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| Number | Title | Issue Date |
| 8092607 | Transporting means and vacuum coating installation for substrates of different sizes In a vacuum coating installation to coat planar substrates, comprising a vacuum chamber and a transport device arranged in the vacuum chamber for transporting the substrates along a transportation path through the vacuum chamber, with the transport device comprising... | 01/10/2012 |
| 8038797 | Apparatus and method for manufacturing magnetic recording medium A method and apparatus for manufacturing a magnetic recording medium uses a small-diameter insulating substrate. The apparatus includes a carrier for a special size of 3.5 inches for receiving a plurality of small-diameter insulating substrates. Seed layers are depo... | 10/18/2011 |
| 7981219 | System for plasma treating a plastic component A system is provided for plasma treating a plastic component having an exterior surface and an inside surface. The system comprises at least one fixture. The fixture includes a support structure, a plurality of locating features, and a plurality of holding devices w... | 07/19/2011 |
| 7927425 | Power-delivery mechanism and apparatus of plasma-enhanced chemical vapor deposition using the same A power-delivery mechanism is provided in the present invention, which utilizes an element with airtight and flexible characteristics coupled to a power-generating unit so as to generate a motion in a specific direction. Besides, an apparatus of plasma -enhanced che... | 04/19/2011 |
| 7879151 | Mask etch processing apparatus Method and apparatus for supporting and transferring a substrate in a semiconductor wafer processing system are provided. In one aspect, an apparatus is provided for supporting a substrate comprising a cover ring comprising a base having a bore disposed therethough,... | 02/01/2011 |
| 7837799 | Arrangement for transporting a flat substrate in a vacuum chamber An arrangement for transporting a flat substrate through a coating installation, wherein the coating installation comprises, e.g., several and different sputter cathodes, to which the flat substrate, for example a glass pane, is transported one after the other in va... | 11/23/2010 |
| 7833355 | Carbon nanotube (CNT) extrusion methods and CNT wire and composites A carbon nanotube (CNT) extrusion system includes a carbon source, an extrusion die having a baseplate having a plurality of die sets, each die set has a plurality of through-holes in fluid communication with the carbon source and a corresponding plurality of templa... | 11/16/2010 |
| 7789963 | Chuck pedestal shield An apparatus for processing semiconductors includes a processing chamber including a plurality of chamber walls, a substrate holder, positioned within the processing chamber and configured to support the substrate, and a linear displacement device, coupled between a... | 09/07/2010 |
| 7678198 | Vertical-offset coater The invention provides a coater, and methods of using the coater, for depositing thin films onto generally-opposed major surfaces of a sheet-like substrate. The coater has a substrate transport system adapted for supporting the substrate in a vertical-offset configu... | 03/16/2010 |
| 7670437 | Mask and substrate alignment for solder bump process A system for of aligning a mask to a substrate comprising: a fixture for holding the mask and the substrate in fixed positions relative to each other; means for holding the substrate, the means for holding the substrate protruding through openings in a table and the... | 03/02/2010 |
| 7572339 | Surface treatment system and method thereof Disclosed are a surface treatment system that includes a deposition chamber (100) for forming a deposition layer at a surface of an object of surface treatment (900); a carrier (910) for carrying the object of surface treatment (900) by m... | 08/11/2009 |
| 7572340 | High resolution substrate holder leveling device and method A device for adjusting a spacing between a chamber body such as a chamber body and a leveling plate such as a leveling plate comprises a mounting stud configured to be mounted to the chamber body. The mounting stud includes a stud threaded surface. A bushing is capa... | 08/11/2009 |
| 7527694 | Substrate gripping apparatus In one embodiment, a substrate centering apparatus for centering a substrate on a substrate support is provided. In one embodiment, the invention comprises an apparatus that is mounted to an underside of a substrate support and includes a lever that projects upward ... | 05/05/2009 |
