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| Number | Title | Issue Date |
| 8123866 | Wafer manufacturing method and device The invention relates to a device for manufacturing semiconductor material wafers with a sawing device for the sawing of slices attached to a saw holder, a pre-cleaning device arranged in the process direction downstream of the sawing device for pre-cleaning the sur... | 02/28/2012 |
| 8083858 | Method and system for cleaning an artillery gun barrel The invention relates to a method for cleaning an artillery gun barrel, which is cleaned of gun oil, greases, or combustion residues using a washing liquid and a brush element. The brush element is moved backwards and forwards in the barrel with the aid of the washi... | 12/27/2011 |
| 8080110 | Method and system to stabilize and preserve iron artifacts A method, system and device to use a dilute alkaline solution held at sub-critical temperature and pressure conditions to remove rapidly chloride ions from corroded iron artifacts. ... | 12/20/2011 |
| 8075696 | Method of recovering heat transfer in reactor and regenerator effluent coolers This invention relates to a method for removing fouling from a heat transfer surface, such as a heat exchanger. The method involves conducting a vapor containing a scouring material to the heat transfer surface and contacting the scouring material with the foulant, ... | 12/13/2011 |
| 8075697 | Particle removal method and composition A method and cleaning solution for cleaning electronic substrates, such as a semiconductor wafers, hard disks, photomasks or imprint molds. The method comprises the steps of contacting a surface of the substrate with a cleaning solution comprised of a polyphosphate,... | 12/13/2011 |
| 8070882 | Method for the wet-chemical treatment of a semiconductor wafer A method for the wet-chemical treatment of a semiconductor wafer involves: a) rotating a semiconductor wafer; b) applying a cleaning liquid comprising gas bubbles having a diameter of 100 μm or less to the rotating wafer such that a liquid film forms on the wafer; ... | 12/06/2011 |
| 8062430 | Process for cleaning filters Filters used in the beverage industry fouled by polyphenol-protein complexes and carbohydrate polymers can be cleaned by treating the filters either with the following methods: Solubilization of at least part of the carbohydrate po... | 11/22/2011 |
| 8052800 | Method for the removal of an insulative coating using an aqueous solution comprising dimethyl formamide A method and aqueous composition are provided for removing at least a portion of a coating from the surface of a substrate. The coating comprises an insulative material, and is contacted with an aqueous composition. The aqueous composition comprises dimethyl formami... | 11/08/2011 |
| 8038798 | Method of and apparatus for cleaning substrate A substrate cleaning apparatus is capable of individually setting a threshold value for use in making a check of a resistivity during a rinsing process on a recipe setting screen in each process step. Thus, by setting each threshold value depending on the type of li... | 10/18/2011 |
| 8021490 | Substrate cleaning processes through the use of solvents and systems A method for removing common contaminates or residues which include but are not limited to ionic residues, particulate residues and moisture from semiconductor wafers used in the manufacture of IC (integrated circuits), liquid crystal displays and flat panel display... | 09/20/2011 |
| 8021491 | Method for selectively removing coatings from metal substrates A method for selectively removing an aluminum-poor overlay coating from a substrate of a component, which as a result of its low aluminum content is highly resistant to a selective stripping solution. The method entails diffusing aluminum into the overlay coating to... | 09/20/2011 |
| 7959739 | Particle removal cleaning method and composition A cleaning solution and method for removing submicron particles from the surface and/or the bevel of an electronic substrate such as a hard disk media substrate, or an imprint mold used in the manufacturing of the hard disk media or a read/write head assembly part. ... | 06/14/2011 |
| 7955440 | Method for cleaning silicon wafer and apparatus for cleaning the silicon wafer After a water film is formed on a wafer front surface in a chamber, the water film is supplied sequentially with an oxidizing component of an oxidation gas, an organic acid component of an organic acid mist, an HF component of an HF gas, the organic acid mist, and t... | 06/07/2011 |
