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3M employee and church chorister Art Fry needed something to temporarily mark pages in his hymnal. He was in luck because his colleague, Spencer Silver, accidentally developed a glue that was too weak for other purposes. After initially discouraging consumer response, Post-it Notes became a hit in 1979.
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| Number | Title | Issue Date |
| 8034191 | Cleaning plant In order to produce a cleaning plant for cleaning work pieces which comprises at least one cleaning station in which the workpiece is subjected to a cleaning process in such a manner that the cleaning process can be organized in a flexible manner and easily adapted ... | 10/11/2011 |
| 7875125 | Method for extending equipment uptime in ion implantation The invention features in-situ cleaning process for an ion source and associated extraction electrodes and similar components of the ion-beam producing system, which chemically removes carbon deposits, increasing service lifetime and performance, without the need to... | 01/25/2011 |
| 7699938 | Cleaning method and dishwasher using same A cleaning method includes a first operation step of allowing a mist of a first cleaning fluid atomized in the order of microns to permeate into and remain in a food debris stuck on a to-be-cleaned item for a predetermined period of time; and a second operation step... | 04/20/2010 |
| 7431853 | Selective etching of oxides from substrates A method and system for release etching a micro-electrical-mechanical-systems (MEMS) device from a substrate. In one aspect, the invention is a method comprising (a) supporting at least one substrate having a sacrificial oxide and a non-sacrificial material in a pro... | 10/07/2008 |
| 7416611 | Process and apparatus for treating a workpiece with gases In a method and apparatus for cleaning or processing a workpiece, a process gas is brought into contact with the workpiece by diffusion through a heated liquid layer on the workpiece, and by bulk transport achieved by entraining the gas in a liquid stream, spray or ... | 08/26/2008 |
| 7410543 | Substrate processing method Resists can be removed while metal contamination of wafers, etc. and generation of particles, and growth of oxide films are suppressed. A substrate processing method comprises feeding a processing gas, such as ozone gas, into a processing vessel to pressurize an atm... | 08/12/2008 |
| 7404863 | Methods of thinning a silicon wafer using HF and ozone A method of thinning a silicon wafer in a controllable cost-effective manner with minimal chemical consumption. The wafer is placed into a process chamber, after which ozone gas and HF vapor are delivered into the process chamber to react with a silicon surface of t... | 07/29/2008 |
| 7367345 | Apparatus and method for providing a confined liquid for immersion lithography A method for processing a substrate is provided which includes generating a meniscus on the surface of the substrate and applying photolithography light through the meniscus to enable photolithography processing of a surface of the substrate. ... | 05/06/2008 |
| 7368589 | Purification of silicone containing compounds by supercritical fluid extraction The present invention relates to a process for the purification of silicone containing compounds via supercritical fluid extraction. Specifically, the present invention relates to a process comprising the steps of contacting at least one silicone containing compound... | 05/06/2008 |
| 7364625 | Rinsing processes and equipment Described are methods of rinsing and processing devices such as semiconductor wafers wherein the device is rinsed with using a surface tension reducing agent; the method may include a subsequent drying step which preferably incorporates the use of a surface tension ... | 04/29/2008 |
| 7361233 | Methods of hydrogen cleaning of metallic surfaces The pulsed partial pressure hydrogen cleaning of cobalt-based alloys in turbine components is achieved by disposing the component within a vacuum furnace and heating the component. Upon heating to about 1400° F., a partial pressure hydrogen gas and a vacuum are rep... | 04/22/2008 |
| 7353560 | Proximity brush unit apparatus and method An apparatus is provided for producing a wet region and corresponding dry region on a wafer. A proximity brush unit delivers fluids with a rotatable brush to produce the wet region on the wafer. As the proximity brush unit moves in a selected scan method across the ... | 04/08/2008 |
| 7318870 | Method of cleaning semiconductor substrate A cleaning method for a semiconductor substrate including placing the semiconductor substrate into a cleaning chamber and injecting ozone gas (O3) into the cleaning chamber. This process operates to cleanse the semiconductor substrate without corrosion or... | 01/15/2008 |
