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| Number | Title | Issue Date |
| 8163104 | Fluxing agent A flux or a flux preparation, which contains complex alkali metal fluorides and additionally includes a water-soluble polymer, preferably polyvinyl alcohol or a polyvinyl alcohol derivative. The water-soluble polymer may be contained in the flux preparation as a gra... | 04/24/2012 |
| RE42329 | Flux cored preforms for brazing A wire preform suitable for use in brazing components to one another. The preform is made from a length of wire having a core of flux material, and a longitudinal seam or gap that extends over the length of the wire. The seam is formed so that when heated, the flux ... | 05/10/2011 |
| 7896979 | Activating flux for welding stainless steels An activating flux for welding stainless steel includes: from 25 to 40 weight percent of titanium dioxide (TiO2); from 25 to 30 weight percent of chromium oxide (Cr2O3); from 10 to 30 weight percent of silicon dioxide (SiO2 | 03/01/2011 |
| 7811389 | Flux and process for hot dip galvanization A flux for use in a hot dip galvanization process has an acidic component so that the flux has a pH of about 1.5 or less. The flux also includes an alkali metal chloride and a nonionic surfactant containing polyoxyethylenated straight-chain alcohols with a hydrophil... | 10/12/2010 |
| 7767032 | No-clean low-residue solder paste for semiconductor device applications A no-clean low residue solder paste is described for die-attach dispensing or fine pitch printing of semiconductor devices. The solder paste has a homogeneous consistency with no tendency to paste separation. The ultimately remaining residue is clear and crystal lik... | 08/03/2010 |
| 7740713 | Flux composition and techniques for use thereof The present invention is directed to soldering techniques and compositions for use therein. In one aspect, a flux composition is provided. The flux composition comprises a fluxing agent comprising organic acid, an organic tacking agent and an organic wetting agent. ... | 06/22/2010 |
| 7601228 | Solder composition A solder composition containing a lead-free SnZn alloy and a solder flux that contains at least an epoxy resin and an organic carboxylic acid. The organic carboxylic acid is dispersed in the solder composition as a solid at room temperature, and has a molecular weig... | 10/13/2009 |
| 7572343 | Composite metal matrix castings and solder compositions, and methods A composite composition and methods for making the composition, providing a metal matrix and dispersed inorganic oxide particles with a bound organofunctional group on a surface of the particles are described. A composite solder composition and methods for making an... | 08/11/2009 |
| 7413805 | Preparation of metallic particles for electrokinetic or electrostatic deposition Metallic particles for electrokinetic or electrostatic deposition, and a method for making such particles, comprising metallic particle bodies, an organic acid film on the particle bodies, and a charge director adhered to the organic acid film. ... | 08/19/2008 |
| 7357291 | Solder metal, soldering flux and solder paste Solder metal consists essentially of 8.8 to 5.0 mass % of Zn, 0.05 to 0 mass % of Bi and the balance of Sn and unavoidable impurities. ... | 04/15/2008 |
| 7351361 | Conductive particles, conductive composition, electronic device, and electronic device manufacturing method A conductive composition layer, conductive particles as a raw material, a conductive composition therefor, a manufacturing method of the conductive composition layer, etc. are provided wherewith heat conductance can be accelerated between electronic devices or elect... | 04/01/2008 |
| 7342870 | Position adjustment apparatus, optical pickup apparatus and position adjustment method A chuck portion provided to keep a fixed positional relation with respect to a housing, holds a light source unit detachably. This chuck portion is displaced from an advanced position to a retracted position to displace the light source unit which is in a provisiona... | 03/11/2008 |
| 7337941 | Flux coated brazing sheet A brazing flux mixture comprised of brazing flux, a polyvinyl butyral resin binder, and an organic solvent which can be applied over an entire aluminum alloy brazing sheet, or can be applied on the brazing sheet only where metallurgical bonds or joints are required,... | 03/04/2008 |
