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| Number | Title | Issue Date |
| 6814808 | Carrier for semiconductor wafers A quartz carrier having spaced, parallel grooved rods for holding a batch of semi-conductor wafers edgewise in upstanding, spaced, parallel relation is formed with a pair of flat end plates supporting the ends of the rods. The ends of the end plates extend laterally... | 11/09/2004 |
| 6805749 | Method and apparatus for supporting a semiconductor wafer during processing A semiconductor wafer is processed while being supported without mechanical contact. Instead, the wafer is supported by gas streams emanating from a large number of passages in side sections positioned very close to the upper and lower surface of the wafer. The gas ... | 10/19/2004 |
| 6800173 | Variable gas conductance control for a process chamber A deposition system in accordance with one embodiment of the present invention includes a process chamber, a stationary pedestal for supporting a substrate in the process chamber, and a moveable shield forming at least a portion of an enclosure defining the process ... | 10/05/2004 |
| 6797068 | Film forming unit A film-forming unit of the invention includes a processing container in which a vacuum can be created, a stage arranged in the processing container, on which an object to be processed is placed, a process-gas supplying means for supplying a process gas into the proc... | 09/28/2004 |
| 6793734 | Heating furnace and semiconductor wafer-holding jig assembly and process of manufacturing semiconductor devices An assembly of heating furnace and semiconductor wafer-holding jig. This assembly includes a furnace body made of refractory or heat insulting material; a heater disposed around the inner side surface of the furnace body; a reaction chamber which forms a uniform hea... | 09/21/2004 |
| 6793767 | Wafer stage including electrostatic chuck and method for dechucking wafer using the wafer stage A wafer stage including an electrostatic chuck and a method for dechucking a wafer using the wafer stage are provided, wherein, the wafer stage includes an electrostatic chuck support, an electrostatic chuck, a lifting means, and a grounding means including a device... | 09/21/2004 |
| 6786998 | Wafer temperature control apparatus and method An assembly for holding a substrate is provided. The substrate has a first surface, a second surface, opposite the first surface and an outer peripheral portion. The assembly includes a holding body having a support surface for supporting the substrate. The holding ... | 09/07/2004 |
| 6786969 | Method and apparatus for producing single crystal, substrate for growing single crystal and method for heating single crystal It is the purpose of the present invention to prevent a macroscopic defect in the production of an SiC single crystal. SiC source material powder and an SiC seed crystal are disposed inside a graphite crucible, and the SiC source material powder is thermally sublima... | 09/07/2004 |
| 6783596 | Wafer handling device The present invention provides a wafer handling device having a base plate (G; G′), which has a first and a second supporting surface for a respective wafer (W1, W2) to be laid on; and a fixing device (K1, K2, S; K1′, K2′ | 08/31/2004 |
| 6783630 | Segmented cold plate for rapid thermal processing (RTP) tool for conduction cooling The present invention is directed to a semiconductor thermal processing system and an apparatus for thermally cooling a semiconductor substrate. According to one aspect of the present invention, a semiconductor thermal processing system and associated apparatus and ... | 08/31/2004 |
| 6783598 | Moisture barrier sealing of fiber optic coils A method of applying a moisture barrier seal to a fiber optic coil includes mounting a fiber optic coil in a vacuum deposition chamber, so as to expose a large exterior surface area of the fiber optic coil to an interior portion of the deposition chamber. The method... | 08/31/2004 |
| 6780787 | Low contamination components for semiconductor processing apparatus and methods for making components Components of semiconductor processing apparatus are formed at least partially of erosion, corrosion and/or corrosion-erosion resistant ceramic materials. Exemplary ceramic materials can include at least one oxide, nitride, boride, carbide and/or fluoride of hafnium... | 08/24/2004 |
| 6780251 | Substrate processing apparatus and method for fabricating semiconductor device A substrate processing apparatus includes a first holder made of silicon carbide or silicon and a second holder made of quartz. Each of the first and the second holder is of a ring shape and the second ring shaped holder is mounted on the first holder. The second ho... | 08/24/2004 |
