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3M employee and church chorister Art Fry needed something to temporarily mark pages in his hymnal. He was in luck because his colleague, Spencer Silver, accidentally developed a glue that was too weak for other purposes. After initially discouraging consumer response, Post-it Notes became a hit in 1979.
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| Number | Title | Issue Date |
| 7261847 | Process for the functional regeneration of the porosity of moulds used for moulding ceramic objects A process for the functional regeneration of the porosity of the materials used to make molds (2) for moulding ceramic objects, when the pores have been damaged by use of the mold (2), comprises the sequential execution of at least two successive steps... | 08/28/2007 |
| 7255114 | Ion sampling system for wafer An ion sampling method for wafer provides a wafer in a sampling chamber, wherein the wafer surface that is going to be sampled faces upward; spraying an extraction liquid continuously on the wafer surface to form a liquid film thereon; keeping the thickness of the f... | 08/14/2007 |
| 7255749 | Substrate cleaning method and substrate cleaning apparatus In a cleaning treatment of a substrate using an aqueous solution of ammonium fluoride or a mixture of an aqueous solution of ammonium fluoride and hydrofluoric acid as a cleaning liquid, the cleaning liquid is replenished by at least one liquid selected from the gro... | 08/14/2007 |
| 7255772 | High pressure processing chamber for semiconductor substrate A high pressure chamber comprises a chamber housing, a platen, and a mechanical drive mechanism. The chamber housing comprises a first sealing surface. The platen comprises a region for holding the semiconductor substrate and a second sealing surface. The mechanical... | 08/14/2007 |
| 7252098 | Apparatus for cleaning and drying substrates A method and apparatus for cleaning, rinsing and Marangoni drying substrates is provided. A line of fluid is sprayed along a substrate surface forming an air/fluid interface line, and a line of drying vapor is supplied to the interface line to achieve Marangoni dryi... | 08/07/2007 |
| 7252801 | Method for controlling in cooling towers A method of controlling Legionella bacteria in cooling water systems is described. The method involves the heating of recirculating cooling water to temperatures of 70° C. for sufficient time to kill the bacteria. The method functions best in combination wit... | 08/07/2007 |
| 7253106 | Manufacturable CoWP metal cap process for copper interconnects A method to electrolessly plate a CoWP alloy on copper in a reproducible manner that is effective for a manufacturable process. In the method, a seed layer of palladium (Pd) is deposited on the copper by an aqueous seeding solution of palladium acetate, acetic acid ... | 08/07/2007 |
| 7252095 | Mobile flushing unit and process In one embodiment of the invention, a method of cleaning a workpiece is disclosed. The method comprises providing a mobile flushing unit and servicing the workpiece as follows: a) connecting a flexible hose of the mobile flushing unit to one end of the workpiece and... | 08/07/2007 |
| 7250085 | Method of wet cleaning a surface, especially of a material of the silicon-germanium type Method of wet cleaning a surface of at least one material chosen from silicon, silicon-germanium alloys, A(III)/B(V)-type semiconductors and epitaxially grown crystalline materials, such as germanium, in which method the following successive steps are carried out: | 07/31/2007 |
| 7250391 | Cleaning composition for removing resists and method of manufacturing semiconductor device The cleaning composition for removing resists includes a salt of hydrofluoric acid and a base not containing a metal (A component), a water-soluble organic solvent (B1 component), at least one organic acid or inorganic acid (C component), water (D component), and, o... | 07/31/2007 |
| 7250369 | Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same Provided are a metal-polishing liquid that comprises an oxidizing agent, an oxidized-metal etchant, a protective film-forming agent, a dissolution promoter for the protective film-forming agent, and water; a method for producing it; and a polishing method of using i... | 07/31/2007 |
| 7250114 | Methods of finishing quartz glass surfaces and components made by the methods Methods of surface finishing a component useful for a plasma processing apparatus are provided. The component includes at least one plasma-exposed quartz glass surface. The method includes mechanically polishing, chemically etching and cleaning the plasma-exposed su... | 07/31/2007 |
| 7250374 | System and method for processing a substrate using supercritical carbon dioxide processing A method and system for processing a substrate in a film removal system. The method includes providing the substrate in a substrate chamber of a film removal system, where the substrate has a micro-feature containing a dielectric film on a sidewall of the micro-feat... | 07/31/2007 |
