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| Number | Title | Issue Date |
| 6951042 | Brush scrubbing-high frequency resonating wafer processing system and methods for making and implementing the same A substrate cleaning apparatus is provided. The apparatus includes a transducer capable of resonating at a high frequency and a brush material attached to a surface of the transducer. The brush material includes at least one passage extending to the surface of the t... | 10/04/2005 |
| 6949465 | Preparation process for semiconductor device According to this invention, residues generated after selectively removing a low-dielectric-constant film such as SiOC can be effectively removed without damage on an insulating film or metal film. Specifically, residues 126 and 128 generated after for... | 09/27/2005 |
| 6948504 | Ozonated water flow and concentration control method The invention features an apparatus and a method for supplying ozonated water to more than one process tool. Ozonated water of a first concentration received from an ozonated water generator and water received from a source are mixed to produce ozonated water of a s... | 09/27/2005 |
| 6949144 | Low pressure plasma processing apparatus and method There are provided a low pressure plasma processing apparatus and method by which a throughput can be improved, film contamination can be effectively prevented, and a film can be readily managed. A film substrate is carried in from the outside of a plasma processing... | 09/27/2005 |
| 6949146 | Ultrasonic cleaning module for singulated electronic packages The invention provides an ultrasonic cleaning module and a method for cleaning singulated electronic packages. The module comprises a cutting chuck having a surface with a plurality of cutting recesses defined in it for enabling a cutting device to separate individu... | 09/27/2005 |
| 6946035 | Method of cleaning substrate Dirt, particularly of inorganic matter, attached to a substrate, such as a glass substrate for liquid crystal devices, is effectively removed by irradiating the substrate with ultraviolet rays including 184.9 nm and 253.7 nm in an oxygene-containing atmosphere in ad... | 09/20/2005 |
| 6947613 | Wavelength selective switch and equalizer A device comprising a light modulator including a plurality of elements wherein each element is selectively operable such that the plurality of elements are dynamically configurable to combine selected ones of a plurality of grating periods such that selected portio... | 09/20/2005 |
| 6946431 | Cleaning solution including aqueous ammonia solution, acetic acid and deionized water for integrated circuit devices and methods of cleaning integrated circuit devices using the same Cleaning solutions for integrated circuit devices and methods of cleaning integrated circuit devices using the same are disclosed. The cleaning solution includes about 30% aqueous ammonia solution, acetic acid by a volume percent higher then a volume percent of the ... | 09/20/2005 |
| 6946774 | Segmented uniform energy megasonic transducer A transducer comprising an acoustic energy generating means and a resonator. The acoustic energy generating means generates acoustic energy and is adapted for delivering an approximately uniform amount of acoustic energy to each unit of surface area on a substrate i... | 09/20/2005 |
| 6946852 | Method and apparatus for measuring concentration of a chemical component in a gas mixture A chemical concentration detecting system for determining the relative concentration of a chemical component in a gas mixture. The gas mixture may include chemical components that are antimicrobial chemicals, as well as chemical components that are base chemicals, a... | 09/20/2005 |
| 6946396 | Maleic acid and ethylene urea containing formulation for removing residue from semiconductor substrate and method for cleaning wafer A semiconductor wafer cleaning formulation for use in semiconductor fabrication comprising maleic acid and ethylene urea as essential components. The preferred formulation comprises maleic acid, ethylene urea, at least one carboxylic acid except maleic acid, at leas... | 09/20/2005 |
| 6946399 | Cleaning system method and apparatus for the manufacture of integrated cicuits A semiconductor deposition system in accordance with the present invention includes a CMP apparatus operative to planarize an active surface of a semiconductor wafer, and a wafer cleaner for cleaning wafer after the CMP process. The wafer cleaner preferably includes... | 09/20/2005 |
| 6946036 | Method and device for removing particles on semiconductor wafers The method for removing particles that adhere to the surface of semiconductor wafers is constituted so as to sequentially carry out a first cleaning process in which semiconductor wafers 100 are cleaned for a prescribed time in cleaning tank 104 contai... | 09/20/2005 |
