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| Number | Title | Issue Date |
| 7981202 | Electroless pure palladium plating solution An electroless pure palladium plating solution capable of forming pure palladium plating films having less plating film variations is provided. The electroless pure palladium plating solution comprises an aqueous solution containing (a) 0.001 to 0.5 mol/liter of a w... | 07/19/2011 |
| 7704307 | Electroless palladium plating liquid An electroless palladium plating liquid, with excellent bath stability, that can provide a film with excellent corrosion resistance, solder bondability, and wire bondability is provided. The invention is an electroless palladium plating liquid, containing: a water s... | 04/27/2010 |
| 7682431 | Plating solutions for electroless deposition of ruthenium An electroless ruthenium plating solution is disclosed herein. The solution includes a ruthenium source, a polyamino polycarboxylic acid complexing agent, a reducing agent, a stabilizing agent, and a pH-modifying substance. A method of preparing an electroless ruthe... | 03/23/2010 |
| 7678183 | Electroless palladium plating bath and electroless palladium plating method Disclosed is an electroless palladium plating bath containing a palladium compound, at least one complexing agent selected from ammonia and amine compounds, at least one reducing agent selected from phosphinic acid and phosphinates, and at least one unsaturated carb... | 03/16/2010 |
| 7632343 | Electroless palladium plating solution An electroless palladium plating solution is capable of forming a pure palladium plating film directly on an electroless nickel plating film without (pre)treatment such as substituted palladium plating treatment or the like, which pure palladium plating film has goo... | 12/15/2009 |
| 7338686 | Method for producing conductive particles The present invention provides a low-cost method for producing conductive particles in a short period of time by simplifying pretreatment in electroless plating. The method for producing conductive particles includes the steps of: introducing a solution composed mai... | 03/04/2008 |
| 7189341 | Electrochemical sensor ink compositions, electrodes, and uses thereof The invention is directed to conductive polymer compositions, catalytic ink compositions (e.g., for use in screen-printing), electrodes produced by deposition of an ink composition, as well as methods of making, and methods of using such compositions and electrodes.... | 03/13/2007 |
| 7018568 | Highly catalytic screen-printing ink The invention is directed to conductive polymer compositions, catalytic ink compositions (e.g., for use in screen-printing), electrodes produced by deposition of an ink composition, methods of making, and methods of using thereof. An exemplary ink material comprises... | 03/28/2006 |
| 6911067 | Solution composition and method for electroless deposition of coatings free of alkali metals An electroless deposition solution of the invention for forming an alkali-metal-free coating on a substrate comprises a first-metal ion source for producing first-metal ions, a pH adjuster in the form of a hydroxide for adjusting the pH of the solution, a reducing a... | 06/28/2005 |
| 6908504 | Electroless plating bath composition and method of using The present invention relates to a cobalt electroless plating bath composition and method of using it for microelectronic device fabrication. In one embodiment, the present invention relates to cobalt electroless plating in the fabrication of interconnect structures... | 06/21/2005 |
| 6878411 | Bath for the electrochemical deposition of high-gloss white rhodium coatings and whitening agent for the same The invention concerns a bath for the electrochemical deposition of high-gloss white rhodium coatings and a whitening agent for the same. The brightness or degree of whiteness of the deposited coatings is significantly increased by means of compounds having the form... | 04/12/2005 |
| 6860925 | Printed circuit board manufacture A process used during manufacture of printed circuit boards comprises protecting metal pads and/or through-holes to provide a tarnish-resistant and solderable coating. In the method, the pads and/or through-holes are bright-etched, metal plated, preferably by an imm... | 03/01/2005 |
| 6852210 | Plating method and plating bath precursor used therefor To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing ... | 02/08/2005 |
| 6840988 | Solvated ruthenium precursors for direct liquid injection of ruthenium and ruthenium oxide A method is provided for forming a film of ruthenium or ruthenium oxide to the surface of a substrate by employing the techniques of chemical vapor deposition to decompose ruthenium precursor formulations. The ruthenium precursor formulations of the present inventio... | 01/11/2005 |