| 7455735 | Width adjustable substrate support for plasma processing An electrode assembly for use in a plasma processing system that includes removable rails that are adjustable for reconfiguring the electrode to accommodate substrates of different widths. The electrode assembly includes an electrode having a plurality of first conn... | 11/25/2008 |
| 7429718 | Heating and cooling of substrate support A substrate support assembly and method for controlling the temperature of a substrate within a process chamber are provided. A substrate support assembly includes an thermally conductive body comprising a stainless steel material, a substrate support surface on the... | 09/30/2008 |
| 7422637 | Processing chamber configured for uniform gas flow An apparatus and method for performing uniform gas flow in a processing chamber is provided. In one embodiment, an apparatus is an edge ring that includes an annular body having an annular seal projecting therefrom is provided. The seal is coupled to a side of the a... | 09/09/2008 |
| 7422636 | Plasma enhanced atomic layer deposition system having reduced contamination A plasma enhanced atomic layer deposition (PEALD) system is described, wherein the system comprises a processing space and a high vacuum, ultra-clean transfer space. During processing, the substrate to which the thin conformal film is formed is exposed to the proces... | 09/09/2008 |
| 7419551 | Plasma reactor with apparatus for dynamically adjusting the plasma source power applicator and the workpiece relative to one another A plasma reactor for processing a workpiece includes a process chamber comprising an enclosure including a ceiling and having a vertical axis of symmetry generally perpendicular to said ceiling, a workpiece support pedestal inside the chamber and generally facing th... | 09/02/2008 |
| 7413628 | Substrate treatment method and substrate treatment apparatus A substrate treatment method for treating a substrate by supplying a treatment liquid to the substrate while rotating the substrate. The method comprises the steps of: performing a first substrate rotation process for rotating the substrate while clamping the substr... | 08/19/2008 |
| 7413612 | In situ substrate holder leveling method and apparatus Embodiments of the present invention are directed to adjusting the spacing between the substrate support and the faceplate of the gas distribution member to achieve improved uniformity of the layer formed on the substrate. One embodiment of the present invention is ... | 08/19/2008 |
| 7402778 | Oven for controlled heating of compounds at varying temperatures An oven is provided for curing or reflowing compounds on objects, such as lead frames or other substrates. The oven comprises a heating chamber, a heating assembly mounted in thermal communication with the heating chamber to provide heat thereto, and a support assem... | 07/22/2008 |
| 7393418 | Susceptor A susceptor at least a surface thereof being coated with SiC, includes a recess where an wafer is mounted, the recess having an round portion disposed on a lower portion of an outer circumferential portion of the recess, a ring-shaped SiC crystal growth surface port... | 07/01/2008 |
| 7393433 | Plasma processing apparatus, semiconductor manufacturing apparatus and electrostatic chucking unit used thereof A wiring member which becomes substantially symmetrical on the plane of an electrostatic chuck unit is connected to the tip end of an RF introduction rod between the RF introduction rod and the electrostatic chuck unit in order to make uniform generation of an elect... | 07/01/2008 |
| 7393207 | Wafer support tool for heat treatment and heat treatment apparatus The present invention provides a wafer support tool for heat treatment easy in working and capable of realizing reduction in cost without generating damages or slip dislocations that would be otherwise caused by high temperature heat treatment and a heat treatment a... | 07/01/2008 |
| 7387686 | Film formation apparatus A metal atomic layer and an oxygen atomic layer are formed in this order by ALD, followed by rapid heating through RTA (Rapid Thermal Annealing). This cycle of steps is repeated to form a high dielectric constant film. ... | 06/17/2008 |
| 7371998 | Thermal wafer processor A thermal processor may include a cooling jacket positionable around a process chamber within a process vessel or jar. A heater can move into a position substantially between the process chamber vessel and the cooling jacket. A holder having multiple workpiece holdi... | 05/13/2008 |
| 7371287 | Substrate handling system A substrate handling system and method in which an air chuck produces a film of air between the substrate and the air chuck, a magnetic chuck attracts the substrate to the air chuck, and an actuator subsystem moves the magnetic chuck closer to and away from the air ... | 05/13/2008 |
