Class 148/22 - COMPOSITIONS

Subclass of Class 148 - Metal treatment
Definition: Compositions employed in the treatment of solid metal and
No. of patents: 87
Last issue date: 07/06/2010

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Number	Title	Issue Date
7749336	Technique for increasing the compliance of tin-indium solders A technique for increasing the compliance of tin-indium solders is disclosed. In one particular exemplary embodiment, the technique may be realized as a lead free solder alloy comprising from about 58.0% to about 99.998% by weight tin, from about 0.001% to about 40....	07/06/2010
7678203	Welding flux A welding flux formulated for pipe welding or one-side welding applications including a gas releasing agent, a high melting compound and a low melting compound. The welding flux is particularly formulated for limited pass welding applications which exhibit high impa...	03/16/2010
7578424	Method of joining a microwave transparent component to a host component A method of joining a microwave transparent component 36 to a host component 34 or 18 includes the steps of applying a Titanium-Tungsten (TiW) coating 44 to the microwave transparent component, applying a metal layer 46 over the Ti...	08/25/2009
7357291	Solder metal, soldering flux and solder paste Solder metal consists essentially of 8.8 to 5.0 mass % of Zn, 0.05 to 0 mass % of Bi and the balance of Sn and unavoidable impurities. ...	04/15/2008
7273337	Partially coated fastener assembly and method for coating A fastener assembly includes a row of fasteners having a head, a tip, and a portion of a shank coated with a polymer composition. The polymer composition includes a polymer material such as polyurethane and metal particles. The polymer composition is used to provide...	09/25/2007
7252853	Protective coating and method of using such coating A vehicle masking material and method of use. The masking material in one embodiment includes polyvinyl alcohol, ethyl alcohol, glycerine or triethylene glycol, a surfactant, and water. The masking material is applied to a surface which is to be protected from paint...	08/07/2007
7226516	Method for making integrated circuit aluminium panels The invention relates to an aluminium OSF integrated circuit panel production method comprising surface preparation of two aluminium alloy sheets, deposition on one of the sheets of a weld-proof ink in reserved areas corresponding to the design of the circuit, conne...	06/05/2007
7141504	Method and apparatus for anisotropic etching There is disclosed a method of treating a substrate material or a film present on the material surface comprising cyclically performing the following steps: (a) etching the material or film; (b) depositing or forming a passivation layer on the surfaces of an etched ...	11/28/2006
7108795	Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under con...	09/19/2006
7029721	Method for applying a high-temperature bond coat on a metal substrate, and related compositions and articles A method for applying a bond coat on a metal-based substrate is described. A slurry which contains braze material and a volatile component is deposited on the substrate. The slurry can also include bond coat material. Alternatively, the bond coat material can be app...	04/18/2006
6998572	Light energy processing device and method A machining apparatus includes a light source (1) for generating light energy, an optical system (2, 3) for guiding the generated light energy to a joint position of a workpiece, a table (5a) on which the workpiece is mounted, and a heati...	02/14/2006
6964712	Hardening protection compositions for partial carburization of metallic components Hardening protection compositions based on substances which form boron glass for partial carburization of metallic components, which contain magnesium-silicon compounds as an additive. These hardening protection compositions can be used very advantageously in proces...	11/15/2005
6946027	Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under con...	09/20/2005
6921577	Water-based metal surface treatment agent A water-based metal surface treatment agent for the surface treatment of metals including aluminum products such as pre-coated aluminum sheets gives excellent coating film adhesion, flexibility and acid resistance. The water-based metal surface treatment agen...	07/26/2005
6796482	Phase separated system for fluxing A solder flux composition (19) is provided which comprises active ingredients and a carrier. The solder flux composition undergoes a phase separation during solder reflow to form at least a first phase (21) and a second phase (23), such that the...	09/28/2004
6784225	Surface enhancer for making a molded metal/ceramic article An improved enhancer formulation for use in forming precision molded articles from a furnace process is disclosed wherein an organometallic zirconia coupling agent is used in conjunction with a polymer in solvent to inhibit the bleed-through of infiltrant metal in a...	08/31/2004
6722557	Flux cleaning method and method of manufacturing semiconductor device An effective method for cleaning flux residues produced in process of fabricating semiconductor devices, and a method of fabricating the semiconductor devices including this cleaning method are provided. The flux cleaning method for cleaning the solder bump electrod...	04/20/2004
6716281	Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under con...	04/06/2004
6648214	Method for partially or completely coating the surfaces of components produced from aluminum or its alloys with solders, fluxing agents or binders for brazing In a method for partial or complete coating of surfaces of components of aluminum and its alloys with a uniform layer of homogeneously distributed solder, fluxing agent and binder for brazing of the components to one another, the solder, fluxing agent and...	11/18/2003
6616032	Brazing composition and method for brazing parts made of alumina-based materials with said composition A refractory braze composition and process for assembling alumina-containing parts to another alumina-based material, metal or a metal alloy by reactive or non-reactive refractory brazing using a braze composition provide assemblies entirely of alumina or...	09/09/2003
