Did You Know...
...that the x-ray was discovered purely by accident? When German physicist Wilhelm Konrad von Roentgen was experimenting with cathode rays in 1895, he put an activated Crookes tube in a book and went out to lunch. When he returned, he discovered that a key that had also been placed in the book showed up as an image on the developed film!
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| Number | Title | Issue Date |
| 8075706 | Paste composition for aluminum brazing A paste composition for aluminum brazing of the invention contains 40 to 65% by weight of a metal powder for brazing (a), 5 to 35% by weight of a fluoride type flux (b), 1 to 10% by weight of a methacrylic acid ester type polymer (c), and 10 to 40% by weight of an o... | 12/13/2011 |
| 8034195 | Material and method of manufacturing of a solder joint with high thermal conductivity and high electrical conductivity A solder composition for forming a solder joint. The composition includes a powder material including a solid metal matrix material and a filler material. The solid metal matrix material includes one or more of tin-silver-copper (Sn—Ag—Cu), tin-copper (Sn—Cu),... | 10/11/2011 |
| 8002905 | Fluxing agent for soldering metal components The aim of the invention is to provide a fluxing agent for soldering components, which creates one or more specific surface characteristics during the soldering process itself, thus obviating the need for the surface treatment process that is conventionally carried ... | 08/23/2011 |
| 7850789 | Pasty composition for aluminum brazing, aluminum-containing member coated with the same, and method for brazing aluminum-containing members with the same Provided are a pasty composition for aluminum brazing which has excellent coating properties, is capable of attaining favorable dimensional accuracy of products obtained after brazing, causes less erosion, and allows favorable external appearances of brazed portions... | 12/14/2010 |
| 7645348 | Repair process In accordance with the present invention, a process for repairing metal workpieces, such as turbine engine components, is provided. The process comprises the steps of forming a braze paste containing a first nickel base alloy material containing boron and chromium a... | 01/12/2010 |
| 7534309 | Aqueous aluminum brazing composition, aluminum material coated with the brazing composition, brazing method using the aluminum material, and automotive heat exchanger manufactured by using the brazing method An aqueous aluminum brazing composition containing an organic binder and a zinc-based flux which prevents the precipitation of the zinc-based flux having a large specific gravity while securing an excellent brazeability. The thixotropic index of the brazing composit... | 05/19/2009 |
| 7416108 | High strength diffusion brazing utilizing nano-powders A braze material (10) including nano-sized filler material particles (14). The nano-sized particles will melt at a temperature significantly lower than the micron-sized particles used in prior art braze materials, thereby eliminating or reducing the ne... | 08/26/2008 |
| 7413805 | Preparation of metallic particles for electrokinetic or electrostatic deposition Metallic particles for electrokinetic or electrostatic deposition, and a method for making such particles, comprising metallic particle bodies, an organic acid film on the particle bodies, and a charge director adhered to the organic acid film. ... | 08/19/2008 |
| 7387690 | Repair process In accordance with the present invention, a process for repairing metal workpieces, such as turbine engine components, is provided. The process comprises the steps of forming a braze paste containing a first nickel base alloy material containing boron and chromium a... | 06/17/2008 |
| 7380700 | Paste composition for brazing and brazing method using the same The invention provides a paste composition for brazing, which upon brazing, does not cause brazing insufficiency such as residual carbon in any type of industrial brazing furnace, can achieve an excellent outward appearance of a brazed portion after brazing and can ... | 06/03/2008 |
| 7361990 | Reducing cracking of high-lead or lead-free bumps by matching sizes of contact pads and bump pads A semiconductor package assembly comprises a first conductive pad on a semiconductor substrate; a second conductive pad on a package substrate; a bump physically coupled between the first conductive pad and the second conductive pad, wherein the bump is substantiall... | 04/22/2008 |
| 7357291 | Solder metal, soldering flux and solder paste Solder metal consists essentially of 8.8 to 5.0 mass % of Zn, 0.05 to 0 mass % of Bi and the balance of Sn and unavoidable impurities. ... | 04/15/2008 |