| 6943062 | Contaminant particle removal by optical tweezers The invention describes how contaminant particles may be removed from a surface without in any way damaging that surface. First, the positional co-ordinates of all particles on the surface are recorded. Optionally, only particles that can be expected to cause curren... | 09/13/2005 |
| 6938638 | Gas circulating-processing apparatus A gas-circulating processing apparatus which comprises a processing chamber, a gas feeding piping, a gas supply piping, a first exhaust mechanism discharging a gas from the processing chamber, a second exhaust mechanism discharging a portion of a gas discharged from... | 09/06/2005 |
| 6936540 | Method of polishing a semiconductor substrate, post-CMP cleaning process, and method of cleaning residue from registration alignment markings A post-CMP cleaning process includes brush cleaning a CMPed surface, followed by at least partially drying the CMPed surface, followed by spray cleaning the CMPed surface. A method of cleaning residue from registration alignment markings formed on a semiconductor su... | 08/30/2005 |
| 6937691 | X-ray fluorescence spectrometric system and a program for use therein An X-ray fluorescence spectrometric system includes a sample pre-treatment apparatus 10 for retaining on a surface of a substrate a substance to be measured that is found on the surface of the substrate, after such substance has been dissolved and subsequentl... | 08/30/2005 |
| 6935926 | System and method for reducing surface defects in integrated circuits The fabrication of integrated circuits entails the repeated application of many basic processing steps, for instance, planarization—the process of making a surface flat, or planar. One specific technique for making surfaces flat is chemical-mechanical planarizatio... | 08/30/2005 |
| 6933234 | Method for manufacturing semiconductor device and polishing apparatus In manufacturing a semiconductor device, a part of an element is formed on the surface of a substrate, and at least a periphery of the substrate is polished using a polishing member stretched around the periphery of the substrate so that a polishing face of the poli... | 08/23/2005 |
| 6933733 | Method and apparatus for measuring the concentration of hydrogen peroxide in a fluid A method and apparatus for measuring the concentration of hydrogen peroxide in a liquid or gaseous fluid. A capacitor is exposed to the fluid, wherein the fluid acts as the dielectric between the conductors of the capacitor. The permittivity and dielectric constant ... | 08/23/2005 |
| 6934070 | Chirped optical MEM device A light modulator comprises a series of ribbons divided by a series of gaps. Sequences of consecutive ribbons and gaps are grouped together to form a plurality of pixels that are configured to process a respective plurality of wavelengths. The spacing from center-li... | 08/23/2005 |
| 6933233 | Liquid material supply system and method for semiconductor manufacturing A liquid material supply system in which an inert gas is injected into a material tank accommodating a liquid material so as to discharge the liquid material into a liquid material discharge pipe connected to the material tank and that the inert gas dissolved or mix... | 08/23/2005 |
| 6932915 | System and method for integrated oxide removal and processing of a semiconductor wafer An integrated oxide removal and processing system (10) includes a process module (30) that may intentionally add at least one film layer to a single semiconductor wafer (32). The integrated oxide removal and processing system (10) also in... | 08/23/2005 |
| 6928751 | Megasonic cleaner and dryer system An apparatus includes a rotatable chuck for supporting a substrate and a splash guard. The splash guard surrounds the chuck and surrounds a substrate mounted on the chuck. The splash guard has a portion that deflects fluid being flung off the substrate by centrifuga... | 08/16/2005 |
| 6929014 | Method and apparatus for single disc ultrasonic cleaning At least one ultrasonic treating apparatus adapted for treating a single workpiece and comprised of a relatively small tank with a sidewall-mounted ultrasonic transducer is provided. The tank may be provided with a movable partition for adjustably partitioning the t... | 08/16/2005 |
| 6929901 | Method for reworking a lithographic process to provide an undamaged and residue free arc layer A method of removing resinous organic material over a semiconductor process surface including providing a semiconductor wafer having a process surface comprising a resinous organic material; and, exposing the process surface to a supercritical CO2 contain... | 08/16/2005 |