6544351	Compositions and methods for producing coatings with improved surface smoothness and articles having such coatings A coating composition produces a protective coating to a substrate, which coating has an improved surface smoothness. The coating composition comprises a mixture of at least a first type of particles and a second type of particles that are dispersed in a ...	04/08/2003
6488781	Soldering paste, soldering method, and surface-mounted type electronic device Soldering paste for bonding an electronic component to electrodes on a ceramic substrate includes alcohol having at least two OH groups, organic acid, and metallic powder. The electronic component disposed on the electrodes through the soldering paste und...	12/03/2002
6387499	Coated solder spheres and method for producing the same Solder spheres which can avoid blackening during transportation have a substantially uniform coating of a lubricant on the surfaces thereof. They are produced by dipping freshly prepared solder spheres in a lubricant solution with a concentration of from ...	05/14/2002
6187114	Solder material and electronic part using the same This invention provides a lead-free high temperature solder material comprising 0.005-3.0 wt % of palladium (Pd) and 97.0-99.995 wt % of tin (Sn) whose liquidus temperature is 200-350° C. The solder material is environmentally-friendly, improved in therm...	02/13/2001
6153021	Method of brazing aluminum A brazing material comprising a mixture of aluminum brazing powder (i.e. Si, Zn, Cu or Ge), flux, binder, and alcohol for diluting the binder is coated on a surface of an extruded flat tubed strip of aluminum type and this and aluminum type fins are braze...	11/28/2000
6124569	Flux-cored welding wire with a low nitrogen content A flux-cored wire for welding shielded by a flow of gas, in particular of the rutile or slag-free type, composed of an outer metal sheath and a central core comprising filling elements, and an MAG gas-shielded welding process using such a flux-cored wire ...	09/26/2000
6054675	Solid wire for mag welding Described is a solid wire for MAG welding which has no copper plating on the wire surface and which has good welding workabilities such as a reduced amount of generated spatters and good arc stability in the MAG welding of steel sheets. A solid wire for M...	04/25/2000
5988483	Anti-lubricant compositions There is described a method of securing against lateral motion two bodies held in face to face asperity contact to make a joint between the two bodies. Inserted into the interface between the two bodes is a material known as a galling agent, gall promoter...	11/23/1999
5964963	Brazing paste Thermal stresses normally associated with brazing are alleviated by a low temperature brazing technique of the present invention. A low-temperature brazing paste, preferably suitable to be melted at temperatures of no greater than 200° C. (e.g., 100-200�...	10/12/1999
5958333	Tin-silver-based soldering alloy The present invention provides a soldering alloy which does not include harmful Pb or Cd and which has an excellent tensile strength, elongation value, and melting point property. The soldering alloy according to the present invention can thus solve the c...	09/28/1999
5932030	Flux for soldering using solder preforms A flux composition for use together with solder preforms, which comprises rosin, N-unsubstituted or N-substituted 2-pyrrolidone, and optionally a high boiling point ester solvent with a content of N-unsubstituted or N-substituted 2-pyrrolidone being 3-50%...	08/03/1999
5928440	Method of forming solder film A method of forming a solder film on a metallic surface such as a pad of a metallic circuit of a printed circuit board and a lead frame of electronic parts, which is capable of forming a precise and fine pattern and which comprises selectively imparting t...	07/27/1999
5919317	Soldering flux, soldering paste and soldering method using the same Provided are a soldering flux or paste containing an organic substance which has at least two hydroxyl (--OH) groups in a molecule and of which the temperature at which the mass % becomes approximately 0% is not lower than approximately 170° C. and not l...	07/06/1999
5918796	Method of fabricating package for housing semiconductor element A method of fabricating a package for housing a semiconductor element, comprising applying solder paste within plural depressions which are formed on at least one principal surface of an insulating substrate and have electrical connection pads, protruding...	07/06/1999
5851434	Ketone-based surfactant and method for treating industrial, commercial, and institutional waste-water A nonionic surfactant having cyclic 1,3-dioxane and/or 1,3-dioxolane functionality which is irreversibly splittable by lowering the pH of its aqueous solution is useful in various processes requiring the removal of emulsified hydrophobic contaminants or o...	12/22/1998
5843371	Lead-free soldering material having superior solderability A lead-free soldering material for soldering wires of electronic parts is disclosed. The lead-free soldering material is composed of in weight %: 3-4% of Ag, 2-5% of In, 6-14% of Bi and a balance of Sn, and the soldering material shows a superior solderab...	12/01/1998
5837066	Composition for making galled joint, process of making and process of using composition A composition which is effective in the making of a galled joint between two metal members in which there are gaps in the joint prior to and during its formation and which comprises a multiplicity of small metal particles and a gall-enhancing material, fo...	11/17/1998
5817194	Tin base soldering/brazing material A tin base soldering/brazing material contains 0.05 to 1.5 wt. % of P, 0.5 to 5.0 wt. % of Ni, if necessary, 30 wt. % or less of Cu, and/or 10 wt. % or less of Ag, and the balance of Sn and unavoidable impurities, wherein the total amount of Ni, Cu and Ag...	10/06/1998
5785770	Brazing flux Brazing fluxes comprising a combination of a fluoroaluminate complex and selected metal fluorosilicates, including their method of manufacture and use, are disclosed....	07/28/1998
5744065	Aldehyde-based surfactant and method for treating industrial, commercial, and institutional waste-water A nonionic surfactant having cyclic 1,3-dioxane and/or 1,3-dioxolane functionality which is irreversibly splittable by lowering the pH of its aqueous solution is useful in various processes requiring the removal of emulsified hydrophobic contaminants or o...	04/28/1998

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Class 148/22 - COMPOSITIONS