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Class 134/1.3 - Semiconductor cleaning


Subclass of Class 134 - Cleaning and liquid contact with solids
Definition: Process wherein the work is a semiconductive precursor,
No. of patents: 1089
Last issue date: 04/24/2012


                    28  
NumberTitleIssue Date
4987008Thin film formation method
Film formation without damage on the surface of semiconductor can be established by generating active halogen or active hydrogen by a photochemical reaction, cleaning on the surface of the semiconductor by removing oxide formed thereon by means of the act...
01/22/1991
4836902Method and apparatus for removing coating from substrate
In a method and apparatus for plasma stripping a polymer photoresist coating from a semiconductor substrate, ultraviolet radiation generated as a byproduct of plasma generation is absorbed by a baffle placed between a plasma source and the substrate. The ...
06/06/1989
4752505Pre-metal deposition cleaning for bipolar semiconductors
A pre-metal deposition cleaning process for bipolar semiconductors includes a two step boron glass etching procedure: a chemical etchant consisting of DI, H2 SO4, HNO3 and HCl (500:65:325:163) heated to 80 deg. C. followed...
06/21/1988
4749440Gaseous process and apparatus for removing films from substrates
A process for removing at least a portion of a film from a substrate, such as a wafer of silicon or other similar materials, the film on the substrate typically being an oxide film, maintaining the atmosphere embracing the substrate at near room temperatu...
06/07/1988
4555303Oxidation of material in high pressure oxygen plasma
A process is disclosed for removing carbonaceous material from a surface in a high pressure oxygen plasma. A surface, such as a surface of a silicon ribbon, having a layer of carbonaceous material thereon is positioned in a high pressure plasma reaction v...
11/26/1985
4292093Method using laser irradiation for the production of atomically clean crystalline silicon and germanium surfaces
This invention relates to a new method for removing surface impurities from crystalline silicon or germanium articles, such as off-the-shelf p- or n-type wafers to be doped for use as junction devices. The principal contaminants on such wafers are oxygen ...
09/29/1981
4075367Semiconductor processing of silicon nitride
A method of providing improved adherence of photoresist to a silicon nitride layer on a semiconductor wafer by first preparing a heated solution of trichlorophenylsilane, immersing the nitride coated wafer in the trichlorophenylsilane solution, drying and...
02/21/1978
3998653Method for cleaning semiconductor devices
A solution of potassium hydroxide is employed to remove the reaction products of aluminum migrated through silicon-semiconductor material by thermal gradient zone melting processing....
12/21/1976
3992233Surface treatment of III-V compound crystals
Group III-V compound substrates are heat cleaned under vacuum conditions by heating above their congruent temperature and subjecting the substrate to at least one molecular beam of the material preferentially evaporating from the substrate thereby maintai...
11/16/1976
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