Celebrity Inventors
Mark Twain (Samuel L. Clemens) received Patent No. 121,992 for "An Improvement in Adjustable and Detachable Straps for Garments." He later received two more patents: one for a self-pasting scrapbook and one for a game to help players remember important historical dates.
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| Number | Title | Issue Date |
| 7329617 | Coating for enhancing adhesion of molding compound to semiconductor devices A method is provided for enhancing adhesion between a molding compound and a semiconductor device comprising a semiconductor chip attached on a carrier, such as a lead frame, by coating the semiconductor device with a polymer primer prior to molding the semiconducto... | 02/12/2008 |
| 7235487 | Metal seed layer deposition A method and structure for reducing the corrosion of the copper seed layer during the fabrication process of a semiconductor structure. Before the structure (or the wafer containing the structure) exits the vacuum environment of the sputter tool, the structure is wa... | 06/26/2007 |
| 7232528 | Surface treatment agent for copper and copper alloy The surface treatment agent for copper and copper alloys contains hydrogen peroxide, a mineral acid, an azole compound, silver ion and a halide ion. The surface treatment agent for copper and copper alloys is useful in the production of printed wiring boards in elec... | 06/19/2007 |
| 7232478 | Adhesion promotion in printed circuit boards An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is... | 06/19/2007 |
| 7186305 | Process for improving the adhesion of polymeric materials to metal surfaces A process is described for treating metal surfaces with a composition comprising an oxidizer, an acid, a corrosion inhibitor, an unsaturated alkyl substituted with an aromatic or non-aromatic cyclic groups, and optionally but preferably a source of adhesion enhancin... | 03/06/2007 |
| 7182822 | Metal material with modified surface, preparation method and use of same A metal material whose surface is modified by bonding of aromatic groups, optionally substituted by functional groups. ... | 02/27/2007 |
| 7125750 | Leadframe with enhanced encapsulation adhesion A leadframe having a metallic substrate and comprising layers of plated material, and a method of manufacturing said leadframe are provided. The substrate is plated with a layer of oxidizable material comprising nickel and a noble metal is selectively plated on the ... | 10/24/2006 |
| 7109111 | Method of annealing metal layers A method of annealing a metal layer on a substrate in a chamber is provided. The method comprises positioning a substrate with a metal layer thereon in a chamber, removing atmospheric gases from the chamber, providing process gas to the chamber, and annealing the me... | 09/19/2006 |
| 7041335 | Titanium tantalum nitride silicide layer Methods and apparatus of forming titanium tantalum silicon nitride (TixTay(Si)Nz) layers are described. The titanium tantalum silicon nitride (TixTay(Si)Nz) layer may be formed using a cyclical deposi... | 05/09/2006 |
| 7008825 | Leadframe strip having enhanced testability A method of fabricating a semiconductor package comprising the step of providing a leadframe strip which defines a strip plane and a multiplicity of leadframes. Each of the leadframes includes an outer frame defining a central opening and a die pad disposed within t... | 03/07/2006 |
| 6746547 | Methods and compositions for oxide production on copper The invention features and methods and compositions for oxide production on a Copper substrate, e.g., a Copper or Copper alloy substrate, to provide for improved adhesion of Copper substrate to polymeric material, e.g., such as used in manufacture of printed circuit... | 06/08/2004 |
| 6743303 | Process for treating adhesion promoted metal surfaces with an organo-silcon post-treatment A method for treating a micro-roughened metal surface to improve bonding between the metal surface and a polymer material. The method involves post-treating the micro-roughened conversion coated metal surface with an aqueous organo-silicon wetting composition after ... | 06/01/2004 |
| 6740420 | Substrate having a modified native oxide layer for improved electrical conductivity A method for improving the electrical conductivity of a substrate of metal, metal alloy or metal oxide comprising depositing a small or minor amount of metal or metals from Group VIIIA metals (Fe, Ru, Os, Co, Rh, Ir, Ni, Pd, Pt) or from Group IA metals (Cu, Ag, Au) ... | 05/25/2004 |
