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President Rutherford B. Hayes ; Said in 1876, after Alexander Graham Bell demonstrated the telephone to him at the White House
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| Number | Title | Issue Date |
| 6953533 | Process for removing chromide coatings from metal substrates, and related compositions A method for removing a chromide coating from the surface of a substrate is described. The coating is treated with a composition which includes an acid having the formula HxAF6, where “A” can be Si, Ge, Ti, Zr, Al, or Ga; and x is 1–6. An... | 10/11/2005 |
| 6953375 | Manufacturing method of a field emission display having porous silicon dioxide insulating layer A field emission display includes a substrate and a plurality of emitters formed on columns on the substrate. The display also includes a porous dielectric layer formed on the substrate and the columns. The porous dielectric layer has an opening formed about each of... | 10/11/2005 |
| 6951220 | Method of decontaminating equipment A method of performing decontamination of a chamber for use in an IC fabrication system includes providing wet oxygen or a mixture comprising hydrochloric gas and oxygen in the chamber and raising the temperature in the chamber from a first lower temperature to a se... | 10/04/2005 |
| 6951765 | Method and apparatus for introduction of solid precursors and reactants into a supercritical fluid reactor The present invention pertains to apparatus and methods for introduction of solid precursors and reactants into a supercritical fluid reactor. Solids are dissolved in supercritical fluid solvents in generator apparatus separate from the supercritical fluid reactor. ... | 10/04/2005 |
| 6949415 | Module with adhesively attached heat sink A method and structure to adhesively couple a cover plate to a semiconductor device. A semiconductor device is electrically coupled to a substrate. A stiffener ring surrounding the semiconductor device is adhesively coupled to the substrate. A cover plate is adhesiv... | 09/27/2005 |
| 6949271 | Dust repellant compositions Sprayable, liquid polymeric film-forming compositions containing an amount of an anti-static polymer that is effective to provide films formed from the composition with resistance to the deposition of dust, soil or grime on the surface thereof, wherein the surface t... | 09/27/2005 |
| 6949330 | Multiple level photolithography A method is provided for performing photolithography on a substrate which has a first region on a lower level and a second region on an upper level, wherein a first pattern area exists within said first region, a second pattern area exists within said second region,... | 09/27/2005 |
| 6946396 | Maleic acid and ethylene urea containing formulation for removing residue from semiconductor substrate and method for cleaning wafer A semiconductor wafer cleaning formulation for use in semiconductor fabrication comprising maleic acid and ethylene urea as essential components. The preferred formulation comprises maleic acid, ethylene urea, at least one carboxylic acid except maleic acid, at leas... | 09/20/2005 |
| 6946431 | Cleaning solution including aqueous ammonia solution, acetic acid and deionized water for integrated circuit devices and methods of cleaning integrated circuit devices using the same Cleaning solutions for integrated circuit devices and methods of cleaning integrated circuit devices using the same are disclosed. The cleaning solution includes about 30% aqueous ammonia solution, acetic acid by a volume percent higher then a volume percent of the ... | 09/20/2005 |
| 6946055 | Method for recovering an organic solvent from a waste stream containing supercritical CO2 An organic solvent is separated from a waste stream containing supercritical CO2, an organic solvent and etchant contaminants. The process includes separating the supercritical CO2 by subjecting the waste stream to elevated temperature and/or r... | 09/20/2005 |
| 6946052 | Separating apparatus and processing method for plate member This invention is to guarantee that in separating a plate member such as a bonded substrate stack, a fluid is injected to an appropriate portion of the plate member. While a bonded substrate stack (50) is rotated, the vertical position of its peripheral porti... | 09/20/2005 |
| 6946036 | Method and device for removing particles on semiconductor wafers The method for removing particles that adhere to the surface of semiconductor wafers is constituted so as to sequentially carry out a first cleaning process in which semiconductor wafers 100 are cleaned for a prescribed time in cleaning tank 104 contai... | 09/20/2005 |
