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| Number | Title | Issue Date |
| 7337941 | Flux coated brazing sheet A brazing flux mixture comprised of brazing flux, a polyvinyl butyral resin binder, and an organic solvent which can be applied over an entire aluminum alloy brazing sheet, or can be applied on the brazing sheet only where metallurgical bonds or joints are required,... | 03/04/2008 |
| 7331500 | Solder bumps formation using solder paste with shape retaining attribute Method of forming solder bumps of an integrated circuit package is described. A solder paste is formed from a material having a characteristic that the deposited instances thereof substantially retain their geometric shape upon exposure to electromagnetic radiation.... | 02/19/2008 |
| 7303944 | Microelectronic devices having underfill materials with improved fluxing agents Microelectronic packages formed by using novel fluxing agents are disclosed. In one aspect, a microelectronic package may include a microelectronic device, a substrate, and an interconnect structure including a solder material coupling the microelectronic device wit... | 12/04/2007 |
| 7070085 | Water soluble protective paste for manufacturing printed circuit boards An improved water soluble protective paste and a method for protecting metal circuits and pads on the surface of an electronic board during the manufacturing steps. A densifier is added to the paste making it easier and more efficient the dispensing of the paste. Af... | 07/04/2006 |
| 7052558 | Solder paste flux composition A soldering paste flux for use in soldering copper and copper alloy piping and the like is formed of 40–70% nonylphenol ethoxylate (preferably Tergitol NO-10® made by Dow Chemical), 10–30% glyceryl monostearate, 3–10% acid activator, 3–10% water, and 4–15... | 05/30/2006 |
| 7041385 | Composite sheet material for brazing The invention relates to a coiled composite sheet material far brazing, the composite sheet material having a structure comprising a substrate, the substrate including an aluminium substrate and/or an aluminium alloy substrate, on at least one side coupled to a carr... | 05/09/2006 |
| 7026376 | Fluxing agent for underfill materials An underfill material, such as a no flow underfill material, containing an anhydride adduct of a rosin compound is disclosed. In one aspect, the anhydride adduct of a rosin compound contains an organic rosin acid moiety and a substitute moiety for a hydroxyl group o... | 04/11/2006 |
| 7022266 | Printable compositions, and their application to dielectric surfaces used in the manufacture of printed circuit boards A composition for use in the production of metal traces and other metal components of printed circuit boards, wiring boards and the like. The composition includes the following components: (a) a metal powder, (b) a solder powder, (c) a polymer or a monomer which is ... | 04/04/2006 |
| 6887319 | Residue-free solder paste A residue-free solder paste which leaves little or no flux residue after reflow soldering and which have good printability, storage stability, retainability of parts, and wettability, comprises a solder powder mixed with a rosin-free pasty flux. The flux comprises a... | 05/03/2005 |
| 6736908 | Composition and process for treating metal surfaces and resulting article A metal treating composition comprising at least a specific type of dissolved and/or dispersed organic resin, a dissolved vanadium compound in which the valence of vanadium is from 3 to 5, and a dissolved compound that contains at least one of the metals Zr, Ti, Mo,... | 05/18/2004 |
| 6726780 | Lead-free solder, and paste solder composition There is provided a lead-free solder which makes it possible to reliably and accurately perform the inspection of various kinds of defective soldering in the inspection using an image inspection apparatus after the reflow soldering. According to this lead-free solde... | 04/27/2004 |
| 6712262 | Water-soluble preflux, printed circuit board, and process for treating the surface of a metal in a printed circuit board The invention provides a water-soluble preflux that can solve problems with a soldering land array having a narrow spacing in that fused solder is likely to cause soldering bridges with defective soldering, a printed circuit board with its film formed thereon, and a... | 03/30/2004 |
