Did You Know...
...that power steering was invented by independent inventor Francis W. Davis? As chief engineer in the 1920s of the truck division of the Pierce Arrow Motor Car Company, he saw how hard it was to steer heavy vehicles. So that he would be able to keep the profits from his future invention, Davis left his job, rented a small engineering shop in Waltham, Mass., and developed a hydraulic power steering system that led to power steering.
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| Number | Title | Issue Date |
| 8066806 | Sintered silicon oxide for film vapor deposition, its production method, and method for producing silicon oxide vapor deposition film A sintered silicon oxide for film vapor deposition having a density of 1.0 to 2.0 g/cm3, three-point flexural strength of at least 50 g/mm2, and a BET specific surface area of 0.1 to 20 m2/g is provided. When this sintered silicon ox... | 11/29/2011 |
| 7998263 | Sintered silicon oxide for film vapor deposition, its production method, and method for producing silicon oxide vapor deposition film A sintered silicon oxide for film vapor deposition having a density of 1.0 to 2.0 g/cm3, three-point flexural strength of at least 50 g/mm2, and a BET specific surface area of 0.1 to 20 m2/g is provided. When this sintered silicon ox... | 08/16/2011 |
| 7323581 | Source reagent compositions and method for forming metal films on a substrate by chemical vapor deposition A metalorganic complex composition comprising a metalorganic complex selected from the group consisting of: metalorganic complexes comprising one or more metal central atoms coordinated to one or more monodentate or multidentate organic ligands, and complexed with o... | 01/29/2008 |
| 7291385 | Conductive film and method for preparing the same A conductive film comprising: a support; a particle-containing layer; and a metal thin film layer, in this order, wherein the particle-containing layer contains particles having a mean particle size of from 1 to 10 μm and a heat decomposed material of a metal acety... | 11/06/2007 |
| 7235681 | Method for producing organoaluminum complexes and the use thereof for producing electrolyte solutions for the electrochemical deposition of aluminum-magnesium alloys The invention relates to a method for producing electrolyte solutions consisting of trialkylaluminium AlR3, M1AlR4, M2AlR4 and an aromatic hydrocarbon. According to the invention, a mixture of M1OR an... | 06/26/2007 |
| 7204871 | Metal plating process A process for forming a coating on a metal substrate includes contacting the substrate with a molybdate solution having a pH of between 3.5 and 5 inclusive containing an acid with the proviso that the acid is not nitric acid. The substrate is contacted with the solu... | 04/17/2007 |
| 7156904 | Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby An aqueous copper-to-resin bonding layer solution comprising: (a) at least one acid type; (b) tin salt or tin oxide; (c) salt or oxide of at least one type of metal selected from the group consisting of: silver, zinc, aluminum, titanium, bismuth, chromium, iron, cob... | 01/02/2007 |
| 7105082 | Composition and method for electrodeposition of metal on a work piece A composition for electrodeposition of a metal on a work piece, which electrodeposition is conducted at an electrodeposition temperature, is provided. The composition comprises a metal salt, a polymer suppressor having a cloud point, an accelerator and an electrolyt... | 09/12/2006 |
| 7087104 | Preparation of electroless deposition solutions A system and method for storing a solution containing a subset of a group consisting of a metal ion, a complexing agent, an ammonium salt, and a strong base and then nearer to a time of use in an electroless deposition process, using the solution to form an electrol... | 08/08/2006 |
| 7025823 | High temperature gasket coating The present invention relates to a method of coating a gasket that includes electrostatically spraying a solvent-free coating material onto a grounded gasket and then fusing the material to itself and the gasket. In one aspect, a particulate lubricant and a silicone... | 04/11/2006 |
| 7026480 | Organometallic light-emitting material Disclosed herein are novel light-emitting materials of Formula I and II below. These new complexes are synthesized and found to be sufficiently stable to allow sublimation and vacuum deposition. These new emitters are electrophosphorescent and can be used in organic... | 04/11/2006 |