| 7314054 | Liquid processing apparatus with nozzle having planar ejecting orifices A liquid processing apparatus includes containers 26, 27, 26a, 26b surrounding processing chambers 51, 52 for accommodating a plurality of wafers W and nozzles 54, 56 for supplying a processing liquid to the substrates W in ... | 01/01/2008 |
| 7311785 | Automatic air-blown cleaning device for liquid crystal display component in LCD assembly and method thereof An automatic air-blown cleaning apparatus for cleaning a liquid crystal display (LCD) component in an LCD assembly process. The automatic air-blown cleaning apparatus has an assembly station for receiving and assembling the liquid crystal display component, a convey... | 12/25/2007 |
| 7293571 | Substrate proximity processing housing and insert for generating a fluid meniscus An apparatus for generating a fluid meniscus to be formed on a surface of a substrate is provided including a housing where the housing includes a housing surface to be placed proximate to a substrate surface of the substrate. The housing further includes a process ... | 11/13/2007 |
| 7291565 | Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid A method and system is described for treating a substrate with a high pressure fluid, such as carbon dioxide in a supercritical state. A process chemistry is introduced to the high pressure fluid for treating the substrate surface. The process chemistry comprises fl... | 11/06/2007 |
| 7288156 | Methods for cleaning a substrate The invention provides a water supplying apparatus and method thereof which has a high capacity of peeling and removing a disused material such as a resist film and the like, and can efficiently use water vapor. A water supplying apparatus for executing a washing pr... | 10/30/2007 |
| 7282099 | Dense phase processing fluids for microelectronic component manufacture Method for processing an article by contacting the article with a dense fluid. The article is introduced into a sealable processing chamber and the processing chamber is sealed. A dense fluid is prepared by introducing a subcritical fluid into a pressurization vesse... | 10/16/2007 |
| 7276138 | Vapor generating and recovery apparatus A vapor generating and recovery apparatus including a housing having an open top, a closed bottom and a plurality of sidewalls therebetween defining a boiling sump with a treating solution therein. The housing is further provided with at least one heating coil and a... | 10/02/2007 |
| 7270717 | Compositions and methods for cleaning contaminated articles Disclosed are compositions and methods for cleaning contaminated articles based on the provision of a zeotropic composition comprising (a) at least one flammable solvent having a boiling point at a first pressure; (b) at least one first nonflammable solvent having a... | 09/18/2007 |
| 7267727 | Processing of semiconductor components with dense processing fluids and ultrasonic energy Method for processing an article with a dense processing fluid in a processing chamber while applying ultrasonic energy during processing. The dense fluid may be generated in a separate pressurization vessel and transferred to the processing chamber, or alternativel... | 09/11/2007 |
| 7264007 | Method and apparatus for cleaning a substrate using megasonic power A method for processing a substrate is provided that includes generating a fluid meniscus on a surface of the substrate and applying acoustic energy to the fluid meniscus. The method also includes moving the fluid meniscus over the surface the substrate to process t... | 09/04/2007 |
| 7264680 | Process and apparatus for treating a workpiece using ozone A method for cleaning a semiconductor workpiece having a metal layer in a processing chamber includes the steps of introducing a liquid solution including dissolved carbon dioxide onto the workpiece, and introducing ozone into the processing chamber. The ozone oxidi... | 09/04/2007 |
| 7255772 | High pressure processing chamber for semiconductor substrate A high pressure chamber comprises a chamber housing, a platen, and a mechanical drive mechanism. The chamber housing comprises a first sealing surface. The platen comprises a region for holding the semiconductor substrate and a second sealing surface. The mechanical... | 08/14/2007 |
| 7252097 | System and method for integrating in-situ metrology within a wafer process A system and method for processing a wafer includes applying a process to the wafer. The process being supported by a surface tension gradient device. A result of the process is monitored. The monitored result is output. ... | 08/07/2007 |
| 7250374 | System and method for processing a substrate using supercritical carbon dioxide processing A method and system for processing a substrate in a film removal system. The method includes providing the substrate in a substrate chamber of a film removal system, where the substrate has a micro-feature containing a dielectric film on a sidewall of the micro-feat... | 07/31/2007 |
