Did You Know...
...that Charles Goodyear performed some of his experiments on rubber while in debtor's prison? He was there so often he referred to it as his "hotel". Chronically in debt because of poor business sense and ill health, Goodyear depended on the generosity of friends and family. Even after he unlocked the secret to vulcanizing rubber, he was unable to improve his financial situation. When he died, his estate was $200,000 in debt.
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| Number | Title | Issue Date |
| 8146581 | Method for slicing workpiece The present invention is a method for slicing a workpiece into wafers by pressing a cylindrical workpiece held with a workpiece holder against a wire row formed by a wire spirally wound between a plurality of wire guides and making the wire travel while supplying a ... | 04/03/2012 |
| 8056551 | Method and system for manufacturing wafer-like slices from a substrate material The present invention relates to a method and a system for manufacturing wafer-like slices from a body of a substrate material, especially for use in the manufacture of semiconductor devices. The method comprises providing a slicing device with a cutting wire equipp... | 11/15/2011 |
| 7926478 | Super abrasive grain wire saw winding structure, super abrasive grain wire saw cutting device, and super abrasive grain wire saw winding method A superabrasive wire saw-wound structure includes a superabrasive wire saw (10) formed with an average diameter D and a reel (1). The superabrasive wire saw (10) includes a core wire (11), a bonding material (12) surrounding a surf... | 04/19/2011 |
| 7793647 | Method and device for sawing a workpiece A device suitable for sawing a workpiece, contains a wire web formed by a sawing wire or adapted to receive such a wire web, a forward feed instrument holding a semiconductor workpiece to be sawed and feeding the workpiece in the direction of the wire web, and a res... | 09/14/2010 |
| 7461648 | Abrasive wire sawing Apparatus for forming a multiplicity of thin wafers from at least two similar blocks, the apparatus comprising a supply reel (1) to supply wire, an upper pair (3a, 3b) and a lower pair (3c, 3d) of parall... | 12/09/2008 |
| 7431028 | Apparatus and method for slicing an ingot A method for slicing an ingot may improve nanotopography at a surface of a wafer. In the method, an ingot is sliced into a plurality of wafers via a slurry while slurry is supplied to a moving wire. A first wire to form a first slicing portion at the wafer firstly s... | 10/07/2008 |
| 7387118 | Wire saw The invention provides a wire saw in which wire tension fluctuations occurring in swinging of a row of wires can be accommodated to thereby increase a velocity of the wire and to carry out cutting with efficiency and precision by utilizing swinging of the row of wir... | 06/17/2008 |
| 7373935 | Carbide wire blade This invention relates to a carbide wire blade that is suitable for use in sawing through subsea structures. The carbide wire blade employs a tungsten carbide cutter, a vibration dampening member, and the first cylindrical spacer, slideably mounted on a solid cylind... | 05/20/2008 |
| 7370646 | Apparatus and method for slicing an ingot A method for slicing an ingot may improve nanotopography at a surface of a wafer. In the method, an ingot is sliced into a plurality of wafers via a slurry while slurry is supplied to a moving wire. A first wire to form a first slicing portion at the wafer firstly s... | 05/13/2008 |
| 7361533 | Stacked embedded leadframe A method of forming a stackable embedded leadframe package includes coupling an electronic component having bond pads to a substrate; coupling on the substrate a leadframe having a plurality of leads, each lead having a lower mounting portion; encapsulating the elec... | 04/22/2008 |
| 7353818 | Apparatus and method for slicing an ingot A method for slicing an ingot may improve nanotopography at a surface of a wafer. In the method, an ingot is sliced into a plurality of wafers via a slurry while slurry is supplied to a moving wire. A first wire to form a first slicing portion at the wafer firstly s... | 04/08/2008 |
| 7306508 | Multi-wire saw A multi-wire saw according to the present invention cuts a workpiece while supplying a slurry containing an alkali or mixed acid to a cutting interface between the workpiece and a wire, and includes: a storage tank with a heating mechanism for storing and heating th... | 12/11/2007 |
| 7261099 | Apparatus and method for slicing an ingot A method for slicing an ingot may improve nanotopography at a surface of a wafer. In the method, an ingot is sliced into a plurality of wafers via a slurry while slurry is supplied to a moving wire. A first wire to form a first slicing portion at the wafer firstly s... | 08/28/2007 |