| 7247208 | Microelectronic cleaning compositions containing ammonia-free fluoride salts Ammonia-free, HF-free cleaning compositions for cleaning photoresist and plasma ash residues from microelectronic substrates, and particularly to such cleaning compositions useful with and having improved compatibility with microelectronic substrates characterized b... | 07/24/2007 |
| 7247579 | Cleaning methods for silicon electrode assembly surface contamination removal Silicon electrode assembly decontamination cleaning methods and solutions, which control or eliminate possible chemical attacks of electrode assembly bonding materials, comprise ammonium fluoride, hydrogen peroxide, acetic acid, optionally ammonium acetate, and deio... | 07/24/2007 |
| 7243718 | Methods for locating formation fractures and monitoring well completion using streaming potential transients information Earth formations are characterized by using an array of electrodes which can measure streaming potentials in the formation, and by interpreting the data obtained by the electrodes. The electrodes are placed on a wireline tool, a LWD tool, or in a fixed manner about ... | 07/17/2007 |
| 7243911 | Substrate treating apparatus A substrate treating apparatus for performing a predetermined treatment of substrates includes a treating tank for storing a treating solution, a holder for holding a plurality of substrates arranged in one direction inside the treating tank, and a bubble generating... | 07/17/2007 |
| 7241920 | Filterable surfactant composition An improved aqueous soluble surfactant which has particular utility for incorporating in etchants for semiconductor devices is provided. The surfactant comprises a combination of a linear perfluorocarboxylic acid, a cyclic amine and an aliphatic alcohol. ... | 07/10/2007 |
| 7238291 | Method for removing oxides from a Ge semiconductor substrate surface This invention relates to a method for removing oxides from the surface of a Ge semiconductor substrate comprising the step of subjecting the surface to a Ge oxide etching solution characterized in that the Ge oxide etching solution removes Ge oxides and Ge sub-oxid... | 07/03/2007 |
| 7235153 | System for removal of a spacer The present disclosure provides a system for removing a spacer, such as associated with a processing operation using a lightly doped drain (LDD) region. In one example, the system includes means for creating a spacer, means for implanting a first relatively heavily ... | 06/26/2007 |
| 7235188 | Aqueous phosphoric acid compositions for cleaning semiconductor devices The present invention relates to dilute aqueous solutions containing phosphoric acid and methods for cleaning plasma etch residue from semiconductor substrates including such dilute aqueous solutions. The solution according to the invention may advantageous contain ... | 06/26/2007 |
| 7235479 | Organic solvents having ozone dissolved therein for semiconductor processing utilizing sacrificial materials A method of fabricating a semiconductor device. The method comprises creating a via in a dielectric layer that is formed on a substrate, filling the via, and optionally, the surface of the dielectric layer with a sacrificial material, patterning a first photoresist ... | 06/26/2007 |
| 7232528 | Surface treatment agent for copper and copper alloy The surface treatment agent for copper and copper alloys contains hydrogen peroxide, a mineral acid, an azole compound, silver ion and a halide ion. The surface treatment agent for copper and copper alloys is useful in the production of printed wiring boards in elec... | 06/19/2007 |
| 7233042 | Method of forming inside rough and outside smooth HSG electrodes and capacitor structure A container capacitor and method of forming the container capacitor are provided. The container capacitor comprises a lower electrode fabricated by forming a layer of doped polysilicon within a container in an insulative layer disposed on a substrate; forming a barr... | 06/19/2007 |
| 7228865 | FRAM capacitor stack clean An embodiment of the invention is a method of cleaning a material stack 2 that has a hard mask top layer 8. The method involves cleaning the material stack 2 with a fluorine-based plasma etch. The method further involves rinsing the material sta... | 06/12/2007 |
| 7229506 | Process for pickling martensitic or ferritic stainless steel A process for pickling martensitic or ferritic stainless steel, preferably in the form of wires, tubes or rods, wherein the stainless steel is placed in contact with a pickling solution which has a temperature in the range 15 to 29° C. and contains 50 to 120 g/l of... | 06/12/2007 |
| 7226513 | Silicon wafer cleaning method This invention provides a cleaning method of silicon wafer for obtaining a silicon wafer in which micro roughness thereof under spatial frequency of 20/μm is 0.3 to 1.5 nm3 in terms of power spectrum density, by passing a process of oxidizing the silicon... | 06/05/2007 |
