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| Number | Title | Issue Date |
| 8113243 | Apparatus and methods for filament crimping and manufacturing Apparatus and methods for filament crimping. In one embodiment, the apparatus comprises a body and a filament crimp element. The filament crimp element comprises a first set of cavities disposed at a spacing which creates a first set of features and a second set of ... | 02/14/2012 |
| 7926520 | Apparatus and methods for filament crimping and manufacturing Apparatus and methods for filament crimping. In one embodiment, the apparatus comprises a body and a filament crimp element. The filament crimp element comprises a first set of cavities disposed at a spacing which creates a first set of features and a second set of ... | 04/19/2011 |
| 7650914 | Apparatus and methods for filament crimping and manufacturing Apparatus and methods for filament crimping. In one embodiment, the apparatus comprises a body and a filament crimp element. The filament crimp element comprises a first set of cavities disposed at a spacing which creates a first set of features and a second set of ... | 01/26/2010 |
| 7314777 | Chip packaging systems and methods An automated process for performing MEMS packaging including automatically attaching a die to a chip carrier, resulting in a chip carrier assembly, automatically moving the chip carrier assembly into a vacuum chamber, wherein the vacuum chamber includes one or more ... | 01/01/2008 |
| 7281312 | Method and apparatus for introducing wave windings into rotor and stator lamination packets of electrical machines A method and apparatus in which wave windings, cut from a continuously formed wave winding band, are brought with a defined number of waves essentially tangentially to a rotor or stator lamination packet or a rotorlike transfer tool having radially outwardly open sl... | 10/16/2007 |
| 7265315 | Method of joining terminals by soldering A method of joining terminals by soldering is provided which allows control of increasing gas supply even in soldering performed in a gas atmosphere within a gas chamber. Utilizing a springback phenomenon occurring at a flat portion of a terminal, a solder joint of ... | 09/04/2007 |
| 7254976 | Method of manufacturing liquid ejection head There is provided a first die in which a plurality of projections are arrayed in a first direction with a fixed pitch. Each projection is elongated in a second direction perpendicular to the first direction. The first die faces a first face of a plate member. A seco... | 08/14/2007 |
| 7247520 | Microelectronic component assemblies and microelectronic component lead frame structures The present invention provides microelectronic component assemblies and lead frame structures that may be useful in such assemblies. For example, one such lead frame structure may include a set of leads extending in a first direction and a dam bar. Each of the leads... | 07/24/2007 |
| 7238543 | Methods for marking a bare semiconductor die including applying a tape having energy-markable properties A method used for marking a semiconductor wafer or device. The method and apparatus have particular application to wafers or devices which have been subjected to a thinning process, including backgrinding in particular. The present method comprises reducing the cros... | 07/03/2007 |
| 7201101 | Punch capable of punching an object at four directions A punch includes a jig having four punching regions, each punching region having a pattern hole and a concave embossment; guide columns extended upward from a border of the punching regions on the jig; a base for fixing the jig; a punching member punching and emboss... | 04/10/2007 |
| 7193303 | Supporting frame for surface-mount diode package A supporting frame is used to solidly bridge to the two metallic contacts of a surface mount diode chip. Any bending or twisting stress between the two contacts is borne by the supporting frame instead of the diode chip. Otherwise the stress may damage the diode chi... | 03/20/2007 |
| 7185414 | Apparatus for forming wave windings for rotor and stator lamination packets of electrical machines An apparatus in which wave windings with a defined number of waves are cut from a continuously formed wave winding band. In forming with a wire guide, the wave winding band is laid in alternation around the outer side faces of forming protrusions, offset from one an... | 03/06/2007 |
| 7171883 | Punching apparatus and the punching unit thereof A punching apparatus is provided which can of punch a non-circular holes at a predetermined position of a work piece. In the punching apparatus for punching a hole by means of a punch integrated into any one of the moving part of a press working machine or the suppo... | 02/06/2007 |