| 6943139 | Removal of particle contamination on patterned silicon/silicon dioxide using supercritical carbon dioxide/chemical formulations A cleaning composition for cleaning particulate contamination from small dimensions on semiconductor substrates. The cleaning composition contains supercritical CO2 (SCCO2), alcohol, fluoride source and, optionally, hydroxyl additive. Such cleaning compos... | 09/13/2005 |
| 6943142 | Aqueous stripping and cleaning composition The present invention relates to aqueous compositions used to remove post etch organic and inorganic residue as well polymeric residues and contaminants from semiconductor substrates. The compositions are comprised of a water soluble organic solvent, a sulfonic acid... | 09/13/2005 |
| 6944254 | Pressurized water reactor shutdown method A reactor coolant system of a pressurized water nuclear reactor with fuel assemblies in the core is simultaneously shutdown and decontaminated in less than 90 hours after the shutdown is initiated. A LOMI or Can-Derem decontamination reagent is added to reactor cool... | 09/13/2005 |
| 6943115 | Semiconductor device and method of manufacture thereof A method is provided for manufacturing a semiconductor device having a multilayer wiring structure in which at least one insulating film is formed with a set of conducting portions which are electrically connected to each other to have a surface area of no less than... | 09/13/2005 |
| 6939816 | Method to improve the uniformity and reduce the surface roughness of the silicon dielectric interface The instant invention is a method for forming a smooth interface between the upper surface of a silicon substrate and a dielectric layer. The invention comprises forming a thin amorphous region (180) on the upper surface (170) of a silicon substrate pr... | 09/06/2005 |
| 6939410 | Apparatus and method for collecting impurities on a semiconductor wafer An apparatus for collecting impurities on a semiconductor wafer includes an airtight process chamber, a rotary chuck disposed in the process chamber for rotating and horizontally supporting the semiconductor wafer, a first scanning unit for forming a droplet of a fi... | 09/06/2005 |
| 6937691 | X-ray fluorescence spectrometric system and a program for use therein An X-ray fluorescence spectrometric system includes a sample pre-treatment apparatus 10 for retaining on a surface of a substrate a substance to be measured that is found on the surface of the substrate, after such substance has been dissolved and subsequentl... | 08/30/2005 |
| 6936113 | Method for removing polymer films in the manufacture of aqueous compositions containing acrylates copolymer This invention relates to a method to facilitate the removal of adherent polymeric films from a hard surface occasioned by the evaporation of solvent from compositions containing an anionic acrylates copolymer, the method comprising incorporating a phosphate ester s... | 08/30/2005 |
| 6933665 | Structure and method for field emitter tips Improved methods and structures are provided for an array of vertical geometries which may be used as emitter tips, as a self aligned gate structure surrounding field emitter tips, or as part of a flat panel display. The present invention offers controlled size in e... | 08/23/2005 |
| 6932003 | Mobile furnace and method of facilitating removal of material from workpieces A method for removing foreign material such as paints and coatings from workpieces using a mobile furnace. The workpieces are flash heated so that only the surface is heated to remove the coatings without heating the core of the workpieces. Deformation of the workpi... | 08/23/2005 |
| 6932915 | System and method for integrated oxide removal and processing of a semiconductor wafer An integrated oxide removal and processing system (10) includes a process module (30) that may intentionally add at least one film layer to a single semiconductor wafer (32). The integrated oxide removal and processing system (10) also in... | 08/23/2005 |
| 6929703 | Detergent, cleaning method and cleaning apparatus An environmental friendly cleaning method is provided. The method comprises the step of cleaning an article using a composition comprising material extracted from the fruit of a plant of the genus Garcinia, for example the fruit of the plant Garcinia atrov... | 08/16/2005 |
| 6928746 | Drying resist with a solvent bath and supercritical CO2 A method for drying an object, having a polymeric film, wherein the object is submerged in a rinse liquid. The object is removed from the rinse liquid and the object is placed in a solvent bath before a sufficient amount of the rinse liquid can evaporate from the ob... | 08/16/2005 |
| 6926012 | Method for supercritical processing of multiple workpieces An apparatus for supercritical processing of multiple workpieces comprises a transfer module, first and second supercritical processing modules, and a robot. The transfer module includes an entrance. The first and second supercritical processing modules are coupled ... | 08/09/2005 |