| 7942975 | Ceramic sprayed member-cleaning method A ceramic sprayed member-cleaning method which is capable of reliably suppressing desorption and attachment of water. The surface of a ceramic sprayed member and water are chemically bonded to each other, whereby the water is stabilized. Water physically adsorbed on... | 05/17/2011 |
| 7942974 | Method of cleaning a film-forming apparatus A method of cleaning a film-forming apparatus to remove a silicon-based material deposited on a constituent member of the film-forming apparatus after being used to form thin films includes introducing a first gas including fluorine gas and a second gas including ca... | 05/17/2011 |
| 7887638 | Removal of niobium second phase particle deposits from pickled zirconium-niobium alloys The present invention relates generally to a process and chemical composition for the removal of adherent niobium-rich second-phase particles (SPPs) from pickled niobium-containing zirconium alloys which includes applying to the alloy surface a chemical composition ... | 02/15/2011 |
| 7828902 | Sodium-free, lithium-containing concrete cleaning compositions and method for use thereof Compositions for cleaning concrete or other cementitious substrates that do not contribute to the alkali-silicate reaction are provided, and methods for use thereof The cleaning compositions comprise lithium salts such as lithium hydroxide, lithium oxide and/or lith... | 11/09/2010 |
| 7736439 | Method for cleaning a polysilicon fraction The present invention relates to a method for cleaning polycrystalline silicon fragments to a metal content of | 06/15/2010 |
| 7691208 | Cleaning method In a process chamber of a substrate processing apparatus, such as an RTP apparatus, a carrier is placed and configured to carry out a contaminant that has been attached to it. In this state, a cleaning gas containing N2 and O2 is introduced int... | 04/06/2010 |
| 7682458 | Aqueous based residue removers comprising fluoride A composition and method comprising same for selectively removing residues such as, for example, ashed photoresist and/or processing residues are disclosed herein. In one aspect, there is provided a composition for removing residue wherein the composition has a pH r... | 03/23/2010 |
| 7678199 | Substrate cleaning method A method is provided for reducing the amount of film fragments discharged into a processing liquid circulation system during removal of films from wafers, thereby reducing the frequency of filter cleaning or filter replacement. The method includes exposing a wafer c... | 03/16/2010 |
| 7674339 | Method for the plasma cleaning of the surface of a material coated with an organic substance and the installation for carrying out said method The invention relates to a method of cleaning the surface of a material (4) that is coated with an organic substance. The inventive method is characterised in that it comprises the following steps, consisting in: introducing the material (4) into a tre... | 03/09/2010 |
| 7670438 | Method of removing particles from wafer A method of removing particles from a wafer is provided. The method is adopted after a process for removing unreactive metal of a salicide process or after a salicide process and having oxide residue remaining on a wafer or after a chemical vapor deposition (CVD) pr... | 03/02/2010 |
| 7641738 | Method of wet cleaning a surface, especially of a material of the silicon-germanium type A method of wet cleaning a surface is disclosed. The method of wet cleaning a surface of at least one material chosen from silicon, silicon-germanium alloys, A(III)/B(V)-type semiconductors and epitaxially grown crystalline materials, such as germanium, includes the... | 01/05/2010 |
| 7628866 | Method of cleaning wafer after etching process A method of cleaning a wafer after an etching process is provided. A substrate having an etching stop layer, a dielectric layer, a patterned metal hard mask sequentially formed thereon is provided. Using the patterned metal hard mask, an opening is defined in the di... | 12/08/2009 |
| 7556696 | Removal of niobium second phase particle deposits from pickled zirconium-niobium alloys The present invention relates generally to a process and chemical composition for the removal of adherent niobium-rich second-phase particles (SPPs) from pickled niobium-containing zirconium alloys which includes applying to the alloy surface a chemical composition ... | 07/07/2009 |
| 7503982 | Method for cleaning semiconductor substrate A method for cleaning a semiconductor substrate having a contact angle between the surface thereof and water dropped thereon of at least 70 degrees comprises contacting the semiconductor surface with a cleaning liquid composition including an aliphatic polycarboxyli... | 03/17/2009 |