| 7162906 | Method and apparatus for removing a carrier part from a carrier A method for removing from a carrier a carrier part with a housing arranged thereon, wherein prior to performing the separating operation a notched line is arranged in the carrier on at least one side of the carrier along at least a part of the length of a separatin... | 01/16/2007 |
| 7134311 | Device and method for fabricating lead frame by press forming A device for fabricating a lead frame, by press forming, provided with a die having a flat face, on which a lead frame to be fabricated by press forming is to be placed, and a concavity, which is dented relative to the flat face, the die possessing a fabricating fac... | 11/14/2006 |
| 7094618 | Methods for marking a packaged semiconductor die including applying tape and subsequently marking the tape The present invention provides a method and apparatus for marking a semiconductor wafer or device. The method and apparatus have particular application to wafers or devices which have been subjected to a thinning process, including backgrinding in particular. The pr... | 08/22/2006 |
| 7077170 | Method of forming leads of a semiconductor device In a lead forming apparatus for a semiconductor device, a holder holds a semiconductor device with leads to be formed, the semiconductor device having leads extending from a package. Two die assemblies (for bending, for cutting, or the like) are set in parallel, eac... | 07/18/2006 |
| 7057273 | Surface mount package Space-efficient packaging of microelectronic devices permits greater functionality per unit PC board surface area. In certain embodiments, packages having leads of a reverse gull wing shape reduce peripheral footprint area occupied by the leads, thereby permitting m... | 06/06/2006 |
| 6971415 | Rotational grip twist machine and method for fabricating bulges of twisted wire electrical connectors Bulges in a wire having helically coiled strands are formed by untwisting the strands in an anti-helical direction at a predetermined position, to form an electrical connector from a length of the stranded wire. The wire is gripped by moving two spaced apart clamp m... | 12/06/2005 |
| 6928850 | Method and tooling for z-axis offset of lead frames A method and apparatus for enabling z-axis offset of narrow metal ties straps in lead frames used for packaging integrated circuits to prevent bowing or distortion. Simultaneous offsetting of the tie strap and stress relief mechanisms are provided on both the front ... | 08/16/2005 |
| 6904671 | Integrated circuit chip handling apparatus and method The present invention provides for an apparatus and method for handling integrated circuit (IC) chips such as thin small outline package (TSOP) IC chips. Embodiments of the invention are directed toward removal of TSOPs from device under test (DUT) boards. By use of... | 06/14/2005 |
| 6842977 | Method of manufacturing metallic wire segment One end of a metallic wire having a rectangular cross-section is widened by upsetting the end of the wire in its axial direction. At the same time, a swollen portion is formed at a position where the widened end portion is to be bent from a straight portion of the w... | 01/18/2005 |
| 6837710 | Bent tip dental root canal implement and method thereof This application relates to the field of Dentistry, and in more particular to the use of root canal excavating implements such as files, broaches, reamers, or probes employed for the use of clearing tissue and removing dentin from the nerve canal of teeth. An introd... | 01/04/2005 |
| 6820657 | Apparatus for the manufacture of rock bolts Apparatus and method for manufacturing multi strand rock bolts having spaced apart bulbs (12), wherein there is a feed means (14, 16, 18 and 19) for supplying a multi strand cable (11) from a rotatable supply wheel (13). Means (... | 11/23/2004 |
| 6654658 | System and method for conditioning leads A system for conditioning a plurality of semiconductor leads of a semiconductor device is provided. The system includes an array of comb blades, where each comb blade terminates at a notch that allows the semiconductor leads to be moved laterally through ... | 11/25/2003 |
| 6640606 | All-purpose pressing-bending machine The application relates to an all-purpose pressing-bending machine having a feeding device (11) for feeding a material to be bent to a plurality of bending tool supporting slides (5), associated with a supporting plate (2). At least one of the bending too... | 11/04/2003 |