| 6679951 | Metal anneal with oxidation prevention The invention relates generally to the prevention of copper oxidation during copper anneal processes. In one aspect of the invention, copper oxidation is prevented by carrying out the anneal in the presence of one or more organic reducing agents.... | 01/20/2004 |
| 6656294 | Method of reducing elution of lead in lead-containing copper alloy, and drinking water service fittings made of lead-containing copper alloy It is an object of the present invention to provide a processing method for preventing elution of lead in a lead-containing copper alloy to prevent lead from eluting from a faucet metal, etc. made of a lead-containing copper alloy, and a drinking water se... | 12/02/2003 |
| 6582531 | X-ray tube and method of manufacture The present invention relates to structures within an x-ray device including an x-ray can, an x-ray can window frame insert, a rotor sleeve, and a bearing support assembly for a rotor structure. The various structures are fabricated from a chromium alloy ... | 06/24/2003 |
| 6562149 | Solution and process to pretreat copper surfaces The invention concerns processes and solutions for the preliminary treatment of copper surfaces which are subsequently to be firmly bonded to organic substrates. The solution is used, in particular, for firmly bonding laminated multilayered printed circui... | 05/13/2003 |
| 6554914 | Passivation of copper in dual damascene metalization The present invention pertains to systems and methods for passivating the copper seed layer deposited in Damascene integrated circuit manufacturing. More specifically, the invention pertains to systems and methods for depositing the copper seed layer by p... | 04/29/2003 |
| 6524644 | Process for selective deposition of OSP coating on copper, excluding deposition on gold A method is provided for the selective deposition of an organic solderability preservative (OSP) coating on copper surfaces of articles such as electronic components, e.g., printed wiring boards, to serve as a protective coating and preserve the solderabi... | 02/25/2003 |
| 6521052 | Surface treatment A simple surface treatment process is provided which offers a high performance surface for a variety of applications at low cost. This novel surface treatment, which is particularly useful for Ti-6Al-4V alloys, is achieved by forming oxides on the surface... | 02/18/2003 |
| 6521114 | Prevention of marine encrustation on bronze propellers From the time that they are immersed into a marine environment, bronze propellers are prone to attack by marine organisms, such as barnacles, coral and algae, which attach themselves to the bronze metallic surface, creating lumps on the propeller, which a... | 02/18/2003 |
| 6503566 | Process for improving the adhesion of polymeric materials to metal surfaces A composition and process are described which are useful in treating metal surfaces, which composition comprises an oxidizer, an acid, a corrosion inhibitor, an organic nitro compound and, optionally, a benzotriazole with an electron withdrawing group in ... | 01/07/2003 |
| 6464901 | Halogen resistant copper corrosion inhibitors Non-halogen substituted, nitrogen containing, aromatic compounds are disclosed which are effective copper corrosion inhibitors in aqueous systems being treated with a halogen biocide. The materials of the present invention exhibit copper corrosion inhibit... | 10/15/2002 |
| 6428629 | Apparatus and method for application of a chemical process on a component surface In accordance with the present invention, an apparatus and method for application of a chemical process on a component surface is provided. In an embodiment for an apparatus for preparing a component surface for application of a chemical process, the appa... | 08/06/2002 |
| 6372055 | Method for replenishing baths Disclosed are methods for replenishing adhesion promoting baths from an unstable state without discarding the bath. Methods of adhesion promoting substrates, such as printed wiring boards, using the replenished baths are also disclosed.... | 04/16/2002 |
| 6336979 | Wear resistant copper base alloy, method of preparing the same and electrical part using the same Wear resistant copper or a wear resistant copper base alloy having formed on the outermost surface thereof an oxide layer having a thickness of 10-1000 nm and a layer of an intermetallic compound primarily comprising Cu--Sn having a thickness of 0.1-10 μ... | 01/08/2002 |
| 6322636 | Method of artificially forming patina on copper A method of artificially forming patina on a copper product surface comprising the steps of blowing granular sodium hydrogen carbonate powder onto the copper product surface to clean and roughen it; wetting the surface with water; and depositing granular ... | 11/27/2001 |
