U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Icon_funbox Quotables

"We live in a society exquisitely dependent on science and technology, in which hardly anyone knows anything about science and technology."

Carl Sagan

Newsletter  PatentStorm News

Make the Most of Our Site

See this month's Top Inventors and Most Cited Patents.

Stay on top of the latest innovations by subscribing to an RSS feed.

Registered users: Manage your profile.

 

Class 118/723R - By creating electric field (e.g., gas activation, plasma, etc.)


Subclass of Class 118 - Coating apparatus
Definition: Apparatus wherein the means performing the additional conditioning
No. of patents: 911
Last issue date: 03/27/2012


1                      
NumberTitleIssue Date
8141514Plasma processing apparatus, plasma processing method, and storage medium
A plasma processing apparatus having a substrate processing chamber, which enables leakage of plasma into an exhaust space to be prevented. The substrate processing chamber has therein a processing space in which plasma processing is carried out on a substrate, an e...
03/27/2012
8136480Physical vapor deposition system
A physical vapor deposition system for making microparticles generated by using a non-transfer type plasma torch not generating an outgas even in an ultra-high vacuum environment accelerate by a supersonic gas flow and depositing microparticles on a substrate to for...
03/20/2012
8117986Apparatus for an improved deposition shield in a plasma processing system
The present invention presents an improved deposition shield for surrounding a process space in a plasma processing system, wherein the design and fabrication of the deposition shield advantageously provides for a clean processing plasma in the process space with su...
02/21/2012
8104428Plasma processing apparatus
A plasma processing apparatus that enables formation of a deposit film on a surface of a grounding electrode to be prevented. A substrate processing chamber has therein a processing space in which plasma processing is carried out on a substrate, an RF electrode that...
01/31/2012
8100081Edge removal of films using externally generated plasma species
The present invention provides methods and apparatuses for removing unwanted film from the edge area of substrate using remotely-generated plasmas. Activated plasma species are directed to the edge of the substrate to contact and remove the unwanted film, while intr...
01/24/2012
8074599Plasma uniformity control by gas diffuser curvature
Embodiments of a gas distribution plate for distributing gas in a processing chamber are provided. In one embodiment, a gas distribution assembly for a plasma processing chamber comprises a diffuser plate with gas passages passing between its upstream and downstream...
12/13/2011
8011320Rotary pressure distributor and carousel-type hollow body treatment machine equipped therewith
Rotary pressure distributor for a carousel-type hollow-body treatment machine, comprising several treatment stations, this distributor comprising two coaxial rings (2, 3) in sealed contact, one of them (3) a rotary ring comprising communication orifice...
09/06/2011
8001927Plasma spraying device and a method for introducing a liquid precursor into a plasma gas stream
The invention relates to a plasma spraying device (1) for spraying a coating (2) onto a substrate (3) by a thermal spray process. Said plasma spraying device (1) includes a plasma torch (4) for heating up a plasma gas (5) in...
08/23/2011
7987814Lower liner with integrated flow equalizer and improved conductance
A plasma processing chamber has a lower liner with an integrated flow equalizer. In an etching process, the processing gases may be unevenly drawn from the processing chamber which may cause an uneven etching of the substrate. The integrated flow equalizer is config...
08/02/2011
7942111Method and device for vacuum-coating a substrate
A method is proposed for vacuum-coating a substrate using a plasma-CVD method. In order to control ion bombardment during the vacuum coating, a substrate voltage, produced independently from a coating plasma, is applied to the substrate. The substrate voltage is mod...
05/17/2011
7913646Vacuum processing apparatus and vacuum processing method
The invention provides a vacuum processing apparatus having a function for removing particles on the surface of the sample stage in order to improve the yield of the sample being processed. The vacuum processing apparatus comprises a processing chamber 104 di...
03/29/2011
7913645Methods and apparatus for incorporating nitrogen in oxide films
In a first aspect, a first method is provided. The first method includes the steps of (1) preconditioning a process chamber with an aggressive plasma; (2) loading a substrate into the process chamber; and (3) performing plasma nitridation on the substrate within the...
