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| Number | Title | Issue Date |
| 6884338 | Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor The present invention provides methods of polishing and/or cleaning copper interconnects using bis(perfluoroalkanesulfonyl) imide acids or copper tris(perfluoroalkanesulfonyl) methide acids compositions. ... | 04/26/2005 |
| 6881244 | Method and device for preventing deposits in steam systems The present invention relates to a method for preventing the deposition of contaminants in steam systems. In a method of this type, deposits are prevented in a simple and economic manner by metering an additive into the steam, which additive adheres to the steam-sid... | 04/19/2005 |
| 6878575 | Method of forming gate oxide layer in semiconductor devices Methods of preparing improved semiconductor substrates having gate oxide layers formed thereon, and use of such substrates in fabricating improved semiconductor devices, are disclosed. The methods include a first step of performing a cleaning process for removing a ... | 04/12/2005 |
| 6878213 | Process and system for rinsing of semiconductor substrates Semiconductor substrates, particularly metallized substrates such as partially processed wafers, are rinsed with an aqueous medium, preferably deionized water, which further contains an anti-corrosive chemical agent or agents selected so as to minimize corrosion of ... | 04/12/2005 |
| 6875089 | Constant pH polish and scrub A system and method are provided that maintains a high pH at the wafer surface through the entire polish process and then lowers the pH only when necessary in a controlled fashion after CMP and during the post-polish clean. A fluid having a high pH chemistry and, op... | 04/05/2005 |
| 6875292 | Process for rejuvenating a diffusion aluminide coating A process of rejuvenating a diffusion aluminide coating on a component. The rejuvenation process involves treating the coating with an aqueous solution of nitric acid and phosphoric acid until at least part of the additive layer of the coating has been removed, but ... | 04/05/2005 |
| 6869487 | Process and apparatus for treating a workpiece such as a semiconductor wafer A novel chemistry, system and application technique reduces contamination of semiconductor wafers and similar substrates and enhances and expedites processing. A stream of liquid chemical is applied to the workpiece surface. Ozone is delivered either into the liquid... | 03/22/2005 |
| 6869921 | Stripping composition A stripping composition comprising at least one of alcohols having an ether-bond in the molecule thereof as component (a), and an anticorrosive as component (b). Furfuryl alcohol or tetrahydrofurfuryl alcohol is preferable as component (a). ... | 03/22/2005 |
| 6864044 | Photoresist residue removing liquid composition The object of the present invention is to provide, in the production of semiconductor circuit elements, a photoresist residue removing liquid composition which is excellent for removing photoresist residues after dry etching without attacking the wiring material or ... | 03/08/2005 |
| 6863738 | Method for removing oxides and coatings from a substrate A method for selectively removing oxide material from the surface of a substrate or coating disposed on the substrate is disclosed. The method includes the step of contacting the oxide material with an aqueous treatment composition having the formula HxAF... | 03/08/2005 |
| 6858124 | Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor The present invention provides methods of polishing and/or cleaning copper interconnects using sulfonic acid compositions. ... | 02/22/2005 |
| 6858089 | Apparatus and method for semiconductor wafer cleaning An improved method for removing contaminant particles from a surface of a semiconductor wafer includes forming a sacrificial film on the surface of the wafer and then removing the sacrificial film by supercritical fluid cleaning. The removal of the sacrificial film ... | 02/22/2005 |
| 6852349 | Storage stable pan release coating and cleaner The pan release coating is provided which includes water, mono and diclycerides, polysorbate, and an antimicrobial effective amount of acetic acid, citric acid and sodium benzoate. Desirably, the composition of the present invention is composed of water in an amount... | 02/08/2005 |
| 6843860 | Method and device for pickling hot-rolled special steel strips The invention relates to a method for pickling hot-rolled special steel strips (1) having an austenite, ferrite and/or martensite structure. The inventive method is carried out in a pickling line (7) with pickling sections (8) containing acids a... | 01/18/2005 |
