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Class 134/1.3 - Semiconductor cleaning


Subclass of Class 134 - Cleaning and liquid contact with solids
Definition: Process wherein the work is a semiconductive precursor,
No. of patents: 1089
Last issue date: 04/24/2012


1                      
NumberTitleIssue Date
8163095Composition for stripping and stripping method
The present invention provides a stripping composition and a stripping method capable of easily stripping a color resist or an organic insulating film formed on a substrate to reuse the substrate when defects are found during a process of forming the color filter or...
04/24/2012
8147615Method of fabricating semiconductor cleaners
A method of manufacturing cleaning solvents is provided. The method includes selecting a small plurality of test solvents from a large plurality of perspective solvents. The equilibrium composition of a multi-component solution is preferably described by the Hansen ...
04/03/2012
8137472Semiconductor process
A semiconductor process is provided. First, a metal layer, a dielectric layer and a patterned hard mask layer are sequentially formed on a substrate. Thereafter, a portion of the dielectric layer is removed to form an opening exposing the metal layer. Afterwards, a ...
03/20/2012
8097089Methods for cleaning process kits and chambers, and for ruthenium recovery
A method is provided for recovering a metal from electronic device deposition equipment including: providing deposition equipment wherein the deposition equipment is at least partially coated with a deposited metal; blasting the deposition equipment with a grit to r...
01/17/2012
8092760Scanning arm for semiconductor wafer pollutant measurement apparatus and scanning device using the same
Provided is a scanning arm which moves to collect pollutants on the surface of a semiconductor wafer, for use in a semiconductor wafer pollutant measurement apparatus, and a scanning device using the same. The scanning arm includes: an X-axis portion; a Z-axis porti...
01/10/2012
8083857Substrate cleaning method and substrate cleaning apparatus
The present invention provides a substrate cleaning method capable of reducing non-uniformity of a removal efficiency of particles between lots with a simple procedure. The substrate cleaning method comprises: a step of supplying a gas into a cleaning tank, while an...
12/27/2011
8075695Apparatus, circuitry, signals, probes and methods for cleaning and/or processing with sound
The invention utilizes single and multiple frequency ultrasound generators driving single and multiple frequency resonant and harmonic transducer arrays at frequencies into the megasonic range. Generator signals that increase cavitation efficiency improve the perfor...
12/13/2011
8062429Methods of cleaning semiconductor devices at the back end of line using amidoxime compositions
The present invention relates to aqueous compositions comprising amidoxime compounds and methods for cleaning plasma etch residue from semiconductor substrates including such dilute aqueous solutions. The compositions of the invention may optionally contain one or m...
11/22/2011
8043435Cleaning liquid and cleaning method for electronic material
A cleaning liquid for an electronic material, in particular, a silicon wafer, uses ultra-pure water or hydrogen water as raw material water, and performs cleaning in combination with ultrasonic irradiation under the presence of hydrogen micro-bubbles. The method ena...
10/25/2011
7981221Rheological fluids for particle removal
Methods and apparatus for cleaning a substrate (e.g., wafer) in the fabrication of semiconductor devices utilizing electrorheological (ER) and magnetorheological (MR) fluids to remove contaminant residual particles from the substrate surface are provided. ...
07/19/2011
7976637Substrate processing system, substrate surface processing apparatus, substrate surface inspecting apparatus, substrate surface inspecting method, and storage medium storing program for implementing the method
A substrate processing system which enables a minute pieces of foreign matter attached to a substrate surface to be detected and are suitable for mass production of substrates. The substrate processing system has a substrate processing apparatus that carries out pre...
07/12/2011
7976638High negative zeta potential polyhedral silsesquioxane composition and method for damage free semiconductor wet clean
A composition for removing particulate matter from integrated circuit substrates, including (a) one or more metal ion-free base; (b) a water-soluble metal ion-free onium salt of a polyhedral silsesquioxane; (c) an oxidizing agent; and (d) metal ion-free water, and a...