| 6619097 | Machine for stamping, bending and/or mounting sheet metal parts The invention relates to a machine for stamping, bending and/or mounting of sheet metal parts with at least one upper housing part 14 and at least one lower housing part 16. Preferably, several are arranged in a row. On each housing part 14, 16 the carria... | 09/16/2003 |
| 6532783 | Clamping device, tool and method of mounting tools The invention relates to a device for clamping at least two tool parts movable relative to each other for processing carriers for electronic components in a press. The invention also relates to a press adapted for co-action with the clamping device. The i... | 03/18/2003 |
| 6435222 | Method and apparatus for manufacturing electronic parts A method and apparatus for manufacturing electronic parts in which leads can be accurately bent and maintenance operations are easy. Each electronic part so manufactured includes a resin mold section 2 with a built-in electronic device and leads projectin... | 08/20/2002 |
| 6412522 | Bending die and bending machine using the same A bending die includes a base member (1, 11) and a roller (3, 14). The base member (1, 11) is provided with a first portion (1a, 11a), the root of a lead (5, 16) is in contact with, and a second portion (1b, 11b), the end (5A, 16A) of the lead (5, 16) is ... | 07/02/2002 |
| 6401765 | Lead frame tooling design for exposed pad features A modular tool for forming features in an exposed pad having a pad surface between a bleed groove and an edge of the pad surface in a lead frame including a first tool for forming a bottom of the exposed pad under the pad surface, a second tool coupled to... | 06/11/2002 |
| 6363976 | Semiconductor manufacturing apparatus and method of manufacturing semiconductor device A semiconductor manufacturing apparatus and a method of manufacturing a semiconductor device are provided. A horizontal driver (111) and a vertical driver (112) are controlled to move a punch holder (110), or an end portion (101T1) of a punch (101), withi... | 04/02/2002 |
| 6085804 | Apparatus and method for forming leads and removing tin dust from leads A lead forming apparatus and a method for removing tin dust from the surface of the outer leads of semiconductor package are disclosed. The apparatus, in which a brushing operation removes tin dust from the outer leads, includes a supplier part; a lead fo... | 07/11/2000 |
| 6035529 | Header pin pre-loaded method A method of deforming a pin for use in an electrical connection, and a method of making an electrical connection using a deformed pin. A normally straight pin is provided and positioned adjacent to a frame supporting a die and an operating member. The ope... | 03/14/2000 |
| 6016852 | Leaded grid array IC package having coplanar bent leads for surface mount technology An integrated circuit package with a two dimensional array of leads that each have a foot portion which is bent at an angle relative to a vertical column portion of the leads. The foot portion of the leads are typically soldered to the surface pads of a p... | 01/25/2000 |
| 6014993 | Method and apparatus for configuring component leads A method and apparatus for bending a plurality of leads of a component, in order to straighten and/or repair damaged or misaligned leads, is disclosed. The apparatus includes: a securing structure for receiving and holding the component; a first member fo... | 01/18/2000 |
| 5979510 | Forming tool and method A pivot punch that has no explicit pivot point. In one embodiment, the tool includes a die, a punch holder pressable along a path toward the die and a punch supported by the punch holder. The punch extends through and is pivotable in an opening in the hol... | 11/09/1999 |
| 5950687 | Lead forming apparatus and lead forming method Four lead bending devices (40) are so disposed as to surround the forming die (31). In each of the lead bending devices (40), a rotary lever (41) extends from a rotary strut (43) and a lever guide (42) disposed therebelow holds the rotary lever (41) to pr... | 09/14/1999 |
| 5878789 | Mechanical press machine for forming semiconductor packages The present invention relates to a press for trimming and forming lead frames of semiconductor packages which have been molded in order to form individual semiconductor chips. The press machine for forming semiconductor packages according to the present i... | 03/09/1999 |
| 5867893 | Clinch assembly lift mechanism A clinching assembly for use with an insertion machine of the type used to form and insert the lead-wires of an electronic component into openings of a printed circuit board insertion machine. The clinching assembly includes two clinch heads that are sele... | 02/09/1999 |