| 7247210 | Methods for treating CIP equipment and equipment for treating CIP equipment A method for treating CIP equipment is provided according to the present invention. The CIP equipment includes process equipment. The method includes steps of treating the CIP equipment with a multiple phase treating composition comprising a treating liquid phase an... | 07/24/2007 |
| 7240679 | System for substrate processing with meniscus, vacuum, IPA vapor, drying manifold One of many embodiments of a substrate preparation system is provided which includes a drying system, the drying system including at least one proximity head for drying a substrate. The system also includes a cleaning system for cleaning the substrate. ... | 07/10/2007 |
| 7235141 | Lift-off method and chemical liquid tank A lift-off procedure is provided which enables prevention of damage to a wiring pattern caused by contact of a metal being peeled off from a wafer with a wiring pattern at a time of lift-off procedure. A wafer having a surface on which a pattern is formed which cont... | 06/26/2007 |
| 7234476 | Method of cleaning CVD equipment processing chamber A method of remote plasma cleaning a processing chamber of CVD equipment, which has high cleaning rates, low cleaning operational cost and high efficiency, is provided. The method comprises supplying cleaning gas to the remote plasma-discharge device; activating the... | 06/26/2007 |
| 7234477 | Method and apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces One of many embodiments of a substrate preparation system is provided which includes a head having a head surface where the head surface is proximate to a surface of the substrate. The system also includes a first conduit for delivering a first fluid to the surface ... | 06/26/2007 |
| 7201807 | Method for cleaning a deposition chamber and deposition apparatus for performing cleaning Disclosed are a method for cleaning a deposition chamber by removing attached metal oxides, and a deposition apparatus for performing in situ cleaning. A first gas and a second gas are provided into the deposition chamber. The first gas is reacted with metal include... | 04/10/2007 |
| 7198055 | Meniscus, vacuum, IPA vapor, drying manifold A head is provided which includes a first surface of the head capable of being in close proximity to the wafer surface, and includes a first conduit region on the head where the first conduit region is defined for delivery of a first fluid to wafer of the surface an... | 04/03/2007 |
| 7189291 | Method for the removal of airborne molecular contaminants using oxygen gas mixtures The present invention discloses a method for the removal of a number of molecular contaminants from surfaces within a device. A purge gas containing oxygen and/or water is introduced into the interior of the device, contacting at least a portion of the interior surf... | 03/13/2007 |
| 7147723 | Method and assembly for static elimination of cleaning object in clearing apparatus There is disclosed a method for static elimination of a cleaning target in a cleaning step is carried out by disposing in a cleaning apparatus a conducting means capable of coming into contact with and separating from the cleaning target at a plurality of portions t... | 12/12/2006 |
| 7145653 | In situ particle monitoring for defect reduction A system and method is provided for monitoring and controlling the contaminant particle count contained in an aerosol during a photoresist coating and/or development process of a semiconductor. The monitoring system monitors the contaminate particle count present in... | 12/05/2006 |
| 7140393 | Non-contact shuttle valve for flow diversion in high pressure systems A valve for redirecting flow in a supercritical fluid or other high pressure processing system is disclosed. In high pressure supercritical carbon dioxide (SCCO2) equipment for semiconductor wafer processing, a major hurtle in providing clean equipment and clean waf... | 11/28/2006 |
| 7141123 | Method of and apparatus for removing contaminants from surface of a substrate A cleanling apparatus for removing contaminants from the surface of a substrate includes two parts: one which produces an aerosol including frozen particles and directs the aerosol onto the surface of the substrate to remove contaminants from the surface by physical... | 11/28/2006 |
| 7138065 | Method for removing at least one area of a layer of a component consisting of metal or a metal compound The invention relates to a method for removing an area of a layer of a component consisting of metal or a metal compound. According to prior art, corrosion products of a component are removed in a first step by applying a molten mass or by heating in a voluminous po... | 11/21/2006 |