| 6659329 | Soldering alloy A new soldering technique and solder alloy for wetting and joining hard-to-wet materials including titanium alloys such as nitinol uses a solder alloy containing tin and an active wetting promoting element such as aluminum in the presence of ultrasound. A... | 12/09/2003 |
| 6648212 | Components coated with an aluminum-silicon alloy Components composed of aluminum or an aluminum alloy with a coating comprising an aluminum-silicon alloy deposited thereon by applying an alkali metal fluorosilicate and heating the resulting treated material. The alloy layer is effectively protected agai... | 11/18/2003 |
| 6592020 | Lead-free solder paste The invention relates to a lead-free solder paste comprising a solder paste flux and solder alloy particles that are substantially lead-free wherein the solder paste flux comprises resin dissolved in a solvent and also includes undissolved resin particles... | 07/15/2003 |
| 6579474 | Conductive composition A conductive composition, and articles and methods using the conductive composition are disclosed.... | 06/17/2003 |
| 6562147 | Soldered product A connecting material, which secures reliable joints without using flux, is disclosed. Soldering is performed using an auxiliary connecting material capable of physically destroying and dispersing an oxide film, which is naturally grown on the surface of ... | 05/13/2003 |
| 6550667 | Flux composition and soldering method for high density arrays A single phase flux composition suitable for use with high density arrays, that comprises dicarboxylic acid in an amount sufficient to react with the oxidized surface area in a high-density array, a first organic solvent, and a second organic solvent havi... | 04/22/2003 |
| 6468363 | Composition for increasing activity of a no-clean flux An activated no-clean flux composition for soldering includes a dicarboxylic acid, an organic solvent, and acetic acid in the range of about 2% to about 4% by weight.... | 10/22/2002 |
| 6458472 | Fluxing underfill compositions This invention relates to fluxing underfill compositions useful for fluxing metal surfaces in preparation for providing an electrical connection and sealing the space between semiconductor devices, such as chip size or chip scale packages ("CSPs"), ball g... | 10/01/2002 |
| 6440228 | Lead-free zinc-containing solder paste A solder paste having a powder of a Zn-containing solder alloy such as an Sn--Zn based alloy in admixture with a soldering flux such as a rosin flux is improved by adding from 0.1% to 5.0% by weight of a glycidyl ether compound such as alkyl, alkenyl, or ... | 08/27/2002 |
| 6387499 | Coated solder spheres and method for producing the same Solder spheres which can avoid blackening during transportation have a substantially uniform coating of a lubricant on the surfaces thereof. They are produced by dipping freshly prepared solder spheres in a lubricant solution with a concentration of from ... | 05/14/2002 |
| 6342106 | Flux-free brazing paste The invention relates t a flux-free brazing paste for the brazing of copper and copper alloys. The paste includes a binder consisting of a mixture of polyisobutene with a relative molar mass from 50,000 to 500,000 and paraffin within a melting-range from ... | 01/29/2002 |
| 6217671 | Composition for increasing activity of a no-clean flux An activated no-clean flux composition for soldering includes a dicarboxylic acid, an organic solvent, and acetic acid in the range of about 2% to about 4% by weight.... | 04/17/2001 |
| 6203628 | Flux compositions for brazing aluminum, their films and brazing method A flux composition for brazing aluminum, comprising a fluoride flux, at least one selected from a butyl rubber and a petroleum resin, and a solvent. The novel flux composition has excellent processing properties and provides brazed areas (fillets) with go... | 03/20/2001 |
| 6193812 | Flux solution for soldering containing borneol A soldering flux containing borneol, which is also referred to as bornyl alcohol. A method soldering using such a flux is also disclosed. Even minor proportions of borneol in the flux help reduce ionic residue from the flux after soldering. Larger proport... | 02/27/2001 |
| 6170735 | Soldering method using a flux containing borneol A soldering flux containing borneol, which is also referred to as bornyl alcohol. A method soldering using such a flux is also disclosed. Even minor proportions of borneol in the flux help reduce ionic residue from the flux after soldering. Larger proport... | 01/09/2001 |