| 6930771 | Optical inspection equipment for semiconductor wafers with precleaning A method for improving the measurement of semiconductor wafers is disclosed. In the past, the repeatability of measurements was adversely affected due to the unpredictable growth of a layer of contamination over the intentionally deposited dielectric layers. Repeata... | 08/16/2005 |
| 6930046 | Single workpiece processing system A system and method for processing a workpiece, includes workpiece processors. A robot is moveable within an enclosure to load and unload workpieces into and out of the processors. A processor includes an upper rotor having a central air flow opening. The upper roto... | 08/16/2005 |
| 6930364 | Microelectronic mechanical system and methods The current invention provides for encapsulated release structures, intermediates thereof and methods for their fabrication. The multi-layer structure has a capping layer, that preferably comprises silicon oxide and/or silicon nitride, and which is formed over an et... | 08/16/2005 |
| 6930383 | Electronic component including a housing and a substrate The invention relates to an electronic component including a housing and a first substrate having at least one integrated circuit, a multiplicity of contact surfaces arranged in an arbitrary distribution on the surface of the first substrate. A second substrate form... | 08/16/2005 |
| 6929713 | In-situ photoresist removal by an attachable chamber with light source A method of fabricating integrated circuit wafers, in accordance with this invention comprises the following steps. Provide an integrated circuit wafer having devices formed therein covered with a metal layer and a photoresist layer over the metal layer which is sel... | 08/16/2005 |
| 6930493 | Method and apparatus for monitoring detergent concentration in a decontamination process A method and apparatus for monitoring the concentration of a detergent in a detergent solution. A capacitive sensor is exposed to the detergent solution, and electrical properties of the capacitive sensor are responsive to changes in the concentration of detergent i... | 08/16/2005 |
| 6927891 | Tilt-able grating plane for improved crosstalk in 1×N blaze switches A light modulator includes elongated elements arranged parallel to each other. Each elongated element includes a light reflective planar surface with the light reflective planar surfaces configured in a first grating plane. A support structure is coupled to the elon... | 08/09/2005 |
| 6928207 | Apparatus for selectively blocking WDM channels An apparatus for selective blocking WDM channels comprises a light modulator, a diffraction grating, and a transform lens. The light modulator comprises an array of pixels. Each pixel of the light modulator is selectively operable to direct light into a first mode a... | 08/09/2005 |
| 6927582 | Method and apparatus for monitoring the state of a chemical solution for decontamination of chemical and biological warfare agents A method and apparatus for monitoring the state of a chemical solution for neutralization of chemical and biological warfare agents are disclosed. A capacitor is exposed to the chemical solution, wherein the steam acts as a dielectric between the plates of the capac... | 08/09/2005 |
| 6926798 | Apparatus for supercritical processing of a workpiece An apparatus for supercritical processing and non-supercritical processing of a workpiece comprises a transfer module, a supercritical processing module, a non-supercritical processing module, and a robot. The transfer module includes an entrance. The supercritical ... | 08/09/2005 |
| 6926012 | Method for supercritical processing of multiple workpieces An apparatus for supercritical processing of multiple workpieces comprises a transfer module, first and second supercritical processing modules, and a robot. The transfer module includes an entrance. The first and second supercritical processing modules are coupled ... | 08/09/2005 |
| 6927176 | Cleaning method and solution for cleaning a wafer in a single wafer process The present invention is a novel cleaning method and a solution for use in a single wafer cleaning process. According to the present invention the cleaning solution comprises ammonium hydroxide (NH4OH), hydrogen peroxide (H2O2), wate... | 08/09/2005 |
| 6926590 | Method of improving device performance A method of improving the yield and performance of IC devices fabricated on a semiconductor wafer is disclosed. The method includes fabricating via plugs in via openings provided in an intermetal dielectric (IMD) layer on a wafer, subjecting the wafer to CMP to isol... | 08/09/2005 |
| 6924557 | Semiconductor package The present invention discloses a semiconductor package, wherein several chips can be packed thereinto. The present invention uses under bump metallurgies or bonding wires to connect the associated circuits of at least two chips in serial or in parallel. At least on... | 08/02/2005 |