03/29/2011
7882800Ring mechanism, and plasma processing device using the ring mechanism
A ring mechanism, comprising a focus ring and divided cover rings surrounding a wafer W placed on a loading table (lower electrode) mounted in a processing chamber, wherein a ring-shaped clearance δ1 is provided between the divided rings to spread plasma to ...
02/08/2011
7832354Cathode liner with wafer edge gas injection in a plasma reactor chamber
The disclosure concerns a wafer support for use in a plasma reactor chamber, in which the wafer support has a wafer edge gas injector adjacent and surrounding the wafer edge. ...
11/16/2010
7810448Apparatus and method for the treating of workpieces
The invention relates to an apparatus and a method for the coating of hollow bodies, in particular for the internal coating of plastic drinks bottles by means of a PICVD. It is an object of the invention to ensure a flexible process sequence, a high throughput, an i...
10/12/2010
7793612Ring plasma jet method and apparatus for making an optical fiber preform
A method and apparatus for making an optical fiber preform, including injecting a plasma gas source into the first end of a tubular member; generating a ring plasma flame with the plasma gas source flowing through a plasma gas feeder nozzle, the plasma gas feeder no...
09/14/2010
7665416Apparatus for generating excited and/or ionized particles in a plasma and a method for generating ionized particles
An apparatus is described for generating excited and/or ionized particles in a plasma with a generator for generating an electromagnetic wave and an excitation chamber with a plasma zone in which the excited and/or ionized particles are formed. At least one excitati...
02/23/2010
7578258Methods and apparatus for selective pre-coating of a plasma processing chamber
An apparatus for selectively pre-coating a plasma processing chamber, including a chamber wall is disclosed. The apparatus includes a first set of RF electrodes, the first set of RF electrodes configured to strike a first pre-coat plasma, the first set of RF electro...
08/25/2009
7571698Low-frequency bias power in HDP-CVD processes
A substrate processing system has a housing that defines a process chamber. A substrate holder disposed within the process chamber supports a substrate during substrate processing. A gas-delivery system introduces a gas into the process chamber. A pressure-control s...
08/11/2009
7484473Suspended gas distribution manifold for plasma chamber
A gas inlet manifold for a plasma chamber having a perforated gas distribution plate suspended by a side wall comprising one or more sheets. The sheets preferably provide flexibility to alleviate stress in the gas distribution plate due to thermal expansion and cont...
02/03/2009
7458335Uniform magnetically enhanced reactive ion etching using nested electromagnetic coils
A magnetic field-enhanced plasma reactor is disclosed, comprising a reaction chamber for applying a plasma to a substrate, a plurality of primary electromagnets disposed about said reaction chamber, and a plurality of secondary electromagnets. At least two of the pr...
12/02/2008
7438018Confinement ring assembly of plasma processing apparatus
A confinement ring assembly of a plasma treatment apparatus includes a cam ring disposed above the process chamber, a plurality of plungers disposed about a process chamber of the apparatus and operated by the cam ring, and a plurality of confinement rings coupled t...
10/21/2008
7439678Magnetic and electrostatic confinement of plasma with tuning of electrostatic field
A system and method for containing plasma and forming a Field Reversed Configuration (FRC) magnetic topology are described in which plasma ions are contained magnetically in stable, non-adiabatic orbits in the FRC. Further, the electrons are contained electrostatica...
10/21/2008
7438765Adjustable shielding plate for adjusting an etching area of a semiconductor wafer and related apparatus and methods
An apparatus for adjusting an etching area of a semiconductor wafer includes an adjustable shielding plate. The adjustable shielding plate includes a plurality of shielding members. Each of the plurality of shielding members are movable between a first position conf...
10/21/2008
7431767Apparatus and method for growth of a thin film
An improved apparatus and method for substrate layer deposition in which substrate layers are grown by carrier gas delivery of sequential pulses of reactants to the substrate surface. At least one of the reactants comprises excited species, e.g., radicals. In a spec...
10/07/2008
7431797Plasma reactor with a dynamically adjustable plasma source power applicator
A plasma reactor for processing a workpiece includes a process chamber having an enclosure including a ceiling and having a vertical axis of symmetry generally perpendicular to the ceiling, a workpiece support pedestal inside the chamber and generally facing the cei...