| 6927198 | Methods and apparatus for cleaning semiconductor substrates after polishing of copper film A cleaning solution, method, and apparatus for cleaning semiconductor substrates after chemical mechanical polishing of copper films is described. The present invention includes a cleaning solution which combines deionized water, an organic compound, and a fluoride ... | 08/09/2005 |
| 6926836 | Treatment of iron sulphide deposits Treating a water system containing or in contact with a metal sulphide scale to inhibit, prevent, reduce, dissolve or disperse iron sulphide deposits. A solution of tris(hydroxyorgano)phosphines (THP) and tetrakis(hydroxyorgano)phosphonium salts (THP+ sal... | 08/09/2005 |
| 6921443 | Process for producing stainless steel with improved surface properties A process for treating a stainless steel strip in an electrolytic tank produces a stainless steel with improved surface properties. The process subjects the stainless steel to a bright annealing process, followed by an electro-chemical treatment stage at current den... | 07/26/2005 |
| 6921494 | Backside etching in a scrubber A scrubber device is provided. The scrubber device may etch a backside of a wafer and may clean a frontside of the wafer simultaneously. The scrubber device may comprise a programmed controller adapted to supply a non-etching fluid to a frontside of the wafer whenev... | 07/26/2005 |
| 6921515 | Apparatus for chemical decontamination In a chemical decontamination apparatus, a catalyst decomposition column in an upstream side of an ion exchange resin column and a hydrogen peroxide injection apparatus in a further upstream side, reduce the amount of waste products caused by a chemical decontaminat... | 07/26/2005 |
| 6916429 | Process for removing aluminosilicate material from a substrate, and related compositions A process for removing aluminosilicate-based material (e.g., “CMAS”) from a substrate is described. The material is treated with an aqueous composition containing at least one acid having the formula HxAF6, in which A is Si, Ge, Ti, Zr, Al,... | 07/12/2005 |
| 6916233 | Polishing and cleaning compound device A polishing and cleaning compound device is provided which polishes and cleans a work piece in series, wherein cleaning is started while the polishing is being terminated. Thus, the polishing and cleaning compound device includes a polishing device unit having a pai... | 07/12/2005 |
| 6914039 | Etching liquid composition The invention provides etching liquid compositions for transparent conducting films wherein foaming is suppressed and residues do not occur after etching. The etching liquid compositions include an etching liquid for transparent conducting films and one or more comp... | 07/05/2005 |
| 6908892 | Photoresist remover composition The present invention is a photoresist remover composition used in order to remove photoresist during the manufacturing process of semiconductor devices, such as large-scale integrated circuits and very large-scale integrated circuits. The present invention comprise... | 06/21/2005 |
| 6908628 | Disinfectant and antiseptic composition Wide spectrum disinfecting and antiseptic composition for use in the fields of human medicine, veterinary science and industry, characterized because it includes: Hydrogen peroxide, lactic acid and halogen salts (Br, I) and/or salts of heavy metals (for examp... | 06/21/2005 |
| 6905550 | Method of removing organic materials using aqueous cleaning solutions Removal of water-insoluble organic residues from inorganic surfaces can be accomplished in aqueous cleaning solutions containing an oxidant at a preselected temperature wherein the pH is adjusted with respect to the isoelectric point of the surface material to be re... | 06/14/2005 |
| 6905555 | Methods for transferring supercritical fluids in microelectronic and other industrial processes A method of displacing a supercritical fluid from a pressure vessel (e.g., in a microelectronic manufacturing process), with the steps of: providing an enclosed pressure vessel containing a first supercritical fluid (said supercritical fluid preferably comprising ca... | 06/14/2005 |
| 6905556 | Method and apparatus for using surfactants in supercritical fluid processing of wafers A method of delivering a reagent to a wafer is provided. A solvent is provided. A set of conditions of temperature and pressure is provided to the solvent, which is sufficient to bring the solvent to supercritical conditions. A reagent is provided. A surfactant is p... | 06/14/2005 |
| 6905974 | Methods using a peroxide-generating compound to remove group VIII metal-containing residue A method for cleaning substrates to remove Group VIII metal-containing, particularly platinum-containing, residue using a cleaning composition that includes a peroxide-generating compound. ... | 06/14/2005 |