| 7331500 | Solder bumps formation using solder paste with shape retaining attribute Method of forming solder bumps of an integrated circuit package is described. A solder paste is formed from a material having a characteristic that the deposited instances thereof substantially retain their geometric shape upon exposure to electromagnetic radiation.... | 02/19/2008 |
| 7326367 | Thick film conductor paste compositions for LTCC tape in microwave applications This invention is related to thick film conductor compositions comprising electrically conductive gold powder, one or more glass frit or ceramic oxide compositions and an organic vehicle. It is further directed to the composition's uses for LTCC (low temperature co-... | 02/05/2008 |
| 7303944 | Microelectronic devices having underfill materials with improved fluxing agents Microelectronic packages formed by using novel fluxing agents are disclosed. In one aspect, a microelectronic package may include a microelectronic device, a substrate, and an interconnect structure including a solder material coupling the microelectronic device wit... | 12/04/2007 |
| 7300528 | Flux binder system A welding flux that includes a flux agent and a binder. The binder includes a colloidal binder formed from small particles of silicon dioxide. The binder can be dried at lower temperatures to thereby for a greater range of fluxing agents and/or metal alloys to be in... | 11/27/2007 |
| 7293602 | Fin tube assembly for heat exchanger and method A fin and tube assembly for use in a heat exchanger comprising a carbon steel tube, a carbon steel fin, and an external brazing compound comprising a material selected from the group consisting of nickel, chrome, copper, aluminum, zinc, and graphite brazed to the tu... | 11/13/2007 |
| 7285173 | Desoldering systems and processes A process for recovering a solder contaminant from a substrate surface with a wick structure comprising a plurality of heat conductive metal strands and a desoldering flux comprising a mixture of a first component of a partially polymerized rosin having a melting po... | 10/23/2007 |
| 7282174 | Lead-free solder and soldered article The present invention provides a Sn—Zn based lead-free solder which can prevent peeling of solder from soldered portions even after the passage of long periods after soldering of portions to be soldered made of Cu. A Sn—Zn based lead-free solder according to the... | 10/16/2007 |
| 7258263 | Bipolar plate fabrication A method for making a current collector plate includes providing a first sheet of material having a first bonding face and a first outer face. A second sheet of material is provided having a second bonding face and a second outer face. A work area is defined on at l... | 08/21/2007 |
| 7252218 | Bipolar plate fabrication by roll bonding An anti-bonding material is placed in a desired pattern onto a first sheet of conductive material. A second sheet of conductive material is roll bonded with the first sheet of material. Fluid is injected between the bonded first and second sheets of material to expa... | 08/07/2007 |
| 7244317 | Dispensible brazing paste A dispensable brazing paste useful in lamp manufacturing includes a brazing powder and a water soluble vehicle that has water, glycerin, a binder, and a dispersant that includes ammonium stearate and ammonium citrate. Preferably, the brazing powder is 84-87 wt % of ... | 07/17/2007 |
| 7241348 | Flux for solder paste and solder paste A flux for solder paste contains a dicarboxylic acid of carbon number 3 to 5 and a dicarboxylic acid of carbon number 15 to 20 as an activator, which prevents skinning or changes by aging of viscosity. In actual use, the solder paste of the present invention can mai... | 07/10/2007 |
| 7238653 | Cleaning solution for photoresist and method for forming pattern using the same Cleaning solutions for photoresist are disclosed which are useful for cleaning a semiconductor substrate in the last step of development when photoresist patterns are formed. Also, methods for forming photoresist patterns using the same are disclosed. The disclosed ... | 07/03/2007 |
| 7214419 | Conductive paste multilayered board including the conductive paste and process for producing the same A conductive paste is provided, which has good conductivity and good adhesiveness to substrates and has good long-lasting stability of these properties, and which, when applied to a through-hole of a multi-layered substrate, ensures improved reliability of bonding t... | 05/08/2007 |
| 7204019 | Method for repairing an apertured gas turbine component A method for repairing defects in a gas turbine component that comprises a substrate and an existing coating on the substrate. The article includes cooling holes having a predetermined air flow requirement and an outer shaped portion and an inner metering portion. T... | 04/17/2007 |