| 6843857 | Methods for cleaning semiconductor surfaces The invention encompasses methods for cleaning surfaces of wafers or other semiconductor articles. Oxidizing is performed using an oxidation solution which is wetted onto the surface. The oxidation solution can include one or more of: water, ozone, hydrogen chloride... | 01/18/2005 |
| 6844304 | Pickling agent containing urea and method of producing it A long-time stable pickling agent for the removal of an oxide layer on a stainless steel after heat treatment, such as welding, which pickling agent comprises nitric acid and fillers and constitutes of a pickling paste or pickling gel to be coated on the heat treate... | 01/18/2005 |
| 6840249 | Method for cleaning a semiconductor device In order to clean a semiconductor device having a dielectric layer deposited on a top surface of a lower metal wiring of the semiconductor device, and a contact hole or a via hole formed in the dielectric layer to expose the lower metal line therethrough, the semico... | 01/11/2005 |
| 6841525 | Dilute cleaning composition and method for using same A cleaning method in a semiconductor fabrication process includes providing a dilute composition consisting essentially of phosphoric acid and acetic acid and exposing a surface, e.g., aluminum, to the dilute composition. For example, the dilute composition includes... | 01/11/2005 |
| 6841311 | Cleaning process for phase shift masks A new sequence and chemical composition for cleaning the surface of a halftone shift masks that use MoSiON as shifter material is provided. For purposes of repair or rework, the pellicle is removed from the mask so that the mask can be accessed. After the rework or ... | 01/11/2005 |
| 6837944 | Cleaning and drying method and apparatus A method of cleaning semiconductor wafers before the epitaxial deposition comprising (A) etching silicon wafers with HF; (B) rinsing the etched wafers with ozonated ultrapure water; (C) treating the rinsed wafers with dilute SC1; (D) rinsing the treated wafers; (E) ... | 01/04/2005 |
| 6833328 | Method for removing a coating from a substrate, and related compositions A method for selectively removing one or more coatings from the surface of a substrate is described. The coating is treated with an aqueous composition which includes an acid of the formula HxAF6, or precursors to such an acid. In that formula,... | 12/21/2004 |
| 6833081 | Method of metal etching post cleaning A method of metal etching post cleaning. A substrate with a surface covered by a patterned metal layer and a patterned resist layer in order is provided, subsequently, oxygen-plasma ashing is performed to remove the patterned resist layer to expose the surface of th... | 12/21/2004 |
| 6833032 | Automatic deliming process An automatic deliming process for a steam oven cooker is described. The process initiates a deliming procedure after a predetermined time of normal operation, which period of time is determined by the hardness of the water in the local area. Upon the expiration of t... | 12/21/2004 |
| 6831048 | Detergent composition A cleaning composition comprising (1) at least one of fluoride salts and hydrogendifluoride salts; (2) an organic solvent having a hetero atom or atoms; and (3) water; a method of cleaning metal gate, contact hole, via hole and capacitor using the composition; a met... | 12/14/2004 |
| 6831047 | Cleaning composition useful in semiconductor integrated circuit fabrication A composition for use in semiconductor processing wherein the composition comprises water, phosphoric acid, and an organic acid; wherein the organic acid is ascorbic acid or is an organic acid having two or more carboxylic acid groups (e.g., citric acid). The water ... | 12/14/2004 |
| 6830627 | Copper cleaning compositions, processes and products derived therefrom The present invention is a persulfate microetchant composition especially useful for removing impurities from copper surfaces during fabrication of microelectronic packages. The microetchant formulation is characterized by its ability to selectively clean copper in ... | 12/14/2004 |
| 6830628 | Methods for cleaning semiconductor surfaces The invention encompasses methods for cleaning surfaces of wafers or other semiconductor articles. Oxidizing is performed using an oxidation solution which is wetted onto the surface. The oxidation solution can include one or more of: water, ozone, hydrogen chloride... | 12/14/2004 |
