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| Number | Title | Issue Date |
| 6840250 | Nextgen wet process tank A process tank for processing a plurality of wafers having a diameter, the process tank comprising: two substantially vertical side walls being a first distance apart; wherein the first distance is substantially equal to the diameter of the wafer; two upwardly angle... | 01/11/2005 |
| 6837252 | Apparatus for treating a workpiece with steam and ozone In a method for processing a workpiece to remove material from a first surface of the workpiece, steam is introduced onto the first surface under conditions so that at least some of the steam condenses and forms a liquid boundary layer on the first surface. The cond... | 01/04/2005 |
| 6837943 | Method and apparatus for cleaning a semiconductor substrate A stripping solution is supplied onto the surface of a substrate and an alternating magnetic flux is applied to the substrate. The alternating magnetic flux induces a current in a conductive pattern of the substrate which heats the conductive pattern while the strip... | 01/04/2005 |
| 6837253 | Processing tank with improved quick dump valve A liquid process tank that provides a quick dump feature includes a fixed bottom wall assembly and moveable tank side walls that contain liquid and also act as a quick dump valve for the liquid. The bottom wall assembly includes an acoustic transducer secured theret... | 01/04/2005 |
| 6833109 | Method and apparatus for storing a semiconductor wafer after its CMP polishing In an apparatus, after completion of a CMP (i.e., chemical mechanical polishing) operation of a semiconductor wafer, the thus polished wafer is temporarily stored in a water tank before it is subjected to a post-CMP cleaning operation. During its storage period in t... | 12/21/2004 |
| 6833035 | Semiconductor processing system with wafer container docking and loading station A processor for processing integrated circuit wafers, semiconductor substrates, data disks and similar units requiring very low contamination levels. The processor has an interface section which receives wafers in standard wafer carriers. The interface section trans... | 12/21/2004 |
| 6832616 | Substrate treating apparatus The present invention is directed to a substrate treating apparatus of a multi-nozzle type comprising an outer tube nozzle through which a chemical fluid, a combination of a chemical fluid and a gas, pure water, or a combination of pure water and a gas is discharged... | 12/21/2004 |
| 6830628 | Methods for cleaning semiconductor surfaces The invention encompasses methods for cleaning surfaces of wafers or other semiconductor articles. Oxidizing is performed using an oxidation solution which is wetted onto the surface. The oxidation solution can include one or more of: water, ozone, hydrogen chloride... | 12/14/2004 |
| 6830631 | Method for the removing of adsorbed molecules from a chamber A method of removing first molecules adsorbed on the surfaces of a chamber and/or at least one object found in the chamber is provided. Second, polar molecules that have a desorptive effect on the first molecules are introduced into the chamber. The second molecules... | 12/14/2004 |
| 6827793 | Drip manifold for uniform chemical delivery A method for cleaning a wafer with a drip nozzle being configured for use in a drip manifold that is oriented over a brush of a wafer cleaning system is provided. The drip nozzle has a first end and a second end with a passage defined there between where the passage... | 12/07/2004 |
| 6824622 | Cleaner and method for removing fluid from an object A cleaner and method for removing excess residual cleaning fluid from an object, particularly a semiconductor wafer, before or as the wafer is removed from a cleaning chamber of a CMP cleaner, for example. Typically, a purge bar is mounted on each side of the cleani... | 11/30/2004 |
| 6824621 | Single wafer type substrate cleaning method and apparatus A single wafer type wet-cleaning technique for effectively preventing chemical fluids from flowing to the back face of a wafer when the back face thereof is wet-cleaned by chemical fluids, wherein purified water is injected and supplied to the back face of the wafer... | 11/30/2004 |
| 6824613 | Substrate processing apparatus A substrate processing apparatus can efficiently form, e.g. by electroless plating, an interconnects-protective layer on the surface of a substrate at a low initial cost for the apparatus and a low running cost without the need for a wide installation space. The sub... | 11/30/2004 |