| 6776875 | Semiconductor substrate support assembly having lobed o-rings therein A semiconductor wafer processing substrate support assembly, comprises a substrate support platform having a centrally disposed recess, coupled to a base disposed above the centrally disposed recess, a plate disposed above the base, and a substrate support disposed ... | 08/17/2004 |
| 6776874 | Processing method and apparatus for removing oxide film A processing method and apparatus for removing a native oxide film from the surface of a subject to be treated, wherein plasma is generated from N2 and H2 gases and then activated to form an activated gas species, NF3 gas is added to... | 08/17/2004 |
| 6776850 | Preventative maintenance aided tool for CVD chamber A preventive maintenance tool which may be installed on a metal chemical vapor deposition (CVD) chamber to prevent escape of contaminating and toxic gases from the chamber interior during preventative maintenance (PM) cleaning of the chamber. The tool comprises a cy... | 08/17/2004 |
| 6776849 | Wafer holder with peripheral lift ring A wafer holder for supporting a wafer within a CVD processing chamber includes a vertically moveable lift ring configured to support the bottom peripheral surface of the wafer, and an inner plug having a top flat surface configured to support the wafer during wafer ... | 08/17/2004 |
| 6774376 | Wafer holding pin A wafer holder assembly includes first and second main structural members from which first and second wafer-holding arms extend. The first arm is secured to the main structural members by a graphite distal retaining member. The second arm is pivotally biased to a wa... | 08/10/2004 |
| 6773562 | Shadow frame for substrate processing A vacuum processing chamber with walls defining a cavity for processing a substrate. The processing chamber includes a substrate support for supporting a substrate being processed in the cavity, a shadow frame for preventing processing of a perimeter portion of the ... | 08/10/2004 |
| 6772827 | Suspended gas distribution manifold for plasma chamber A gas inlet manifold for a plasma chamber having a perforated gas distribution plate suspended by a side wall comprising one or more sheets. The sheets preferably provide flexibility to alleviate stress in the gas distribution plate due to thermal expansion and cont... | 08/10/2004 |
| 6772710 | Plasma enhanced chemical vapor deposition apparatus In a PECVD (plasma enhanced chemical vapor deposition) apparatus including a reaction chamber; plural susceptors installed inside the reaction chamber and horizontally mounted with a wafer respectively; a heating means for heating the susceptors; a power supply unit... | 08/10/2004 |
| 6770144 | Multideposition SACVD reactor There is disclosed a high throughput multideposition SACVD reactor that enables the rapid thermal deposition of dielectric materials such as Si3N4, SiO2, and SiON and non-dielectric materials such as polysilicon onto a semiconductor ... | 08/03/2004 |
| 6770146 | Method and system for rotating a semiconductor wafer in processing chambers The present invention is generally directed to a system and process for rotating semiconductor wafers in thermal processing chambers, such as rapid thermal processing chambers and chemical vapor deposition chambers. In accordance with the present invention, a semico... | 08/03/2004 |
| 6767429 | Vacuum processing apparatus In a plasma CVD apparatus for applying a film deposition process to a semiconductor wafer (W), a wafer placement stage (3) is provided at a center of a vacuum chamber (2). The placement stage (3) is mounted to a side wall (63) via a suppo... | 07/27/2004 |
| 6767407 | Auto-centering device for mechanical clamp A substrate holding mechanism which is particularly adaptable to automatically centering a semiconductor wafer on a platen spider as the wafer is lowered from a wafer loading and unloading position to a wafer processing position in a medium current implanter such as... | 07/27/2004 |
| 6759253 | Process monitoring methods in a plasma processing apparatus, monitoring units, and a sample processing method using the monitoring units The intensity of the light emitted from the light-emitting diode on wafer is measured and then the potential difference between the terminals of the light-emitting element, and the plasma current flowing thereinto are derived from measured light intensity. Since the... | 07/06/2004 |
| 6758909 | Gas port sealing for CVD/CVI furnace hearth plates A method and apparatus for sealing gas ports in CVD/CVI furnaces and processes is disclosed. A fluid direction nozzle (160) is positioned between a top lip (101) of a gas inlet port (100) delivering a reactant gas (G) to a furnace compartment ( | 07/06/2004 |