| 6316117 | Stainless steel sheet having Cu-enriched grains dispersed in its matrix and/or a Cu-condensed layer A new stainless steel sheet has a stainless steel substrate which contains Cu at a ratio of 1.0 wt. % or more and has Cu-enriched grains precipitated at a ratio of 0.2 vol. %. The Cu-enriched grains are exposed to the outside through pinholes in a passive... | 11/13/2001 |
| 6312762 | Process for production of copper or copper base alloys A process for the production of copper or a copper base alloy that provides a surface having improved characteristics suitable for the production of a connector or a charging-socket of an electric automobile by having a decreased coefficient of friction o... | 11/06/2001 |
| 6270590 | Low lead release plumbing components made of copper based alloys containing lead, and a method for obtaining the same A method for treating a component made of a copper-based alloy containing lead. The component has Pb and Pb salts on a surface thereof. The method includes the step of etching the surface of the component selectively to remove almost entirely the Pb and P... | 08/07/2001 |
| 6254701 | Copper alloy and sliding bearing having improved seizure resistance A sliding bearing having improved seizure resistance has the following structure. (a) A bearing layer (2). It comprises a copper alloy containing in a Cu matrix Ag, Sn, Sb, In, Mn, Fe, Bi, Zn, Ni and/or Cr. (b) A fisrst sub-layer (3) of the bearing layer (2). ... | 07/03/2001 |
| 6221176 | Surface treatment of copper to prevent microcracking in flexible circuits In one embodiment, the present invention relates to a flexible laminate, comprising a first flexible polymeric film; a copper layer having a microcracking prevention layer on at least one side the microcracking prevention layer sufficient to prevent micro... | 04/24/2001 |
| 6183880 | Composite foil of aluminum and copper This invention provides a composite foil comprising an aluminum carrier layer and an ultra-thin copper foil having a protective layer disposed between them comprising a porous copper layer and an interpenetrating zinc layer. A process for producing such c... | 02/06/2001 |
| 6146701 | Process for improving the adhension of polymeric materials to metal surfaces A process is described for treating metal surfaces with a composition comprising an oxidizer, an acid, a corrosion inhibitor, a source of halide ions, a source of adhesion enhancing ions selected from the group consisting of molybdates, tungstates, tantal... | 11/14/2000 |
| 6103144 | Halogen resistant copper corrosion inhibitors Non-halogen substituted, nitrogen containing, aromatic compounds are disclosed which are effective copper corrosion inhibitors in aqueous systems being treated with a halogen biocide. The materials of the present invention exhibit copper corrosion inhibit... | 08/15/2000 |
| 6103026 | Corrosion-resistant copper materials and making method A corrosion-resistant copper material has a surface layer of a copper alloy containing 10-50 at % (i.e. % by atom) of silicon and of 10-1,000 Å thick. It is produced simply by annealing a copper material containing 0.01-5 at % of silicon at 100-600° C. ... | 08/15/2000 |
| 6045628 | Thin-walled monolithic metal oxide structures made from metals, and methods for manufacturing such structures Monolithic metal oxide structures, and processes for making such structures, are disclosed. The structures are obtained by heating a metal-containing structure having a plurality of surfaces in close proximity to one another in an oxidative atmosphere at ... | 04/04/2000 |
| 6020029 | Process for treating metal surfaces A process for treating metal surfaces that includes first contacting the metal surface with a particular acidic peroxide adhesion promoting composition, followed by contacting that metal surface with an alkaline solution. This treatment is particularly su... | 02/01/2000 |
| 5923771 | Sensor device for counting and determining surface bubble and crack sizes in copper bars during continuous tapping The present invention relates to a device that measures and counts near surface bubbles on a copper bar, as well as the cracks on the lateral sides. The device detects said flaws in real time. The device is based on the image digitalization technique. The... | 07/13/1999 |
| 5919519 | Potable water supply components A method of treating a potable water supply component, for example a pipe, pipe coupling or tap body, made of a leaded copper-based alloy such as a brass or gun metal, in order to inhibit the leach out of lead from the alloy by potable water during servic... | 07/06/1999 |
