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| Number | Title | Issue Date |
| 6660102 | Method of decoating a turbine blade A method is directed toward decoating a parent body, provided with an anti-corrosion coating, of a turbine blade. An outer part of the anti-corrosion coating is removed abrasively by a water jet. An inner part of the anti-corrosion coating is then removed... | 12/09/2003 |
| 6656897 | Enamel safe cleaning process The present invention describes a process of cleaning an enamel surface with a liquid acidic composition comprising an enamel safe acid wherein the pKa of said acid is 3.5 or higher, with the proviso that non mono-lower alkyl ethers or phenyl e... | 12/02/2003 |
| 6656895 | Remover composition A remover composition comprising (a) 100 parts by weight of a composition obtained by adding a cyclic urea compound to water, water-soluble organic solvent, or a mixture of water and water-soluble organic solvent so that the concentration of the cyclic ... | 12/02/2003 |
| 6656289 | Method of reducing water spotting and oxide growth on a semiconductor structure The present invention relates to a method of cleaning and drying a semiconductor structure in a modified conventional gas etch/rinse or dryer vessel.... | 12/02/2003 |
| 6655395 | Method and device for scouring and cleaning rolled steel strip A device for pickling or cleaning rolled steel strip which is moved in the form of loops through several pickling and cleaning containers arranged within a treatment line, wherein at least one strip side is subjected tot he action of a pickling or cleanin... | 12/02/2003 |
| 6652661 | Radioactive decontamination and translocation method A method for removing a wide variety of radioactive contaminants from a contaminated surface sufficient for the surface to be classified as a low-level waste or as free release. Contaminated surfaces may be classified as Class C, Class B, Class A, or high... | 11/25/2003 |
| 6652659 | Low species buffered rinsing fluids and method A method of rinsing an electronic substrate recognizes that adding a buffer to a rinsing fluid eliminates fluctuations in the amount of residues on an electronic substrate, and a buffered rinsing fluid is prepared by (a) providing water from a water sourc... | 11/25/2003 |
| 6645926 | Fluoride cleaning masking system The present invention relates to a maskant system for use with a fluoride cleaning system. The maskant system comprises a parting compound applied to a surface which requires protection and a chromium rich maskant for substantially preventing intergranula... | 11/11/2003 |
| 6645306 | Hydrogen peroxide pickling scheme for stainless steel grades The present invention relates to a process for pickling hot rolled, hot rolled & annealed, and cold rolled & annealed stainless steel strip in a continuous fashion. The process comprises a series of pre-pickling tanks and pickling tanks, and optionally in... | 11/11/2003 |
| 6641740 | Method for combating hard water and scale by using algins The deleterious effects of metal ions in water, for example water hardness and formation of deposits, may be combated by application of an algin, for example alginic acid or a salt of alginic acid, such as sodium alginate or potassium alginate. Such a com... | 11/04/2003 |
| 6641678 | Methods for cleaning microelectronic structures with aqueous carbon dioxide systems A method of cleaning and removing water and entrained solutes during a manufacturing process from a microelectronic device such as a resist-coated semiconductor substrate, a MEM's device, or an optoelectronic device comprising the steps of: (a) providing ... | 11/04/2003 |
| 6641675 | Method and apparatus for immersion treatment of semiconductor and other devices Method and apparatus for cleaning semiconductor devices and other workpieces using an aqueous rinse solution which is de-oxygenated by passing the aqueous rinse solution and a carrier gas through an osmotic membrane degasifier. A cleaning chamber is also ... | 11/04/2003 |
| 6642199 | Composition for stripping nickel from substrates and process A nickel stripping composition is disclosed. The composition can be contacted with a nickel plated article in an aqueous solution in order to remove the nickel. In accordance with the present invention, besides an oxidizing agent, the composition includes... | 11/04/2003 |
| 6641677 | Method of reducing water spotting and oxide growth on a semiconductor structure The present invention relates to a method of cleaning and drying a semiconductor structure in a modified conventional gas etch/rinse or dryer vessel. In a first embodiment of the present invention, a semiconductor structure is placed into a first treatmen... | 11/04/2003 |
