the target textur... | 08/16/2005 |
| 6926779 | Lead-free copper-based coatings with bismuth for swashplate compressors A surface of aluminum alloy or iron alloy coated, on at least a part, with a lead-free copper-based coating layer comprising, by weight, 0.2–15% bismuth, and at least one metal selected from the group consisting of 5–40% nickel, 1–20% chromium, 1–20% iron, a... | 08/09/2005 |
| 6908691 | Metal strip for epitaxial coatings and method for the production thereof The aim of the invention is to provide a metal strip for epitaxial coating with a biaxially textured layer, this metal strip, however, being able to be produced in an uncomplicated manner and having a high tensile strength, low magnetic losses and/or a high electric... | 06/21/2005 |
| 6896748 | Ultrafine-grain-copper-base sputter targets The sputter target has a composition selected from the group consisting of high-purity copper and copper-base alloys. The sputter target's grain structure is at least about 99 percent recrystallized; and the sputter target's face has a grain orientation ratio of at ... | 05/24/2005 |
| 6881281 | High-strength, high conductivity copper alloy excellent in fatigue and intermediate temperature properties The present invention provides a Cu—Cr—Zr alloy material excellent in fatigue and intermediate temperature characteristics, which comprises 0.05 to 1.0% by mass of Cr and 0.05 to 0.25% by mass of Zr with a balance of Cu and inevitable impurities. The alloy compr... | 04/19/2005 |
| 6858102 | Copper-containing sputtering targets, and methods of forming copper-containing sputtering targets The invention includes a sputtering target containing copper of a purity of at least about 99.999 wt. %, and at least one component selected from the group consisting of Ag, Sn, Te, In, B, Bi, Sb, and P dispersed within the copper. The total of Ag, Sn, Te, In, B, Bi... | 02/22/2005 |
| 6800151 | Method of modifying properties of high-strength, high-conductivity Cu-Ag alloy plate, and method of producing high-strength, high conductivity Cu-Ag alloy plate The present invention provides a method of modifying conductivity- and strength-related properties of a Cu—Ag alloy plate produced by predetermined annealing and cold rolling, composed of 4 to 32% by atom of Ag and Cu accounting for the balance, wherein the plate ... | 10/05/2004 |
| 6797079 | Physical vapor deposition target A physical vapor deposition target includes an alloy of copper and silver, with the silver being present in the alloy at from less than 1.0 at % to 0.001 at %. In one implementation, a physical vapor deposition target includes an alloy of copper and silver, with the... | 09/28/2004 |
| 6790297 | Retainer A brass is a base material, and a material containing Mn and Si is cast to make a ring material. Ametallic structure in the cross section of the ring material is under a condition where an intermetallic compound Mn5Si3 is uniformly and finely s... | 09/14/2004 |
| 6783611 | Phosphorized copper anode for electroplating A phosphorized copper anode used for electroplating, including: 20-800 ppm of phosphorus; between 0.1 and less than 2 ppm of oxygen, and the balance being high purity copper having a purity of 99.9999% by mass or higher, wherein the average grain size of the copper ... | 08/31/2004 |
| 6758920 | Conductive integrated circuit metal alloy interconnections, electroplating anodes; metal alloys for use as a conductive interconnection in an integrated circuit; and physical vapor deposition targets A physical vapor deposition target includes an alloy of copper and silver, with the silver being present in the alloy at from less than 1.0 at % to 0.001 at %. In one implementation, a physical vapor deposition target includes an alloy of copper and silver, with the... | 07/06/2004 |
| 6749699 | Silver containing copper alloy A copper alloy that consists essentially of, by weight, from 0.15% to 0.7% of chromium, from 0.005% to 0.3% of silver, from 0.01% to 0.15% of titanium, from 0.01% to 0.10% of silicon, up to 0.2% of iron, up to 0.5% of tin, and the balance copper and inevitable impur... | 06/15/2004 |
| 6736947 | Sputtering target, A1 interconnection film, and electronic component A sputtering target consists essentially of 0.1 to 50% by weight of at least one kind of element that forms an intermetallic compound with Al, and the balance of Al. The element that forms an intermetallic compound with Al is uniformly dispersed in the target textur... | 05/18/2004 |
| 6722002 | Method of producing Ti brazing strips or foils A method for producing titanium alloy brazing strips and the resulting brazing strips and/or foils. The method uses a cold-rolling process without annealing to generate a titanium based multi-layer alloy strip or foil made up of discrete layers of titanium and an ad... | 04/20/2004 |
| 6716541 | Material for a metal strip The material for a metal strip for manufacturing electrical contact component parts has, expressed in percent by weight, the following composition: | 04/06/2004 |
| 6699337 | Copper-base alloys having improved punching properties on press and a process for producing them An ingot of a copper-base alloy containing a total of 0.01-30 wt % of at least one element selected from among Sn, Ni, P, Zn, Si, Fe, Co, Mg, Ti, Cr, Zr and Al, with the balance being Cu and incidental impurities, is homogenized by annealing, subjected to... | 03/02/2004 |
| 6679955 | Copper base alloy casting, and methods for producing casting and forging employing copper base alloy casting In the present invention, forming is carried out by employing casting to rapidly solidify molten material comprising a copper base alloy containing 3 to 20% Ag (mass % hereinafter), 0.5 to 1.5% Cr and 0.05 to 0.5% Zr. Next, an aging treatment for precipit... | 01/20/2004 |
| 6677527 | Connection member Connection member made of metal for electrical connection between at least two electric power distribution modules, such as power plant equipment cabinets (2) or the like, which member (1) comprises at least a first and a second joining end portion (7, 8)... | 01/13/2004 |