| 6753507 | Wafer heating apparatus In a ceramic heater having a plate-like body made of a ceramic, heating element in one main face of the plate like body, and an electric supply portion to be electrically connected with the heating element, it has been a problem that the temperature is uneven if ben... | 06/22/2004 |
| 6752625 | Method and apparatus device for the heat treatment of substrates The invention relates to a device and a method for the heat treatment of substrates, especially semiconductor wafers. The device comprises a reaction chamber with a compensation element. According to the invention the substrate can be inserted and withdrawn again mo... | 06/22/2004 |
| 6746540 | Wafer support plate assembly having recessed upper pad and vacuum processing apparatus comprising the same A plate assembly on which a wafer is supported in the processing chamber of a processing apparatus facilitates a precise transfer of the wafer therefrom even when a vacuum atmosphere is present in the chamber. The plate assembly includes an underlying support plate ... | 06/08/2004 |
| 6740367 | Plasma CVD film-forming device A plasma CVD film-forming device forms a film on a semiconductor substrate in such as way that the film quality and film thickness of a thin film becomes uniform. The plasma CVD film-forming device to form a thin film on a semiconductor substrate includes a vacuum c... | 05/25/2004 |
| 6740167 | Device for mounting a substrate and method for producing an insert for a susceptor A device for mounting a substrate includes a susceptor as a support for the substrate to be coated. The susceptor includes an insert whose surface is at least partly formed by a metal carbide layer of a predetermined thickness. The device for mounting the substrate ... | 05/25/2004 |
| 6736901 | Vertical chemical vapor deposition system A susceptor is arranged in a reaction chamber, and an induction heating coil is arranged at a lower side of the susceptor. A ceiling of a bell jar is provided with an observation port, and an infrared radiation thermometer is arranged outside the observation port. A... | 05/18/2004 |
| 6733624 | Apparatus for holding an object to be processed An apparatus for holding an object to be processed, according to this invention is mounted in a plasma processing apparatus and includes a convex-shaped holder main body, first dielectric film, and second dielectric film. The holder main body has a holding portion w... | 05/11/2004 |
| 6733829 | Anti-binding deposition ring A deposition ring which has a cut out on its interior circumferential edge. The deposition ring is configured to contact an edge of an electrostatic chuck and shield at least a portion of the electrostatic chuck during a deposition process wherein material is deposi... | 05/11/2004 |
| 6730175 | Ceramic substrate support A substrate support assembly for supporting a substrate during processing is provided. In one embodiment, a support assembly includes a ceramic body having an embedded heating element and a base plate. The base plate and the ceramic body define a channel therebetwee... | 05/04/2004 |
| 6726799 | Plasma etching apparatus with focus ring and plasma etching method A focus ring is disposed along a circumference of a semiconductor substrate on a lower electrode. A sensor measures a position of an upper surface of the focus ring, and a drive mechanism 6 drives the focus ring vertically. A controller adjusts the position o... | 04/27/2004 |
| 6726805 | Pedestal with integral shield Generally, a substrate support member for supporting a substrate is provided. In one embodiment, a substrate support member for supporting a substrate includes a body coupled to a lower shield. The body has an upper surface adapted to support the substrate and a low... | 04/27/2004 |
| 6723437 | Semiconductor processing component having low surface contaminant concentration A method for cleaning ceramic workpieces such as SiC boats used in semiconductor fabrication is disclosed. The method comprises washing a virgin or used ceramic workpiece with a strong acid and then using a pelletized CO2 cleaning process on the acid-wash... | 04/20/2004 |
| 6723214 | Apparatus for improved power coupling through a workpiece in a semiconductor wafer processing system Apparatus for supporting a substrate such as a semiconductor wafer in a process chamber to improve power coupling through the substrate. The apparatus contains a pedestal assembly and a pedestal cover positioned over the top surface of and circumscribing the pedesta... | 04/20/2004 |