| 6638365 | Method for obtaining clean silicon surfaces for semiconductor manufacturing A method of preparing a silicon surface for a subsequent processing said such as thermal oxidation, or metal silicide formation, via use of a novel wet chemical clean procedure, has been developed. The novel wet chemical clean procedure is comprised of th... | 10/28/2003 |
| 6638145 | Constant pH polish and scrub A system and method are provided that maintains a high pH at the wafer surface through the entire polish process and then lowers the pH only when necessary in a controlled fashion after CMP and during the post-polish clean. A fluid having a high pH chemis... | 10/28/2003 |
| 6635232 | Method of chemically decontaminating components of radioactive material handling facility and system for carrying out the same Ozone gas having a high ozone concentration is generated by a solid electrolyte electrolytic process. An ozone solution is prepared by injecting the ozone gas into an acidic solution of pH 6 or below. The ozone solution heated at a temperature in the rang... | 10/21/2003 |
| 6632292 | Selective treatment of microelectronic workpiece surfaces This invention provides a process for treating a workpiece having a front side, a back side, and an outer perimeter. In accordance with the process, a processing fluid is selectively applied or excluded from an outer peripheral margin of at least one of t... | 10/14/2003 |
| 6632291 | Methods and compositions for cleaning, rinsing, and antimicrobial treatment of medical equipment The present invention relates to methods for cleaning, rinsing, and/or antimicrobial treatment of medical carts, medical cages, and other medical instruments, devices or equipment. The method for cleaning employs a solid alkaline, for example a solid carb... | 10/14/2003 |
| 6632289 | Substrate cleaning method and substrate cleaning apparatus A to-be-cleaned substrate is cleaned by use of an acid liquid agent in a cleaning cup, the remaining acid liquid agent is washed out by use of pure water, then an alkaline liquid agent is emitted to the surface of the to-be-cleaned substrate in the same c... | 10/14/2003 |
| 6627001 | Method for cleaning a semiconductor wafer A semiconductor wafer cleaning method is provided. After cleaning the wafer with a chemical cleaning solution, the wafer is placed in a cleansing tank that fills with deionized water. A neutralizer is then added to the cleansing tank. The surface of the w... | 09/30/2003 |
| 6624127 | Highly polar cleans for removal of residues from semiconductor structures Supercritical carbon dioxide may be utilized to remove resistant residues such as those residues left when etching dielectrics in fluorine-based plasma gases. The Supercritical carbon dioxide may include an ionic liquid in one embodiment.... | 09/23/2003 |
| 6624078 | Methods for analyzing the effectiveness of wafer backside cleaning A method for using a monitor substrate to determine effectiveness of a cleaning operation is provided. The method includes selecting a substrate from a lot of substrates and inspecting a surface of the substrate to determine a roughness profile of the sub... | 09/23/2003 |
| 6624086 | Effective solution and process to wet-etch metal-alloy films in semiconductor processing A solution and method is described for etching TaN, TiN, Cu, FSG, TEOS, and SiN on a silicon substrate in silicon device processing. The solution is formed by combining HF at 49% concentration with H2 O2 at 29%-30% concentration in d... | 09/23/2003 |
| 6620743 | Stable, oxide-free silicon surface preparation Methods are provided for producing a hydrogen-terminated silicon wafer surface with high stability against oxidation. The silicon wafer is cleaned with ammonium hydroxide/hydrogen peroxide/water, etched with high purity, heated dilute hydrofluoric acid, r... | 09/16/2003 |
| 6620340 | Method for providing a corrosion inhibiting solution The invention is directed to a method for providing a corrosion inhibiting aqueous solution which includes zinc orthophosphate where the zinc orthophosphate is solubilized. The invention is directed to a method of making a substantially contaminant-free, ... | 09/16/2003 |
| 6616773 | Substrate treatment method A substrate treatment assembly for treating a work object on a surface of a substrate by supplying to the work object a wet ozone-containing gas wetted with a treatment solution includes a substrate heating device for maintaining a substrate at a temperat... | 09/09/2003 |