| 7468105 | CMP cleaning composition with microbial inhibitor An antimicrobial cleaning composition and methods for cleaning semiconductor substrates, particularly after chemical mechanical planarization or polishing, are provided. In one embodiment, the cleaning composition combines a solvent, a cleaning agent such as a hydro... | 12/23/2008 |
| 7468106 | Removal of niobium second phase particle deposits from pickled zirconium-niobium alloys The present invention provides a method for removing niobium-rich second-phase-particle (SPP) deposits from zirconium-niobium alloy components. The method comprises washing a freshly pickled and rinsed zirconium-niobium alloy component with an acidified oxalic acid ... | 12/23/2008 |
| 7442675 | Cleaning composition and method of cleaning semiconductor substrate A cleaning composition comprises at least quaternary ammonium hydroxide, a water-soluble organic solvent, water, an anticorrosive, and potassium hydroxide of 1 mass percent or less of a total amount of the solution. This cleaning composition can singly and effective... | 10/28/2008 |
| 7435355 | Liquid-based gravity-driven etching-stop technique for controlling structure dimension A liquid-based gravity-driven etching-stop technique for controlling structure dimension is provided, where opposite etching trenches in cooperation with an etching-stop solution are used for controlling the dimension of a microstructure on the wafer level. In an em... | 10/14/2008 |
| 7435301 | Cleaning solution of silicon germanium layer and cleaning method using the same Disclosed are a cleaning solution for preventing damage of a silicon germanium layer when cleaning a semiconductor device including the silicon germanium layer and a cleaning method using the same. The cleaning solution of a silicon germanium layer includes from abo... | 10/14/2008 |
| 7431860 | Etching process A method for etching a pattern in a material in precise target areas comprising depositing selectively onto the material droplets of a substance for dissolving or reacting chemically with the material. Droplets may be deposited from a print head of the type having a... | 10/07/2008 |
| 7422639 | Method of reducing water spotting and oxide growth on a semiconductor structure The present invention relates to a method of cleaning and drying a semiconductor structure in a modified conventional gas etch/rinse or dryer vessel. ... | 09/09/2008 |
| 7417018 | Method of cleaning a solid surface by removing organic and/or mineral soils using a microemulsion The invention relates to a method of cleaning a solid surface comprising the following stages: a) the solid surface is cleaned using a microemulsion-type cleaning composition; e) the cleaned surface is drained; f) the drained surface is rinsed with an organic solven... | 08/26/2008 |
| 7416611 | Process and apparatus for treating a workpiece with gases In a method and apparatus for cleaning or processing a workpiece, a process gas is brought into contact with the workpiece by diffusion through a heated liquid layer on the workpiece, and by bulk transport achieved by entraining the gas in a liquid stream, spray or ... | 08/26/2008 |
| 7410543 | Substrate processing method Resists can be removed while metal contamination of wafers, etc. and generation of particles, and growth of oxide films are suppressed. A substrate processing method comprises feeding a processing gas, such as ozone gas, into a processing vessel to pressurize an atm... | 08/12/2008 |
| 7405189 | Surface treatment composition and method for removing Si component and reduced metal salt produced on the aluminum die cast material in etching process A surface treatment composition and method for removing Si and reduced metal salt produced during etching of an aluminum die cast material (“ALDC material”) without generation of nitrogen oxide (NOx) or hydrogen fluoride (HF). In surface treatment of an ALDC mat... | 07/29/2008 |
| 7404863 | Methods of thinning a silicon wafer using HF and ozone A method of thinning a silicon wafer in a controllable cost-effective manner with minimal chemical consumption. The wafer is placed into a process chamber, after which ozone gas and HF vapor are delivered into the process chamber to react with a silicon surface of t... | 07/29/2008 |
| 7402213 | Stripping and removal of organic-containing materials from electronic device substrate surfaces Described herein is a method of removing an organic-containing material from an exposed surface of a large substrate (at least 0.25 m2). The substrate may comprise an electronic device. The exposed surface is treated with a stripping solution comprising o... | 07/22/2008 |