| 6830629 | Method for treating brass Brass articles having leachable lead are contacted with an aqueous caustic solution that contains a chelating agent. A brass article can optionally be post-treated by contacting it with an aqueous solution containing anazole. ... | 12/14/2004 |
| 6827090 | Process for removing deposits from water-carrying systems and devices for water supply Process for removing deposits from water-carrying systems and devices for water supply, or from their individual parts, in which the deposits are dissolved by means of an aqueous treatment solution and removed in dissolved form from the system or the device or their... | 12/07/2004 |
| 6821352 | Compositions for removing etching residue and use thereof A composition for removing etching residue and a method using same are disclosed herein. In one aspect, there is provided a method for removing etching residue from a substrate comprising: contacting the substrate with a composition comprising water, an organic dica... | 11/23/2004 |
| 6821351 | Hydrofluoric acid generating composition and method of treating surfaces The present invention relates to compositions, kits and processes for the brightening of metal surfaces by the application of the chemical compositions. These compositions act to release hydrofluoric acid as a brightening agent. The solutions are preferably mixed du... | 11/23/2004 |
| 6821350 | Cleaning process residues on a process chamber component A method of cleaning process residues from the surface of a substrate processing chamber component having holes. In the method, the component is at least partially immersed into a cleaning solution having hydrafluoric acid and nitric acid, and a non-reactive gas is ... | 11/23/2004 |
| 6821349 | Method and apparatus for removing a liquid from a surface A method and an apparatus for removing a liquid, i.e. a wet processing liquid, from at least one surface of at least one substrate is disclosed. A liquid is supplied on a surface of substrate. Simultaneously or thereafter the liquid or the substrate is locally heate... | 11/23/2004 |
| 6810887 | Method for cleaning semiconductor fabrication equipment parts A process for cleaning semiconductor fabrication equipment parts includes determining a definition for a clean part including multiple maximum acceptable impurity levels; determining an initial multiple impurity levels of a part prior to its cleaning; determining a ... | 11/02/2004 |
| 6807971 | Heat treatment apparatus and cleaning method of the same A semiconductor water is contained in a reaction tube, and the reaction tube is exhausted through an exhaust pipe while supplying ammonia and dichlorosilane into the reaction tube. A silicon nitride film is deposited on an object to be heat-treated by a reaction of ... | 10/26/2004 |
| 6802911 | Method for cleaning damaged layers and polymer residue from semiconductor device A method of cleaning damaged layers and polymer residue on semiconductor devices includes mixing HF and ozone water in a vessel to form a solution of HF and ozone water, and dipping a semiconductor device in the vessel containing the solution of HF and ozone water. ... | 10/12/2004 |
| 6796315 | Method to remove particulate contamination from a solution bath A method of cleaning particulates from a solution bath including at least partially filling a deionized water (DIW) bath for rinsing at least one wafer following chemically cleaning the at least one wafer; rinsing the at least one wafer; transferring the at least on... | 09/28/2004 |
| 6797194 | Surface treating for micromachining and method for surface treatment The present invention provides a micromachining surface treatment material for and a surface treatment method that suppress widening of the diameter of contact holes when removing a natural oxidation layer arising at bottom sections of the contact holes. The microma... | 09/28/2004 |
| 6793737 | Process for removing a resinous coating from fiberous products A method for reclaiming fiberglass and a resinous residue from resinous fiberglass product. The method comprises first introducing the resinous fiberglass product to a single chamber or multi-chamber washer/extractor machine. An aqueous acid solution is then used to... | 09/21/2004 |
| 6793738 | Method for processing acid treatment solution, solution processed thereby, and method for treating articles therewith A method for preparing a solution for treating an article, a treatment solution made thereby, and a method for treating an article with the solution are presented with, for example, the treatment method comprising providing a quantity of treatment solution, the trea... | 09/21/2004 |