| 6613157 | Methods for removing particles from microelectronic structures A method of cleaning and removing solid particles during a manufacturing process from a microelectronic device such as a resist-coated semiconductor substrate, a MEM's device, or an optoelectronic device comprising the steps of: (a) providing a partially ... | 09/02/2003 |
| 6613376 | Storage stable pan release coating and cleaner The pan release coating is provided which includes water, mono and diclycerides, polysorbate, and an antimicrobial effective amount of acetic acid, citric acid and sodium benzoate. Desirably, the composition of the present invention is composed of water i... | 09/02/2003 |
| 6613153 | Method for reducing the radioactivity of metal part The radioactivity of a metal part is reduced in the process. In the method, firstly a layer of oxide is removed from the metal part using a decontamination solution. Then, an agent which has an oxidizing action and is still present is removed from the dec... | 09/02/2003 |
| 6610152 | Method for removing inorganic matter from solid surfaces Metal ions are removed from solid surfaces which may be contaminated with one or more radionuclides by contacting the solid surfaces with the supercritical fluid, as, for instance, carbon dioxide containing both an acidic ligand and organic amine. The met... | 08/26/2003 |
| 6607605 | Cleaning of semiconductor process equipment chamber parts using organic solvents A system and method are provided for using an organic solvent to clean chamber parts used in semiconductor manufacturing. The chamber parts are exposed to the solvent using a dipping system or a vapor contact system in order to soften or dissolve the orga... | 08/19/2003 |
| 6605230 | Solutions and processes for removal of sidewall residue after dry etching The present invention relates to a novel process for removing sidewall residue after dry-etching process. Conventionally, after dry-etching, photoresist and sidewall residues are removed by ozone ashing and hot sulfuric acid. Normally, they are hard to be... | 08/12/2003 |
| 6605158 | Radioactive decontamination and translocation method A method for removing radioactive contaminants from a given surface. An aqueous solution having a wetting agent and a complex substituted keto-amine is provided. The solution is left on the surface for a time sufficient to remove the radioactive contamina... | 08/12/2003 |
| 6605155 | Remover for scale deposited on titanium material A descaling composition for use in removing scale deposited on a member made of titanium or a titanium alloy, the descaling composition containing a hydroxycarboxylic acid, a sulfamic acid and ammonium sulfate as effective components and effectively inhib... | 08/12/2003 |
| 6602351 | Methods for the control of contaminants following carbon dioxide cleaning of microelectronic structures A method of cleaning and removing water and entrained solutes during a manufacturing process from a microelectronic device such as a resist-coated semiconductor substrate, a MEM's device, or an optoelectronic device comprising the steps of: (a) providing ... | 08/05/2003 |
| 6599371 | Hydrogen peroxide pickling scheme for silicon-containing electrical steel grades The pickling process of the present invention is designed for pickling electrical steel strip in a continuous fashion and comprises at least one pickling tank equipped with at least one set of sprayers designed to spray the top and bottom surfaces of a st... | 07/29/2003 |
| 6599370 | Stabilized alkaline compositions for cleaning microelectronic substrates The invention provides aqueous alkaline compositions useful in the microelectronics industry for stripping or cleaning semiconductor wafer substrates by removing photoresist residues and other unwanted contaminants. The compositions typically contain (a) ... | 07/29/2003 |
| 6596093 | Methods for cleaning microelectronic structures with cyclical phase modulation A method of cleaning and removing water, entrained solutes and particulate matter during a manufacturing process from a microelectronic device such as a resist-coated semiconductor substrate, a MEM's device, or an optoelectronic device comprising the step... | 07/22/2003 |
| 6596087 | Method of cleaning conditioning disk A conditioning disk and a conditioner for a chemical mechanical polishing (CMP) pad, and a method of fabricating, reworking, and cleaning the conditioning disk, are utilized to improve conditioning efficiency, and to reduce production expenses. The condit... | 07/22/2003 |