10/07/2008
7429306Plasma processing system
A plasma processing system includes a plasma processing chamber and a plasma confining portion for defining a plasma confined area in the processing chamber. The plasma confining portion includes a plurality of spaced-apart segments arranged in a structural array. A...
09/30/2008
7422656Dry etching method and apparatus for use in the LCD device
A dry etching step during the manufacturing of a substrate for a liquid crystal display (LCD) device is improved by placing the substrate at a predetermined distance away from the lower electrode to prevent damage of the substrate due to electrostatic formed therebe...
09/09/2008
7421974Layer forming method, product comprising the layer, optical film, dielectric-coated electrode and plasma discharge apparatus
A layer forming method is disclosed which comprises the steps of supplying power of not less than 1 W/cm2 at a high frequency voltage exceeding 100 kHz across a gap between a first electrode and a second electrode opposed to each other at atmospheric pres...
09/09/2008
7419551Plasma reactor with apparatus for dynamically adjusting the plasma source power applicator and the workpiece relative to one another
A plasma reactor for processing a workpiece includes a process chamber comprising an enclosure including a ceiling and having a vertical axis of symmetry generally perpendicular to said ceiling, a workpiece support pedestal inside the chamber and generally facing th...
09/02/2008
7419566Plasma reactor
The plasma reactor comprises at least one cooling device (15, 16) consisting of two cooling elements (15a, 15b; 16a, 16b) adapted to be separately switched on and off. The heat produced during the plasma...
09/02/2008
7416633Plasma processing apparatus
Described is a vacuum processing apparatus that includes a vacuum container which has a processing chamber inside thereof, wherein a plasma used for processing a sample is formed inside the processing chamber. The processing chamber has an upper side wall which surr...
08/26/2008
7405521Multiple frequency plasma processor method and apparatus
A workpiece is processed with a plasma in a vacuum plasma processing chamber by exciting the plasma at several frequencies such that the excitation of the plasma by the several frequencies simultaneously causes several different phenomena to occur in the plasma. The...
07/29/2008
7392759Remote plasma apparatus for processing substrate with two types of gases
In a plasma CVD apparatus, a plate formed with a plurality of perforated holes is arranged to separate a plasma generation region and a processing region. The aperture ratio of the perforated holes to the plate is not greater than five percent. Plasma including radi...
07/01/2008
7387081Plasma reactor including helical electrodes
A device for forming an ion sheath in a plasma to deposit coatings on a non-conducting substrate. The device comprises a tubular reaction chamber having an outer surface wound helically with a first electrode having a first width. Helical winding of the first electr...
06/17/2008
7382098Plasma producing apparatus and doping apparatus
An object of the present invention is to provide an apparatus for producing stable plasma. Another object of the present invention is to provide an apparatus having a long-lasting cathode electrode which is superior in field emission characteristic since the plasma ...
06/03/2008
7374941Active reactant vapor pulse monitoring in a chemical reactor
A method and apparatus for determining changes in a supply system, designed to supply repeated pulses of a vapor phase reactant to a reaction chamber is disclosed. One embodiment involves providing the reactant source, and a gas conduit to connect the reactant sourc...
05/20/2008
7374620Substrate processing apparatus
A substrate processing apparatus (10A) using a microwave plasma is disclosed wherein an inner partition wall (15) is provided within a process chamber (11) so that the inside of the process chamber (11) is divided into a space (11A...
05/20/2008
7371332Uniform etch system
Etching a layer over a substrate is provided. The substrate is placed in a plasma processing chamber. A first gas is provided to an inner zone within the plasma processing chamber. A second gas is provided to the outer zone within the plasma processing chamber, wher...
05/13/2008
7371647Methods of forming transistors
The invention encompasses a method of forming a structure over a semiconductor substrate. A silicon dioxide containing layer is formed across at least some of the substrate. Nitrogen is formed within the silicon dioxide containing layer. Substantially all of the nit...
05/13/2008
1                      
 
Sign InRegister
Username  
Password   
forgot password?