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Class 125/13.01 - Rotary


Subclass of Class 125 - Stone working
Definition: Subject matter in which sawing of stone or similar material
No. of patents: 511
Last issue date: 02/21/2012


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NumberTitleIssue Date
6119675Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafe...
09/19/2000
6113489Ingot slicing method, an ingot manufacturing method and a sliced ingot grinding apparatus
A method of slicing an ingot wherein a pre-cut work 3 in which a holding member 2 extending over the entire length of a side surface of a cylindrical ingot 1 is bonded to the side surface of the ingot 1 is set on a slicing apparatus 4, and the pre-cut wor...
09/05/2000
6112736Portable saw with improved disconnectable platform for cutting concrete for controlling cracks
An apparatus for cutting grooves in a green concrete slab having at least one terminating side edge transverse to a broad top surface in a low cost manner is described and includes the following elements: a hand-held portable rotary saw, supported on a ro...
09/05/2000
6105567Wafer sawing apparatus having washing solution spray and suction devices for debris removal and heat dissipation
A wafer sawing apparatus scribes a wafer having a plurality of ICs which are separated from each other by a plurality of scribe streets so as to cut the wafer into individual ICs. During scribing, silicon particles are produced and heat is generated as th...
08/22/2000
6102022Pavement cutting machine
A pavement cutting machine having a rotary cutting wheel with a generally horizontal axis of rotation where rotation of the cutting wheel is selectively controlled by a clutch on either the drive shaft of the engine or a driven shaft of the cutting wheel ...
08/15/2000
6102023Precision cutting apparatus and cutting method using the same
Disclosed is an improved precision cutting apparatus comprising a chuck table for holding a workpiece, and first and second cutting means each including a spindle unit having a blade attached thereto. The first and second cutting means are series-arranged...
08/15/2000
6098609Superabrasive electrodeposited cutting edge and method of manufacturing the same
A cutting edge comprising a mass of superabrasive particles (2) electrodeposited on a thin-walled metallic base member (1) along a border (6) of said base member, wherein said mass (2) forms one or more layers at said border of said base member and fixed ...
08/08/2000
6099080Dry cutting and grooving apparatus for pavement
In a dry cutting and grooving apparatus for pavement in which blades for cutting or grooving the pavement are covered by a housing which leaves the lower ends of the blades exposed, and in which chips and cutting powder generated at the time of cutting an...
08/08/2000
6080041Compact motorized table saw
A saw with a compact frame that permits the cutting of large workpieces and that can be repeatedly operated repeatedly without requiring manual activation of an on/off switch. A special pivoting support arm pivots outwardly away from a motor assembly to a...
06/27/2000
6073621Apparatus for automatic layout and cutting corner lines in stone
An apparatus or machine is disclosed for automatic establishing and cutting the corner lines in a piece of stone. The machine includes two pairs of saw blades, each pair disposed on opposite sides of the stone. The saw blades are adjustable in two directi...
06/13/2000
6067977Apparatus and method for reducing damage to wafer cutting blades during wafer dicing
A wafer cutting chuck for reducing wear and damage to a cutting blade. The chuck has a surface for supporting a wafer. The chuck also has a plurality of recesses in its surface to accommodate a cutting blade of a wafer spindle and blade assembly. The rece...
05/30/2000
6062969Grinding wheel with spiral grooved face
A grinding wheel is disclosed with a disk-like, cylindrical shape, whose perimeter is equipped with a grinding abrasive and has at least one spiral groove. The groove extends essentially around the perimeter at an acute bevel angle of inclination less tha...
05/16/2000
6058922Grinding blade for trowel machine
The present invention is directed towards an attachment to a trowel machine. The trowel machine attachment converts the trowel machine blade to a grinding blade and allows the trowel machine to become a grinding machine in order to smooth the concrete sur...
05/09/2000
6058923Saw blade
The invention relates to a saw blade for cutting, slotting or grooving natural rock and synthetic construction materials, such as concrete, reinforced concrete, brick, asphalt or the like. The saw blade has a sawblade body and a plurality of segments whic...
05/09/2000
6055976Method of preparing end faces on integrated circuits
A method for preparing operative end faces of integrated circuit chips or dies utilizes a beveled cutting blade to impart a desired contact angle to the operative end faces of the chip. The method includes the steps of mounting feet on the chip, trimming ...
05/02/2000
6050253Hand-operated cutting machine
A hand-operated cutting machine comprising a rotatable saw blade (3), a machine body with drive machinery for rotation of the saw blade, a rear manoeuvring handle (20) with control (17, 18) for a drive motor (2) included in said drive machinery and a fron...
04/18/2000
6047693Dust collector-equipped power cutter
A dust collector-equipped power cutter, which is easy to handle in operation and convenient for storage and transportation thereof and is capable of preventing dusty air from flowing back to the cutter portion when a cutting operation is interrupted, incl...
04/11/2000
6039037Power cutter and centrifugal clutch for a power cutter
A power cutter is disclosed whose dust suction-discharge fan is driven to rotate at a high speed to thereby attain sufficient dust suction-discharge performance, and which can be constructed relatively compactly in size as a whole at a reduced cost. The p...
03/21/2000
6019433Concrete saw with stabilized carriage and blade control
A highly stable concrete saw for cutting crack control relief grooves features a stabilized and reinforced carriage. The carriage frame comprises a generally C-shaped, rigid metal weldment having a closed side extending between a closed front and closed r...