| 6987197 | Organozirconium composite and method of synthesizing the same, raw material solution containing the same, and method of forming lead zirconate titanate thin film The organozirconium composite of the present invention has a decomposition temperature which is near the respective decomposition temperatures of an organolead compound and an organotitanium compound. The raw material solution can precisely control the composition o... | 01/17/2006 |
| 6911068 | Plating bath and method for depositing a metal layer on a substrate A metal plating bath containing organic compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with resp... | 06/28/2005 |
| 6911067 | Solution composition and method for electroless deposition of coatings free of alkali metals An electroless deposition solution of the invention for forming an alkali-metal-free coating on a substrate comprises a first-metal ion source for producing first-metal ions, a pH adjuster in the form of a hydroxide for adjusting the pH of the solution, a reducing a... | 06/28/2005 |
| 6908504 | Electroless plating bath composition and method of using The present invention relates to a cobalt electroless plating bath composition and method of using it for microelectronic device fabrication. In one embodiment, the present invention relates to cobalt electroless plating in the fabrication of interconnect structures... | 06/21/2005 |
| 6860925 | Printed circuit board manufacture A process used during manufacture of printed circuit boards comprises protecting metal pads and/or through-holes to provide a tarnish-resistant and solderable coating. In the method, the pads and/or through-holes are bright-etched, metal plated, preferably by an imm... | 03/01/2005 |
| 6860981 | Minimizing whisker growth in tin electrodeposits The present invention relates to a method for reducing tin whisker formation in tin deposits by plating on an underlying metal tin deposits which are predominantly in a predetermined crystal orientation that essentially matches that of the underlying metal in order ... | 03/01/2005 |
| 6837980 | Bond enhancement antitarnish coatings Aqueous electroplating solutions and methods are provided for the codeposition of zinc and chromium. The solutions include effective amounts of zinc, chromium, and hydroxyl ions. The solutions further include an effective amount of one or more ions of alkali metals,... | 01/04/2005 |
| 6821323 | Process for the non-galvanic tin plating of copper or copper alloys The invention describes a process for non-galvanic tin plating of copper and copper alloys by precipitation of tin from methanesulphonic acid and tin-containing electrolytes, containing a complexing agent. In describing a process by which a durable tin layer which c... | 11/23/2004 |
| 6797142 | Tin plating Electrolyte compositions for the deposition of tin and tin-alloys on a substrate are disclosed, along with methods of electroplating tin and tin-alloys using such compositions. These electrolyte compositions are useful for high speed tin plating. ... | 09/28/2004 |
| 6776826 | Composition and method for electroless plating of non-conductive substrates Compositions and methods for coating and plating a non-conductive substrate, the substrate having a surface, comprising coating the surface with a binding solution composition, the binding solution composition comprising between approximately 30% by weight and appro... | 08/17/2004 |
| 6773573 | Plating bath and method for depositing a metal layer on a substrate A metal plating bath containing alcohol compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with resp... | 08/10/2004 |
| 6736954 | Plating bath and method for depositing a metal layer on a substrate A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom organic compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of p... | 05/18/2004 |
| 6730209 | Solder electroplating bath including brighteners having reduced volatility In accordance with the invention, the volatility of a solder plating bath with volatile brighteners such as aldehydes has its volatility reduced by the addition of diols to the bath. The diols are advantageously 1,3 propanediol or 1,2 propanediol and are accompanied... | 05/04/2004 |
| 6726827 | Electroplating solution for high speed plating of tin-bismuth solder In accordance with the present invention, an electroplating solution is provided for electroplating satin bright tin-bismuth alloy solder coatings in high speed electroplating applications. The solution comprises a sulfonic acid electrolyte, a soluble tin compound, ... | 04/27/2004 |
| 6689199 | Apparatus and method for introducing small amounts of refractory elements into a vapor deposition coating A method of introducing small amounts of a refractory element into a vapor deposition coating. A second material (30), containing at least two elements which are desired to be deposited as a coating on a base material, has placed over it a first material ... | 02/10/2004 |