| 7351361 | Conductive particles, conductive composition, electronic device, and electronic device manufacturing method A conductive composition layer, conductive particles as a raw material, a conductive composition therefor, a manufacturing method of the conductive composition layer, etc. are provided wherewith heat conductance can be accelerated between electronic devices or elect... | 04/01/2008 |
| 7342409 | System for testing semiconductor components A system for testing semiconductor components includes an interconnect, an alignment system for aligning a substrate to the interconnect, a bonding system for bonding the component to the interconnect, and a heating system for heating the component and the interconn... | 03/11/2008 |
| 7337941 | Flux coated brazing sheet A brazing flux mixture comprised of brazing flux, a polyvinyl butyral resin binder, and an organic solvent which can be applied over an entire aluminum alloy brazing sheet, or can be applied on the brazing sheet only where metallurgical bonds or joints are required,... | 03/04/2008 |
| 7331500 | Solder bumps formation using solder paste with shape retaining attribute Method of forming solder bumps of an integrated circuit package is described. A solder paste is formed from a material having a characteristic that the deposited instances thereof substantially retain their geometric shape upon exposure to electromagnetic radiation.... | 02/19/2008 |
| 7326367 | Thick film conductor paste compositions for LTCC tape in microwave applications This invention is related to thick film conductor compositions comprising electrically conductive gold powder, one or more glass frit or ceramic oxide compositions and an organic vehicle. It is further directed to the composition's uses for LTCC (low temperature co-... | 02/05/2008 |
| 7325717 | Welding material and a method of producing welded joint In the present invention, an iron based alloy which contains by mass %: 0.20% or less of C; 6.0 to 16.0% of Cr; 6.0 to 16.0% of Ni and whose martensitic transformation starting temperature (Ms point temperature) is in the range of 0-170° C., inclusive of 0° C. and... | 02/05/2008 |
| 7324203 | Method and apparatus for optical detection for multi-phase combustion systems A method for in-situ monitoring of an emission product includes transmitting a light, tuning the light to a first wavelength, receiving the light at a second location, varying the light from the first wavelength to a second wavelength during a first period, measurin... | 01/29/2008 |
| 7304491 | Interconnect for testing semiconductor components An interconnect for testing semiconductor components includes interconnect contacts configured for bonding to, and then separation from component contacts on the components. The interconnect can be utilized with a method that includes the steps of bonding the interc... | 12/04/2007 |
| 7291791 | Resin substrate A substrate is made of resin or a composite material. Pins with Au plating on their surface are soldered, with a soldering material made of Sn and Sb, to a substrate body having a first main surface, and formed into substantially a rectangular shape to project over ... | 11/06/2007 |
| 7279359 | High performance amine based no-flow underfill materials for flip chip applications Amine-based no-flow underfill materials and a method to produce flip-chip devices electrically bonded to a substrate are described. The no-flow underfill material includes an amine-based curing agent and a fluxing agent, which activates at a fluxing temperature and ... | 10/09/2007 |
| 7271084 | Reinforced solder bump structure and method for forming a reinforced solder bump A reinforced solder bump connector structure is formed between a contact pad arranged on a semiconductor chip and a ball pad arranged on a mounting substrate. The semiconductor chip includes at least one reinforcing protrusion extending upwardly from a surface of an... | 09/18/2007 |
| 7271611 | Method for testing semiconductor components using bonded electrical connections A method for testing a semiconductor component includes the steps of bonding an interconnect to the component to form bonded electrical connections, applying test signals through the bonded electrical connections, and then separating the interconnect from the compon... | 09/18/2007 |
| 7259581 | Method for testing semiconductor components A method for testing a semiconductor component includes the steps of bonding an interconnect to the component to form bonded electrical connections, applying test signals through the bonded electrical connections, and then separating the interconnect from the compon... | 08/21/2007 |
| 7244317 | Dispensible brazing paste A dispensable brazing paste useful in lamp manufacturing includes a brazing powder and a water soluble vehicle that has water, glycerin, a binder, and a dispersant that includes ammonium stearate and ammonium citrate. Preferably, the brazing powder is 84-87 wt % of ... | 07/17/2007 |