07/12/2011
7959738Method of removing photoresist and method of manufacturing a semiconductor device
A method of removing a photoresist may include permeating supercritical carbon dioxide into the photoresist on a substrate having a conductive structure including a metal. The photoresist permeating the supercritical carbon dioxide may be easily removable. The photo...
06/14/2011
RE42420Liquid feed nozzle, wet treatment apparatus and wet treatment method
The wet treatment liquid feed nozzle of the invention comprises an introducing path having an introducing port, a discharging path having a discharging port, a crossing section formed by causing the introducing path and the discharging path to cross at the other end...
06/07/2011
7922823Compositions for processing of semiconductor substrates
Compositions useful in microelectronic device manufacturing for surface preparation and/or cleaning of wafer substrates such as microelectronic device precursor structures. The compositions can be employed for processing of wafers that have, or are intended to be fu...
04/12/2011
7922824Oxidizing aqueous cleaner for the removal of post-etch residues
An oxidizing aqueous cleaning composition and process for cleaning post-plasma etch residue and/or hardmask material from a microelectronic device having said residue thereon. The oxidizing aqueous cleaning composition includes at least one oxidizing agent, at least...
04/12/2011
7918941Cleaning composition
The present invention relates to a cleaning agent composition for use in cleaning a substrate for recording media, a substrate for photomask, or a substrate for flat panel display, a surface of which at least contains a metallic or glassy substrate moiety, the clean...
04/05/2011
7914624Systems and methods for charging a cleaning solution used for cleaning integrated circuit substrates
Inventive methods, systems and compositions of cleaning integrated circuit (“IC”) substrates are described. The cleaning methods of the present invention include: charging a solution, which contains at least a solute selected to promote cleaning of the IC substr...
03/29/2011
7909934Megasonic cleaning efficiency using auto-tuning of a RF generator at constant maximum efficiency
A system and method of cleaning a substrate includes a megasonic chamber that includes a transducer and a substrate. The transducer is being oriented toward the substrate. A variable distance d separates the transducer and the substrate. The system also includes a d...
03/22/2011
7896970Semiconductor substrate cleaning liquid and semiconductor substrate cleaning process
A semiconductor substrate cleaning liquid composition is provided that includes one or more types selected from the group consisting of a compound having at least two sulfonic acid groups per molecule, phytic acid, and a condensed phosphoric acid compound; an inorga...
03/01/2011
7837800CMP polishing slurry and polishing method
The present invention relates to a CMP polishing slurry, comprising cerium oxide particles, a dispersing agent, a water-soluble polymer and water, wherein the water-soluble polymer is a compound having a skeleton of any one of an N-mono-substituted product and an N,...
11/23/2010
7799139Chemistry for removal of photo resist, organic sacrificial fill material and etch polymer
Methods and associated structures of forming a microelectronic device are described. Those methods may include utilizing a cleaning mixture comprising a solvent such as ethylene glycol monopropyl ether, an inorganic base, an organic base, a copper corrosion inhibito...
09/21/2010
7731801Semiconductor wafer treatment method and apparatus therefor
In the ozone water treatment process, the silicon wafer is treated with the first ultra-pure water that includes ozone. The first ultra-pure water is refined by the ultraviolet ray sterilization method. The first ultra-pure water includes total organic carbon conten...
06/08/2010
7731799Substrate processing method, substrate processing apparatus and computer-readable memory medium
A substrate processing method which removes an ArF resist film from a wafer having the ArF resist film. As an ultraviolet irradiation process is performed on the ArF resist film, and then an ozone gas and water vapor are fed to the ArF resist film, the ArF resist fi...
06/08/2010
7731800Systems and methods for single integrated substrate cleaning and rinsing
Inventive methods and systems of cleaning patterned integrated circuit (“IC”) substrates are described. The cleaning methods of the present invention include: (1) providing the patterned integrated circuit substrate having thereon poly silicon lines adjacent to ...
06/08/2010
7691207Method for cleaning disk-shape glass substrate and magnetic disk
A method for cleaning a disk-shape glass substrate, which comprises rotating the disk-shape glass substrate on its center with its main surface vertical, and making a cleaning fluid irradiated with ultrasonic waves run down on the outer peripheral edge surface of th...