| 6620304 | Bath system for galvanic deposition of metals A bath system for galvanic deposition of metals includes a solution containing at least one metal, especially a precious metal and/or precious metal alloy in the form of a water-soluble salt, at least one water-soluble protein material or amino acid and/o... | 09/16/2003 |
| 6596888 | MOCVD of WNx thin films using imido precursors Single imido tungsten imido precursors are described for the deposition of tungsten nitride on a substrate by processes such as metal organic chemical vapor deposition. The precursors may be employed to form diffusion barrier layers on microelectronic dev... | 07/22/2003 |
| 6582814 | Rare earth-transition metal oxide pigments Rare earth-transition metal oxides are used as pigments. The rare earth-transition metal oxide pigments are preferably of the formula (Rex Tm)Oy, where Re is at least one rare earth element, Tm is at least one transition metal, x ran... | 06/24/2003 |
| 6582582 | Electroplating composition and process An electroplating bath is disclosed that is particularly suited to the electrodeposition of tin, zinc and alloys of the foregoing in a smooth and bright electrodeposit. The disclosed electroplating bath comprises propanedioic acid, diethyl ester, polymer ... | 06/24/2003 |
| 6562220 | Metal alloy sulfate electroplating baths The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy sulfate electroplating baths has a number of unexpected benefits including wider useful c... | 05/13/2003 |
| 6547863 | Metal compound solution and thin film formation using the same A metal compound solution of a metal compound represented by formula (I): ##STR1## wherein R1, R2, and R3 are each a halogen-substituted or unsubstituted alkyl group having 1 to 8 carbon atoms which may contain an oxygen a... | 04/15/2003 |
| 6464762 | Aqueous solution for the formation of an indium oxide film by electroless deposition A method for forming an indium oxide film on an electrically conductive substrate by immersing the substrate and a counter electrode in an aqueous solution containing at least nitrate and indium ions and flowing an electric current between the substrate a... | 10/15/2002 |
| 6447666 | Galvanic bath, method for producing structured hard chromium layers and use thereof The present invention relates to a galvanic bath, to a process for the precipitation of chromium onto objects, and to the use of the process for the generation of textured hard-chrome layers on machine components. The galvanic bath contains in aqueous sol... | 09/10/2002 |
| 6398854 | Chemical solution for forming silver film and process for forming silver film using same The present invention relates to a chemical solution for forming a silver film on a substrate. This chemical solution has (1) an ammoniac silver nitrate solution; (2) a reducing solution containing a reducing agent and a base component; and (3) an additiv... | 06/04/2002 |
| 6395402 | Electrically conductive polymeric foam and method of preparation thereof Provided are methods of preparing an electrically conductive polymeric foam. The methods include the following steps: (a) contacting a polymeric foam with a surfactant solution; (b) contacting the polymeric foam with a sensitizing solution; (c) contacting... | 05/28/2002 |
| 6352580 | Complexes having tris(pyrazolyl)borate ligands for forming films Methods of forming a film on a substrate using chemical vapor deposition techniques and pyrazolyl complexes. The complexes and methods are particularly suitable for the preparation of semiconductor structures.... | 03/05/2002 |
| 6331201 | Bismuth coating protection for copper Copper-containing surfaces, such as a copper surface for use in an electrical circuit, are protected by the provision of a bismuth metal coating immersion-plated from a moderately to strongly acidic plating bath. The plating bath preferably contains disso... | 12/18/2001 |
| 6277180 | Method of replacing evaporation losses from colloidal catalyst baths A method to make volumetric additions of dilute aqueous acid solutions to a colloidal catalyst bath that will retard the salt crystallization. The process includes the steps of measuring the volumetric loss of water by physical measurements and adding dil... | 08/21/2001 |
| 6273943 | Electroless composite Plating Solution and Electroless composite plating method An electroless composite plating solution comprising metal ions, a complexing agent for said metal ions, a hypophosphite serving as a reducing agent, a surface active agent, and a water-insoluble composite material, said surface active agent comprising a ... | 08/14/2001 |