| 7351646 | Laser annealing method and laser annealing device In order to promote an effect of laser annealing in respect of a semiconductor film, moisture is intentionally included in an atmosphere in irradiating laser beam to the semiconductor film by which a temperature holding layer comprising water vapor is formed on the ... | 04/01/2008 |
| 7351292 | Assembly for processing substrates An assembly for processing substrates, which processing comprises a vacuum deposition process, such as, for instance, sputtering, CVD or PECVD, which vacuum deposition process is carried out in at least one process chamber, the assembly being provided with a conveyi... | 04/01/2008 |
| 7351293 | Method and device for rotating a wafer Method and device for rotating a wafer which is arranged floating in a reactor. The wafer is treated in a reactor of this nature, and it is important for this treatment to be carried out as uniformly as possible. For this purpose, it is proposed to rotate the wafer ... | 04/01/2008 |
| 7347900 | Chemical vapor deposition apparatus and method A chemical vapor deposition (CVD) apparatus includes a process chamber where a deposition process is performed on a wafer. A gas supply assembly is mounted in the process chamber for supplying a process gas to the process chamber, and a vacuum pump is mounted in the... | 03/25/2008 |
| 7335394 | Substrate supporting frame A substrate supporting frame, a substrate supporting frame assembly including the frame, a method of framing a substrate using the frame, a method of fabricating a donor substrate using the substrate supporting frame assembly, and a method of fabricating an Organic ... | 02/26/2008 |
| 7331307 | Thermally sprayed member, electrode and plasma processing apparatus using the electrode A thermally sprayed member or an electrode includes a basic material, a thermally sprayed film formed on the surface of the basic material, the thermally sprayed film being made of an insulating ceramic and a metallic intermediate layer provided between the basic ma... | 02/19/2008 |
| 7326303 | Single-pass growth of multilayer patterned electronic and photonic devices using a scanning localized evaporation methodology (SLEM) This invention describes an apparatus, Scanning Localized Evaporation Methodology (SLEM) for the close proximity deposition of thin films with high feature definition, high deposition rates, and significantly improved material economy. An array of fixed thin film he... | 02/05/2008 |
| 7317172 | Bake system Provided is a bake system. The bake system includes a heating plate having a heating plate having a substrate on an upper surface. A case is disposed below the heating plate to support the heating plate; a first cover is disposed above the heating plate and coupled ... | 01/08/2008 |
| 7309269 | Method of fabricating light-emitting device and apparatus for manufacturing light-emitting device In this embodiment, an interval distance between a desposition source holder 17 and an object on which deposition is performed (substrate 13) is reduced to 30 cm or less, preferably 20 cm or less, more preferably 5 to 15 cm, and a deposition source hol... | 12/18/2007 |
| 7303937 | Method of manufacturing a quantum-dot element A method for manufacturing a quantum-dot element is disclosed. The method includes the following steps. First, a deposition chamber having at least one atomizer and a substrate-supporting base is provided. The atomizer is connected to a gas inlet and a sample inlet.... | 12/04/2007 |
| 7303991 | Atomic layer deposition methods The invention includes an atomic layer deposition method of forming a layer of a deposited composition on a substrate. The method includes positioning a semiconductor substrate within an atomic layer deposition chamber. On the substrate, an intermediate composition ... | 12/04/2007 |
| 7301190 | Structures and methods to enhance copper metallization Disclosed structures and methods inhibit atomic migration and related capacitive-resistive effects between a metallization layer and an insulator layer in a semiconductor structure. One exemplary structure includes an inhibiting layer between an insulator and a meta... | 11/27/2007 |
| 7299104 | Substrate processing apparatus and substrate transferring method Shock waves occurring when opening a gate valve between two vacuum chambers and peeling of particles by a viscous force taking place when a gas is supplied into a vacuum chamber are necessary to be suppressed by the apparatus and method of the invention, whereby con... | 11/20/2007 |