| 6823880 | High pressure processing apparatus and high pressure processing method A high-pressure processing apparatus includes a processing vessel including a processing chamber formed therein to perform a certain process onto an object in the processing chamber; fluid feeding means which feeds a high-pressure fluid into the processing chamber; ... | 11/30/2004 |
| 6823876 | Methodology of rotational etching tool maintenance A method of cleaning and maintenance used for a rotational etching tool, combining the physical characteristics of water (splashed off after striking the surface of a spinning wafer) and a PM (preventive maintenance) computer program, can automatically and quickly c... | 11/30/2004 |
| 6821349 | Method and apparatus for removing a liquid from a surface A method and an apparatus for removing a liquid, i.e. a wet processing liquid, from at least one surface of at least one substrate is disclosed. A liquid is supplied on a surface of substrate. Simultaneously or thereafter the liquid or the substrate is locally heate... | 11/23/2004 |
| 6818066 | Method and apparatus for treating a substrate A system and method for treating a substrate by integrating the annealing of a metal-containing layer on a substrate as part of a chemical mechanical polishing process. In one embodiment, a system for treating a substrate generally includes an annealing station inco... | 11/16/2004 |
| 6817370 | Method for processing the surface of a workpiece An apparatus for supplying a mixture of a treatment liquid and ozone for treatment of a surface of a workpiece, and a corresponding method are set forth. The preferred embodiment of the apparatus comprises a liquid supply line that is used to provide fluid communica... | 11/16/2004 |
| 6817368 | Substrate processing method and substrate processing apparatus Resists can be removed while metal contamination of wafers, etc. and generation of particles, and growth of oxide films are suppressed. An ozone gas feed system 40 for feeding ozone gas 2 into a processing vessel 10 holding wafers W, and a steam... | 11/16/2004 |
| 6817369 | Device and method for cleaning substrates The inventive device for cleaning substrates, especially semiconductor wafers, comprises a treatment basin for receiving at least one substrate, a cover for sealing said treatment basin, a first feeding device for controllably feeding in a reactive gas, a second fee... | 11/16/2004 |
| 6811618 | Liquid processing apparatus and method In one embodiment of a liquid processing apparatus, a cleaning unit (CLN) 12 includes a rotary plate 61, supporting members 64a, holding members 64b, a chemical nozzle 51 for supplying a wafer W with a chemical liquid... | 11/02/2004 |
| 6810888 | Wafer rotary holding apparatus and wafer surface treatment apparatus with waste liquid recovery mechanism Provided is a wafer rotary holding apparatus by which a reduced pressure is created on an upper surface of a rotary disk by a simple and easy-to-make mechanism with no need of any of a vacuum source apparatus, a compressed air supply apparatus, a compressed gas supp... | 11/02/2004 |
| 6810887 | Method for cleaning semiconductor fabrication equipment parts A process for cleaning semiconductor fabrication equipment parts includes determining a definition for a clean part including multiple maximum acceptable impurity levels; determining an initial multiple impurity levels of a part prior to its cleaning; determining a ... | 11/02/2004 |
| 6807974 | Single wafer type substrate cleaning method and apparatus In the drying step of the single wafer type substrate cleaning system for cleaning wafers not stored in a cassette, in a sealed cleaning housing, a spin drying treatment is applied to the wafer when the wafer is supported and rotated at high speed while an inert gas... | 10/26/2004 |
| 6807972 | Gutter and splash-guard for protecting a wafer during transfer from a single wafer cleaning chamber A single wafer cleaning chamber that includes a rotatable bracket that can place a wafer beneath an upper end of a catch cup during a wafer cleaning process, a gutter positioned above a wafer transfer slit; where the catch cup can mate with the gutter to create a ga... | 10/26/2004 |
| 6806194 | Apparatus and methods for processing a workpiece A system for processing a workpiece includes a head attached to a head lifter. A workpiece is supported in the head between an upper rotor and a lower rotor. A base has a bowl for containing a liquid. The head is movable by the head lifter from a first position vert... | 10/19/2004 |
| 6805791 | Ozonated water flow and concentration control apparatus The invention features an apparatus and a method for supplying ozonated water to more than one process tool. Ozonated water of a first concentration received from an ozonated water generator and water received from a source are mixed to produce ozonated water of a s... | 10/19/2004 |