| 6156130 | Screen-printable or dispensable active brazing pastes and process for producing the same These active brazing pastes satisfy the requirements for screen printing or dispensing particularly well and are well suited for brazing one aluminum oxide ceramic body to another one or to a metal body. This can be done by means of respective regions of ... | 12/05/2000 |
| 6146470 | Methods of brazing and preparing articles for brazing, and coating composition for use in such methods Methods of brazing and coating and preparing articles for brazing and coating are disclosed. Prior to assembly and brazing, the articles are coated with a coating composition including a hot melt adhesive medium and brazing materials. To coat the articles... | 11/14/2000 |
| 6059894 | High temperature flip chip joining flux that obviates the cleaning process A fluxing composition is disclosed. The composition comprises a high molecular weight carboxylic acid that forms a combination of carboxylate salts and unreacted acid anhydrides when applied to a solder alloy and exposed to temperatures in the range of ab... | 05/09/2000 |
| 6010577 | Multifunctional soldering flux with borneol A soldering flux containing borneol, which is also referred to as bornyl alcohol. A method soldering using such a flux is also disclosed. Even minor proportions of borneol in the flux help reduce ionic residue from the flux after soldering. Larger proport... | 01/04/2000 |
| 5989362 | Polymerizable flux composition for encapsulating the solder in situ A polymer-based solder paste composition having the strength and corrosion resistance of joints produced by conventional solder technology and the environmental and processing advantages of ICA technology comprises a powdered solder metal with a single co... | 11/23/1999 |
| 5985456 | Carboxyl-containing polyunsaturated fluxing adhesive for attaching integrated circuits A thermally curable adhesive composition that includes a fluxing agent that also acts as an adhesive is provided. The composition includes: (a) a fluxing agent represented by the formula RCOOH, wherein R comprises a moiety having two or more carbon-carbon... | 11/16/1999 |
| 5985043 | Polymerizable fluxing agents and fluxing adhesive compositions therefrom A thermally curable adhesive composition that includes a fluxing agent that also acts as an adhesive is provided. The composition includes: (a) a fluxing agent represented by the formula RCOOH, wherein R comprises a moiety having two or more carbon--carbo... | 11/16/1999 |
| 5980650 | Flux suitable for soldering light metals such as aluminum A flux which contains irreversibly dehydrated K2 AlF5, for soldering light metal materials, in particular aluminum. The flux has the advantages of forming a very uniform flux coating on the workpiece or workpieces to be soldered and ... | 11/09/1999 |
| 5932030 | Flux for soldering using solder preforms A flux composition for use together with solder preforms, which comprises rosin, N-unsubstituted or N-substituted 2-pyrrolidone, and optionally a high boiling point ester solvent with a content of N-unsubstituted or N-substituted 2-pyrrolidone being 3-50%... | 08/03/1999 |
| 5919317 | Soldering flux, soldering paste and soldering method using the same Provided are a soldering flux or paste containing an organic substance which has at least two hydroxyl (--OH) groups in a molecule and of which the temperature at which the mass % becomes approximately 0% is not lower than approximately 170° C. and not l... | 07/06/1999 |
| 5904782 | Epoxy based, VOC-free soldering flux A resin-based VOC-free soldering flux consists of 40 to 50 wt % of a liquid epoxy resin, 25 to 30 wt % of a non-volatile liquid epoxy diluent, 20 to 33 wt % of a polyfunctional carboxylic acid, and 2.0 to 3.5 wt % of a thixotropic agent. There are no vola... | 05/18/1999 |
| 5863355 | Flux for soldering electronic components on circuit substrates, and mounted or unmounted circuit substrate The invention provides a soldering flux for mounting circuit substrates, which is free from any organic solvent attributable to air pollution and dispenses with any washing step. The soldering flux is obtained by dissolving a rosin modified by an unsatura... | 01/26/1999 |
| 5851311 | Polymerizable flux composition for encapsulating the solder in situ A polymer-based solder paste composition having the strength and corrosion resistance of joints produced by conventional solder technology and the environmental and processing advantages of ICA technology comprises a powdered solder metal with a single co... | 12/22/1998 |