04/06/2010
7658803Manufacturing and cleansing of thin film transistor panels
A manufacturing a thin film transistor array panel includes depositing a first thin film including aluminum on a substrate, patterning the first thin film by photolithography and etching, cleansing the substrate including the first thin film, and depositing a second...
02/09/2010
7655094Systems and methods for charging a cleaning solution used for cleaning integrated circuit substrates
Inventive methods, systems and compositions of cleaning integrated circuit (“IC”) substrates are described. The cleaning methods of the present invention include: charging a solution, which contains at least a solute selected to promote cleaning of the IC substr...
02/02/2010
7637270Method of washing a polished object
An abrasive includes abrasive grains, a solvent, and an additive. MnO2, Mn2O3, Mn3O4, MnO or a mixture thereof as the abrasive grains, H2O2 as the solvent, and HNO3, an organic a...
12/29/2009
7624742Method for removing aluminum fluoride contamination from aluminum-containing surfaces of semiconductor process equipment
Described are methods of removing aluminum fluoride contaminants from aluminum, anodized aluminum, and sprayed ceramic surfaces. Hydrofluoric acid, long known to be effective at removing certain contaminants, has not been used to dissolve aluminum fluoride on alumin...
12/01/2009
7621281Cleaning solution for cleaning substrate for semiconductor devices and cleaning method using the same
A cleaning solution for cleaning a substrate for semiconductor devices and a cleaning method using the said cleaning solution, which comprises at least the following components (A), (B) and (C): (A) an ethyleneoxide-type surfactant...
11/24/2009
7614406Method of cleaning substrates utilizing megasonic energy
A method of cleaning a substrate without causing damage to the substrate is provided. The method comprises the steps of providing a transmitter made of a material that is a good conductor of megasonic energy, positioning the transmitter so that a lower edge is posit...
11/10/2009
7604011Method and apparatus for semiconductor wafer cleaning using high-frequency acoustic energy with supercritical fluid
An apparatus and a method is provided for using high-frequency acoustic energy with a supercritical fluid to perform a semiconductor wafer (“wafer”) cleaning process. High-frequency acoustic energy is applied to the supercritical fluid to impart energy to partic...
10/20/2009
7591270Process solutions containing surfactants
Process solutions comprising one or more surfactants are used to reduce the number of pattern collapse defects on a plurality of photoresist coated substrates during the manufacture of semiconductor devices. ...
09/22/2009
7578302Megasonic cleaning using supersaturated solution
A method and system for the megasonic cleaning of one or more substrates that reduces damage to the substrate(s) resulting from the megasonic energy. The substrates are supported in a process chamber and contacted with a cleaning solution comprising a cleaning liqui...
08/25/2009
7543592Compositions and processes for photoresist stripping and residue removal in wafer level packaging
Improved compositions and processes for removing photoresists, polymers, post etch residues, and post oxygen ashing residues from interconnect, wafer level packaging, and printed circuit board substrates are disclosed. One process comprises contacting such substrate...
06/09/2009
7543593Substrate processing apparatus
A substrate processing apparatus is provided. The apparatus includes a plurality of fluid suppliers 61, 61, 63 for supplying different processing fluids. In processing a wafer W, the substrate processing apparatus moves the fluid suppliers 61, 62, 63 a...
06/09/2009
7467632Method for forming a photoresist pattern
A photoresist cleaning solution and method for forming photoresist patterns using the same. More specifically, disclosed are a photoresist cleaning solution comprising H2O and an ionic surfactant represented by Formula 1, and a method for forming a photor...
12/23/2008
7448396Apparatus and method of removing particles
An impurities elimination apparatus including a base plate, a first nozzle for removing impurities on the base plate using air suction, a glass substrate disposed on the base plate, and a second nozzle for coating the glass substrate with an organic material. ...
11/11/2008
7448395Process method to facilitate silicidation
The present invention substantially removes dry etch residue from a dry plasma etch process 110 prior to depositing a cobalt layer 124 on silicon substrate and/or polysilicon material. Subsequently, one or more annealing processes 128 are perfor...
11/11/2008
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