02/01/2000
6014965Apparatus for recognizing the shape of a semiconductor wafer
The present invention provides an apparatus for recognizing the shape of a semiconductor wafer, capable of stably achieving accurate shape recognition without being affected by either a circuit pattern formed on the semiconductor wafer or the color of an ...
01/18/2000
6014811Power cutter
A power cutter is disclosed which is capable of selectively changing the discharge direction of dust discharged from a dust discharge port of a dust suction-discharge fan and, hence, which is capable of optimally adjusting the dust discharge direction acc...
01/18/2000
6006735Automated stoneworking system and method
An automated stoneworking system and method for cutting and shaping various stone materials, such as marble and granite, in any number of preprogrammed fashions so as to eliminate the need for manual stoneworking operations....
12/28/1999
6006739Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafe...
12/28/1999
6000387Power saw with fluid cooling bearing assembly
A ceramic and masonry power saw is constructed with a fluid cooling bearing assembly to drive a saw blade. The fluid cooling bearing assembly includes a bearing housing which has a coolant chamber embracing around the shaft sleeve. The coolant chamber has...
12/14/1999
5975990Method of producing semiconductor wafers
A method for producing semiconductor wafers is by a repeated sequence of grinding the end face of a monocrystal using a grinding tool and cutting a semiconductor wafer having a thickness from the monocrystal using a cutting tool, a grinding abrasion of a ...
11/02/1999
5960780Lightweight stone cutting apparatus
An apparatus and a method for producing accurate straight cuts in a slab of stone, concrete, or the like. A carriage conveys the cutter along two parallel rails that lie directly upon the upper surface of the slab to be cut. In a preferred embodiment of t...
10/05/1999
5950612Apparatus for cutting concrete
A self-propelled saw for cutting green or uncured concrete having a frame with rear drive wheels and adjustable front wheels is provided. The saw has a handle for guiding it along the desired path to be cut in the concrete and a drive motor for the saw bl...
09/14/1999
5947103Stone tile finishing system
A stone tile finishing system includes an apparatus and a group of different tools usable in the apparatus for various tile finishing operations. The apparatus itself has a motor, a tool mount rotated by the motor and a tile support movable relative to th...
09/07/1999
5944007Wire type slicing machine and method
Two grooved rolls 11 and 12 among three grooved rolls 11~13 engaged by a saw wire 14 are arranged one above the other and the saw wire 14 is made to travel vertically between the grooved rolls 11 and 12. A workpiece 9 is moved horizontally and pushed agai...
08/31/1999
5941227Portable saw with disconnectable platform for cutting concrete for controlling cracks
An apparatus for cutting grooves in a green concrete slab having at least one terminating side edge transverse to a broad top surface in a low cost manner is described and includes the following elements: a hand-held portable rotary saw, supported on a ro...
08/24/1999
5927263Method for manufacturing completely circular semiconductor wafers
In a method for manufacturing completely circular wafers, a specified crystal orientation of a cylindrical semiconductor crystal member is detected, and a support is mounted on the semiconductor crystal member in accordance with the detected specified cry...
07/27/1999
5921228Multi-directional, self-propelled saw for cutting concrete slabs
A saw for cutting an extruded, prestressed concrete slab having a length, a width and a thickness includes a framework assembly movable along the length of the concrete slab. A carriage system is rotatably supported from the framework assembly about a fir...
07/13/1999
5915370Saw for segmenting a semiconductor wafer
An apparatus for cutting a semiconductor wafer comprises a wafer holding assembly and a cutting assembly having at least one cutting element. The apparatus further comprises a control assembly coupled to the cutting assembly which is operable to move the ...
06/29/1999
5908224Vacuumatic concrete planer
A vacuumatic concrete planer for preventing dust from escaping the dust collecting bag attached to the vacuum blower assembly . The vacuumatic concrete planer includes a wheeled housing, a motor being mounted to the housing, a grinder blade assembly being...
06/01/1999
5901694Counterweight for silicon ingot endcuts
A counterweight to facilitate endcuts from silicon ingots comprising a bent angle moment arm and adjustable weighting means....
05/11/1999
5887579Saw and saw blade
A wall saw includes a saw head which is displaceable longitudinally on a running rail and has a swivelable saw arm and a saw blade with cutting elements which is detachably fastened to the saw arm. The saw blade is rotatable by means of a drive unit which...
03/30/1999
5865163Dicing saw alignment for array ultrasonic transducer fabrication
An array ultrasonic transducer precursor includes a body of piezoelectric material with a dielectric substrate bonded to a surface of the body. Circuit elements supported on the dielectric substrate include, in an active region, physically parallel signal...
02/02/1999
5857453Precision slot cutting machine for concrete and asphalt
A precision slot cutting machine for concrete and asphalt pavement includes a self propelled unit with an operator's station and a blade platform is attached to the self propelled unit by a pair of pivot arms which allow the blade platform to freely pivot...
01/12/1999
5846125Truing wheel with incorporated cooling
The grinding wheel has its cooling fluid supply system through its own body (1). It has central bores (4) that each open into a side chamber (2) and distribution holes (3) opening out into grooves (11) made in the abrasive deposit (10), preferably alterna...
12/08/1998
5845630Process and apparatus for fabricating a semiconductor wafer
A process for fabricating a semiconductor wafer and an apparatus for chamfering a semiconductor ingot are provided to precisely perform the chamfering together and reduce significantly the cutting and chamfering time. The semiconductor ingot 2 is rotated ...
12/08/1998
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