| 6805754 | Device and method for processing substrates A device and method for processing substrates, whereby medium consumption and processing time are reduced. According to the inventive method, liquid is conducted to a surface of the substrate that is to be treated via at least one nozzle that is arranged in a substa... | 10/19/2004 |
| 6805137 | Method for removing contamination particles from substrates Embodiments of the invention provide a method for removing contaminant particles from a substrate surface, where the method includes supporting a substrate in a face up position on a substrate support member and imparting a broadband impulse to the substrate support... | 10/19/2004 |
| 6804851 | Holder for semiconductor wafers in a brush-cleaning installation A holder in a brush-cleaning installation, preferably for combined use in the brush-cleaning and centrifugal-drying process, contains a carrier part from which there extend, in a spider-shaped manner, a plurality of carrying arms. On the carrying arms there is mount... | 10/19/2004 |
| 6803588 | Apparatus and method for rapid photo-thermal surfaces treatment An apparatus for surface treating a semiconductor wafer includes a surface treatment chamber and a source of radiation. The semiconductor wafer disposed inside the chamber is illuminated with radiation sufficient to create a plurality of electron-hole pairs near the... | 10/12/2004 |
| 6799589 | Method and apparatus for wet-cleaning substrate In the art of wet-cleaning a substrate by etching with a cleaning solution prepared by dissolving hydrofluoric acid as an active component in water, using the process of measuring the concentration of a predetermined component regularly and then replenishing the cle... | 10/05/2004 |
| 6799588 | Apparatus for treating substrates The aim of the invention is to attain a uniform and homogeneous treatment of substrates in a device comprising at least one process container which is arranged in a gas atmosphere and which contains a treatment fluid. Said process container also comprises at least t... | 10/05/2004 |
| 6799586 | Substrate processing method An outer covering wall (26) and an inner covering wall (27), which are capable of surrounding a rotor (24), can be horizontally moved. A wafer carrier waiting portion (30) is disposed right below the rotor (24). A wafer holding mem... | 10/05/2004 |
| 6799584 | Condensation-based enhancement of particle removal by suction This invention is directed to apparatus and a method for removing particles from a surface, such as a semiconductor wafer. A fluid is applied to the surface on which the particles are distributed so as to coat the particles with the fluid. At least some of these par... | 10/05/2004 |
| 6799583 | Methods for cleaning microelectronic substrates using ultradilute cleaning liquids A method of cleaning a surface of an article using cleaning liquids in combination with acoustic energy. Preferably, an ultradilute concentration of a cleaning enhancement substance, such as ammonia gas, is dissolved in a liquid solvent, such as filtered deionized w... | 10/05/2004 |
| 6796316 | Atomic layer deposition (ALD) thin film deposition equipment having cleaning apparatus and cleaning method An atomic layer desposition (ALD) thin film deposition equipment having a cleaning apparatus, this equipment including a reactor in which a wafer is mounted and a thin film is deposited on the wafer, a first reaction gas supply portion for supplying a first reaction... | 09/28/2004 |
| 6796315 | Method to remove particulate contamination from a solution bath A method of cleaning particulates from a solution bath including at least partially filling a deionized water (DIW) bath for rinsing at least one wafer following chemically cleaning the at least one wafer; rinsing the at least one wafer; transferring the at least on... | 09/28/2004 |
| 6796054 | Low-pressure dryer and low-pressure drying method A low-pressure dryer dries a substrate applied a coating solution thereon at low pressure. The dryer includes an airtight chamber installing a substrate table to place the substrate thereon; a diffuser plate, provided as facing the substrate placed on the substrate ... | 09/28/2004 |
| 6797076 | Spray nozzle system for a semiconductor wafer container cleaning aparatus A cleaning system for cleaning boxes or containers used to carry semiconductor wafers has box holder assemblies attached to a rotor within an enclosure. Liquid spray manifolds have one or more spray nozzles that spray at an angle toward or away from the direction of... | 09/28/2004 |