| 7223155 | Method of producing III-nitride substrate An ingot 3 of a hexagonal III-nitride crystal is cut using a wire array 21 composed of a wire 22. On this occasion, the ingot 3 is cut in such a manner that the ingot 3 is sliced with supply of an abrasive fluid while feeding at le... | 05/29/2007 |
| 7195542 | Process, apparatus and slurry for wire sawing A wire saw (1; 100) for cutting a workpiece includes a device (21, 22, 24, 27) for setting, controlling and/or maintaining a predetermined or desired water content in at least part of the gaseous medium that contacts the slurry. With the wire saw accor... | 03/27/2007 |
| 7192807 | Wafer level package and fabrication method A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through t... | 03/20/2007 |
| 7150277 | Pivoting guide pulley stand for wire saw A guide pulley stand for wire saw use in stone quarries, for guiding the cutting wire when the wire saw unit is set up on the top of the object to be cut. The pivoting guide pulley stand comprises of a support base on the front end of the wire saw track, a guide pul... | 12/19/2006 |
| 7137865 | Method and device for cutting single crystals, in addition to an adjusting device and a test method for determining a crystal orientation A method for the division of single crystals, in particular of GaAs, is provided in which a single crystal (1) to be cut into at least two parts and a cutting tool (2, 3; 8, 8a, 8b, 8c) are moved relative to one anoth... | 11/21/2006 |
| 7114424 | Wire sawing device A sawing device includes a holding device (22) arranged so as to hold in the course of wire sawing the different sawed slices (23) substantially parallel and such that the width of the sawing gaps (24) is held constant. The device includes, for ... | 10/03/2006 |
| 7082940 | Wire sawing apparatus and wire sawing method A wire sawing apparatus includes a wire, a wire feed roller, and two basic rollers. The three rollers have the same diameter and are arranged in such a manner that their axes of rotation are in parallel with one another. Cutting-positioning circumferential grooves a... | 08/01/2006 |
| 7055516 | Stone slicer A stone slicer of slicing rough stone into stone plates having a predetermined thickness, which can improve productivity by reducing consumption of the rough stone by minimizing the thickness of a cut portion cut by a saw blade, and can reduce the treatment cost of ... | 06/06/2006 |
| 7052381 | Belt sander having tension adjustment mechanism A belt sander includes a frame, a support seat, a first wheel rod, a second wheel rod, a sand belt, an adjusting unit, and an operation unit. Thus, the operation handle of the operation unit is rotated to rotate the drive shaft which rotates the drive bevel gear whi... | 05/30/2006 |
| 7025665 | Method and apparatus for cutting ultra thin silicon wafers A wire saw and wafer stabilizing system are provided for holding wafer sections invariantly against vibration and unwanted movement during the sawing process. A stabilizing means is applied to the ends of partially defined wafer sections at an early stage when the w... | 04/11/2006 |
| 6994756 | Method of producing sintered rare earth magnetic alloy wafer A method of producing a sintered rare earth magnetic alloy wafer comprises a step of using a cutter to slice a wafer of a thickness of not greater than 3 mm from a sintered rare earth magnetic alloy having ferromagnetic crystal grains surrounded by a more readily gr... | 02/07/2006 |
| 6981495 | Wire sawing process and device In the sawing process and device according to the invention, the pieces to be sawed are mounted on at least one support table and caused to bear against a layer of wires. Inclination structure in the form of wedges or pieces for angular adjustment by pivoting and bl... | 01/03/2006 |
| 6954024 | Unidirectional acoustic probe and method for making same A unidirectional acoustic probe including a high-performance interconnection network, and a method of manufacturing such a probe. The unidirectional acoustic probe includes linear piezoelectric transducers on the surface of a dielectric film. The dielectric film inc... | 10/11/2005 |
| 6945844 | Methods for dynamically controlling a semiconductor dicing saw A saw cutting pattern is dynamically established for a semiconductor dicing saw based on detection of the saw blade contacting a wafer or a portion of a wafer. The dynamic cutting pattern may terminate cuts if the saw blade no longer contacts the wafer or a portion ... | 09/20/2005 |