| 7182241 | Multi-functional solder and articles made therewith, such as microelectronic components Aspects of the invention provide solder compositions which include two different fluxing agents. One of the fluxing agents promotes melting of a metal of the solder at a first activation temperature and the other fluxing agent promotes melting of the metal at a seco... | 02/27/2007 |
| 7182240 | Solder coated lid A solder coated lid for a package for an electronic device has a lead-free solder layer comprising a Sn—Sb based solder with a liquidus temperature of at least 220 degrees C. provided on at least a region of the lid where the lid is to be joined to a base of a pac... | 02/27/2007 |
| 7147725 | Colloidal silica binder system A welding flux that includes a flux agent, water glass and colloidal compound formed from small particles of silicon dioxide. The welding flux has a very low hygroscopicity, thus is well suited from low hydrogen electrodes. ... | 12/12/2006 |
| 7143928 | Flux and method for joining dissimiliar metals Disclosed herein is a method for joining dissimilar metals without a need for a separate welding process. The method comprises applying a flux on a metal to be joined, inserting the metal into a mold, and injecting a molten metal into the mold. Thus, the base metal ... | 12/05/2006 |
| 7108755 | Simplification of ball attach method using super-saturated fine crystal flux A method for preparing a metal surface (34) for a soldering operation is provided. In accordance with the method, the metal surface is treated with a solder flux (31) comprising a supersaturated solution of a carboxylic acid. ... | 09/19/2006 |
| 7097090 | Solder ball A solder ball is formed from an Sn—Pb alloy which consists essentially of about 2–65 mass % of Sn, 0–5 mass % of Ag, about 0.1–1 mass % of Sb, and 0.01–0.1 mass % of Cu, and 0.01–0.1 mass % of Bi, and a balance of Pb and incidental impurities. The solder... | 08/29/2006 |
| 7087859 | Stick electrode A welding electrode comprising a metal core and a flux coating at least partially coated on an outer surface of said metal core, and also including a end coating material which at least partially inhibits porosity of a weld bead formed during the welding operation. | 08/08/2006 |
| 7076958 | Magnetic material The magnetic material for magnetic refrigeration of the present invention is characterized by exhibiting, in a certain temperature region, preferably, only in part of a temperature region from 200 K to 350 K, an inflection point at which a second order differential ... | 07/18/2006 |
| 7070085 | Water soluble protective paste for manufacturing printed circuit boards An improved water soluble protective paste and a method for protecting metal circuits and pads on the surface of an electronic board during the manufacturing steps. A densifier is added to the paste making it easier and more efficient the dispensing of the paste. Af... | 07/04/2006 |
| 7059512 | Solder alloy material layer composition, electroconductive and adhesive composition, flux material layer composition, solder ball transferring sheet, bump and bump forming process, and semiconductor device An object of the present invention is to provide solder bumps sufficiently satisfying the expected functions and having a small diameter which conventional methods cannot attain, a semiconductor device on which these bumps are mounted, and a bump transferring sheet.... | 06/13/2006 |
| 7052559 | Welding flux for use in arc-welding of stainless steels, method of welding stainless steel members using the welding flux A welding flux for use in welding stainless steel parts to increase welding penetration, consisting essentially a base material obtained from manganese peroxide (MnO2), and an activator selected from a material group that includes zinc oxide (ZnO), silico... | 05/30/2006 |
| 7052558 | Solder paste flux composition A soldering paste flux for use in soldering copper and copper alloy piping and the like is formed of 40–70% nonylphenol ethoxylate (preferably Tergitol NO-10® made by Dow Chemical), 10–30% glyceryl monostearate, 3–10% acid activator, 3–10% water, and 4–15... | 05/30/2006 |
| 7047635 | Connecting material and connecting method A connecting material can form a detachable connecting structure. According to the connecting material, a connecting portion between a certain object and another object can be more readily formed, and the certain object can be more readily detached from the another ... | 05/23/2006 |