| 7220322 | Cu CMP polishing pad cleaning A polishing pad is cleaned of Cu CMP by-products, subsequent to planarizing a wafer, to reduce pad-glazing by applying to the polishing pad surface a composition comprising about 0.1 to about 3.0 wt. % of at least one organic compound having one or more amine or ami... | 05/22/2007 |
| 7216653 | Cleaning solution and cleaning method of a semiconductor device A cleaning method for removing foreign bodies during the fabrication of semiconductor devices including treating a substrate with a cleaning solution including an oxidizer to form a chemical oxide layer and then removing the chemical oxide layer, thereby removing fo... | 05/15/2007 |
| 7217464 | Method of manufacturing electrodeposited copper foil with carrier foil for high-temperature heat-resistance and electrodeposited copper foil with carrier foil for high-temperature heat-resistance obtained by the manufacturing method The object is to provide a method of manufacturing electrodeposited copper foil with a carrier foil for high-temperature heat-resistance in which the peeling of the carrier foil is easy even by press working at temperatures of not less than 200°C. For this purpose ... | 05/15/2007 |
| 7211200 | Manufacture and cleaning of a semiconductor Metal nitride and metal oxynitride extrusions often form on metal silicides. These extrusions can cause short circuits and degrade processing yields. The present invention discloses a method of selectively removing such extrusions. In one embodiment, a novel wet etc... | 05/01/2007 |
| 7211553 | Processing of substrates with dense fluids comprising acetylenic diols and/or alcohols A dense cleaning fluid for removing contaminants from a substrate and a method comprising same is disclosed herein. In one embodiment of the present invention, the dense cleaning fluid comprises a dense fluid and at least one acetylenic diol or acetylenic alcohol su... | 05/01/2007 |
| 7211923 | Rotational motion based, electrostatic power source and methods thereof A power system includes a member with two or more sections and at least one pair of electrodes. Each of the two or more sections has a stored static charge. Each of the pair of electrodes is spaced from and on substantially opposing sides of the member from the othe... | 05/01/2007 |
| 7211156 | Method for cleaning a ceramic member for use in a system for producing semiconductors, a cleaning agent and a combination of cleaning agents The present invention provides a method for cleaning a ceramic member for use in a system for producing semiconductors. The method has the step of cleaning the ceramic member with an organic acid or a weak acid. Preferably, the ceramic member is cleaned with a stron... | 05/01/2007 |
| 7208455 | Method to increase electromigration resistance of copper using self-assembled organic thiolate monolayers Methods and solutions for forming self assembled organic monolayers that are covalently bound to metal interfaces are presented along with a device containing a self assembled organic monolayer. Embodiments of the present invention utilize self assembled thiolate mo... | 04/24/2007 |
| 7208454 | Cleaning solution for removing anti-reflective coating composition A cleaning solution for a cured anti-reflective layer (AFC layer) component and a method of cleaning an anti-reflective layer component by using the same, wherein the cleaning solution comprises about 5–30% by weight of ammonium hydroxide, about 23–70% by weight... | 04/24/2007 |
| 7208049 | Process solutions containing surfactants used as post-chemical mechanical planarization treatment Process solutions comprising one or more surfactants are used to reduce the number of defects in the manufacture of semiconductor devices. In certain preferred embodiments, the process solution of the present invention may reduce defects when employed as a rinse sol... | 04/24/2007 |
| 7208411 | Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module A method of depositing a metal film on a substrate includes a supercritical preclean step, a supercritical desorb step, and a metal deposition step. Preferably, the preclean step comprises maintaining supercritical carbon dioxide and a chelating agent in contact wit... | 04/24/2007 |
| 7204889 | Method of reducing water spotting and oxide growth on a semiconductor structure The present invention relates to a method of cleaning and drying a semiconductor structure in a modified conventional gas etch/rinse or dryer vessel. ... | 04/17/2007 |
| 7205265 | Cleaning compositions and methods of use thereof A remover composition and method for removing resists from substrates containing nucleophilic amine and at least one solvent is described. Optionally, a chelating agent can also be included in the remover composition. The remover composition is especially suitable f... | 04/17/2007 |