| 6941940 | Wire saw and process for slicing multiple semiconductor ingots A wire saw (10) for simultaneously slicing multiple, generally cylindrical monocrystalline ingots (14) into wafers. The wire saw includes a cutting head (16), an ingot support (12), and multiple generally parallel lengths of cutting wire ... | 09/13/2005 |
| 6923171 | Device and method for determining the orientation of a crystallographic plane in relation to a crystal surface and device for cutting a single crystal in a cutting machine An apparatus and a method for determining the orientation of a crystallographic plane (100) relative to a crystal surface (2) are provided, in which the orientation is free from errors of adhesion of the crystal or contamination of the holders for the crystal... | 08/02/2005 |
| 6920871 | Cable saw The invention relates to a cable saw device (1) comprising a sawing cable (25) and a cable storage device (30) which is used for temporary accommodation of the sawing cable (25). The cable storage device (30) comprises several defl... | 07/26/2005 |
| 6896595 | Method for cutting rare earth alloy, method for manufacturing rare earth magnet, and wire-saw machine A method for cutting a rare earth alloy using a wire with abrasive grains fixed to a core wire, including the step of cutting the rare earth alloy with the wire traveling in a state that a portion of the rare earth alloy to be cut with the wire is immersed in a cool... | 05/24/2005 |
| 6889684 | Apparatus, system and method for cutting a crystal ingot The apparatus, system and method for cutting crystal ingot provide techniques for cutting an ingot into wafers with a wire cutting apparatus utilizing wire with a diameter of less than 0.18 mm, such as 0.14 mm. The wire cutting apparatus also includes multiple rolle... | 05/10/2005 |
| 6837778 | Method for cutting rare earth alloy, method for manufacturing rare earth magnet, and wire-saw machine A method for cutting a rare earth alloy using a wire with abrasive grains fixed to a core wire, including the step of cutting the rare earth alloy with the wire traveling in a state that a portion of the rare earth alloy to be cut with the wire is immersed in a cool... | 01/04/2005 |
| 6832606 | Wire saw and cutting method thereof When a work W is cut by moving a wire in an axial direction thereof while the wire is pressed onto the work and an abrasive liquid which is made by dispersing abrasive grains in a dispersion medium is interposed between the work and the wire, a flow of the wire is f... | 12/21/2004 |
| 6817925 | Multistage fine hole machining method and device A multistage fine-hole machining device has lap stations for lapping an inner surface defining a through-hole of a workpiece. Each of the lap stations has a passing unit for passing wire through the through-hole of the workpiece, a supply unit for supplying a polish... | 11/16/2004 |
| 6773333 | Method for cutting slices from a workpiece A method for cutting up a workpiece which is in rod or block form by means of a saw, wherein the temperature of the workpiece is measured during the cutting, and the measurement signal is transmitted to a control unit, which generates a control signal which is used ... | 08/10/2004 |
| 6763823 | Machining method not causing any damage to major cut surfaces of cut objects An ingot is placed below parallel wires of a multiwire saw, and the wires are driven to run. The ingot is moved upward and cut by the wires to obtain wafers. The wires are displaced toward one side of cut surfaces of the wafers. By lowering the wafers as the wires r... | 07/20/2004 |
| 6742424 | Cutting apparatus for ceramic green bodies An apparatus for cutting green ceramic bodies, includes a traveling path for green ceramic bodies, beds for supporting green ceramic bodies at constant intervals in series along the traveling path, an arm on each side of the traveling path, two drive portions for mo... | 06/01/2004 |
| 6652356 | Wire saw and cutting method There is provided a cutting method comprising winding a wire around plural grooved rollers, and pressing the wire against the work with running it, to cut the work, wherein the work is cut with controlling temperature of the work by supplying a cutting fl... | 11/25/2003 |
| 6640796 | Method for separating slices from a hard brittle workpiece, and wire saw for carrying out the method A method for separating slices from a hard brittle workpiece involves subjecting the workpiece to an advancing movement and pressing it onto wires of a wire web of a wire saw, the wires being under a defined wire tension and making contact with the workpi... | 11/04/2003 |