| 7241348 | Flux for solder paste and solder paste A flux for solder paste contains a dicarboxylic acid of carbon number 3 to 5 and a dicarboxylic acid of carbon number 15 to 20 as an activator, which prevents skinning or changes by aging of viscosity. In actual use, the solder paste of the present invention can mai... | 07/10/2007 |
| 7214419 | Conductive paste multilayered board including the conductive paste and process for producing the same A conductive paste is provided, which has good conductivity and good adhesiveness to substrates and has good long-lasting stability of these properties, and which, when applied to a through-hole of a multi-layered substrate, ensures improved reliability of bonding t... | 05/08/2007 |
| 7211205 | High conductivity inks with improved adhesion Conductive ink compositions which can be cured to highly conductive metal traces by means of “chemical welding” include adhesion promoting additives for providing improved adhesion of the compositions to various substrates. ... | 05/01/2007 |
| 7201304 | Multi-functional solder and articles made therewith, such as microelectronic components Aspects of the invention provide solder compositions which include two different fluxing agents. One of the fluxing agents promotes melting of a metal of the solder at a first activation temperature and the other fluxing agent promotes melting of the metal at a seco... | 04/10/2007 |
| 7198983 | Solder ball excellent in micro-adhesion preventing properties and wetting properties and method for preventing the micro-adhesion of solder balls The present invention provides a solder ball that has solved the problem of micro-adhesion and, moreover, has solved both of the problems of micro-adhesion and wetting properties, and a method for preventing the micro-adhesion of solder balls. That is, the present i... | 04/03/2007 |
| 7189469 | Fuel cell assembly and method of making the same A fuel cell assembly including a liquid metal seal and/or a liquid metal interconnect. ... | 03/13/2007 |
| 7182241 | Multi-functional solder and articles made therewith, such as microelectronic components Aspects of the invention provide solder compositions which include two different fluxing agents. One of the fluxing agents promotes melting of a metal of the solder at a first activation temperature and the other fluxing agent promotes melting of the metal at a seco... | 02/27/2007 |
| 7172643 | Lead-free solder powder material, lead-free solder paste and a method for preparing same Lead-free solder metal powder material including two or more metals capable of forming an intermetallic compound and having an unreacted phase and an amorphous phase. Further, a lead-free solder paste is prepared by mixing the powder material with a soldering flux. ... | 02/06/2007 |
| 7169650 | Semi-solid metal injection methods for electronic assembly thermal interface To accommodate high power densities associated with high performance integrated circuits, an integrated circuit package includes a heat-dissipating structure in which heat is dissipated from a surface of a die to an integrated heat spreader (IHS) through a high capa... | 01/30/2007 |
| 7170073 | Stainless steel product containing B and method for production thereof A stainless steel slab containing B, wherein a protecting material is joined onto at least two faces across the bloom from each other in a stainless steel bloom containing B of 0.3–2.5 mass %, being integrated into one-piece by forming a weld metal comprising a st... | 01/30/2007 |
| 7163137 | Method of manufacturing mounting boards The object is the capability of providing a method of manufacturing mounting boards that enables extensive adoption of a stacked structure at a low cost. As a solution, in the method of manufacturing a mounting board in which a mounting board is manufactured by moun... | 01/16/2007 |
| 7150797 | Filler material for use in welding of Mg-contained aluminum alloy die-cast members, welding method, and welded article An aluminum alloy filler material for use in welding of metal members including at least one aluminum die-cast member containing Mg includes an aluminum or an aluminum alloy as base material and Al—K—F series flux. The Al—K—F series flux is contained by 2 to... | 12/19/2006 |
| 7147141 | Preconditioning via plug material for a via-in-pad ball grid array package A method for providing an improved solder joint for a via-in-pad ball grid array package. One or more bonding pads are formed upon a substrate. One or more vias are formed through the substrate within the bonding pad. The vias are plugged with a via plug material. T... | 12/12/2006 |
| 7147725 | Colloidal silica binder system A welding flux that includes a flux agent, water glass and colloidal compound formed from small particles of silicon dioxide. The welding flux has a very low hygroscopicity, thus is well suited from low hydrogen electrodes. ... | 12/12/2006 |