| 6706420 | Electroless platinum-rhodium alloy plating The present invention relates to electroless plating of a platinum-rhodium alloy onto a substrate. More particularly, this invention pertains to an aqueous platinum and rhodium plating bath, a process for plating a uniform coating of a platinum-rhodium alloy onto va... | 03/16/2004 |
| 6524499 | Transparent conductive film and display device The transparent conductive film of the present invention is formed to have a conductive layer containing at least ruthenium fine particles, gold fine particles and silver fine particles, the weight ratio of ruthenium fine particles and gold fine particles... | 02/25/2003 |
| 6517616 | Solvated ruthenium precursors for direct liquid injection of ruthenium and ruthenium oxide A method is provided for forming a film of ruthenium or ruthenium oxide to the surface of a substrate by employing the techniques of chemical vapor deposition to decompose ruthenium precursor formulations. The ruthenium precursor formulations of the prese... | 02/11/2003 |
| 6455175 | Electroless rhodium plating An composition for electroless plating of rhodium onto a substrate, a process for plating a uniform coating of rhodium onto various substrates using an electroless plating composition, and a rhodium plated article formed therefrom. The plating composition... | 09/24/2002 |
| 6451433 | Fine metal particle-dispersion solution and conductive film using the same A fine metal particle-dispersion solution and a method for the solution are disclosed which enables to form a transparent conductive film having an uniform distribution of at least two kinds of metals and is produced by mixing an aqueous solution (A) of a... | 09/17/2002 |
| 6277180 | Method of replacing evaporation losses from colloidal catalyst baths A method to make volumetric additions of dilute aqueous acid solutions to a colloidal catalyst bath that will retard the salt crystallization. The process includes the steps of measuring the volumetric loss of water by physical measurements and adding dil... | 08/21/2001 |
| 6273943 | Electroless composite Plating Solution and Electroless composite plating method An electroless composite plating solution comprising metal ions, a complexing agent for said metal ions, a hypophosphite serving as a reducing agent, a surface active agent, and a water-insoluble composite material, said surface active agent comprising a ... | 08/14/2001 |
| 6235093 | Aqueous solutions for obtaining noble metals by chemical reductive deposition An aqueous solution for obtaining a noble metal by chemical reduction containing at least one water-soluble compound or complex of a metal selected from the group consisting of gold, platinum, silver, and palladium as a source of the metal to be deposited... | 05/22/2001 |
| 6183545 | Aqueous solutions for obtaining metals by reductive deposition An aqueous solution for the reductive deposition of metals comprising, besides water, (A) a phosphine of the general formula (1) ##STR1## in which R1, R2, and R3 denote lower alkyl groups, at least one of which being hydr... | 02/06/2001 |
| 6165342 | Cyanide-free electroplating bath for the deposition of gold and gold alloys Cyanide-free electroplating baths for deposition of gold and gold alloy coatings, using sulphurous gold complexes that are stable for a relatively long time, can be used with current density over 1 A/dm2 and are practically odor-free, are obtai... | 12/26/2000 |
| 6156413 | Glass circuit substrate and fabrication method thereof A glass circuit substrate wherein nuclei of Pd (palladium) are placed on a glass substrate and a plating layer of Pd--P (palladium--phosphorus) is placed on the nuclei. A fabrication method of the glass circuit substrate comprises steps of forming nuclei ... | 12/05/2000 |
| 6045682 | Ductility agents for nickel-tungsten alloys A tungsten alloy electroplating bath. Highly ductile tungsten alloy deposits are facilitated using a sulfur co-depositing ductility additive such as: ##STR1## wherein R1 is selected from the group consisting of H1, alkyl, a... | 04/04/2000 |
| 5882736 | palladium layers deposition process A formaldehyde-free chemical bath containing a palladium salt, a nitrogenated completing agent, and formic acid or formic acid derivatives, at a pH of greater than 4 and a process of using the chemical bath for depositing on a metal surface an adhesive, p... | 03/16/1999 |
| 5746809 | Activating catalytic solution for electroless plating Disclosed is an activating catalytic solution for electroless plating which makes possible carrying out successive processes efficiently, without using organic solvent, involving preparation of activating catalytic solution for forming substrate film, for... | 05/05/1998 |
| 5645628 | Electroless plating bath used for forming a wiring of a semiconductor device, and method of forming a wiring of a semiconductor device A contact hole and a wiring groove are formed in an insulating layer formed on a semiconductor substrate. A silver layer is formed inside of the contact hole and the wiring groove and on the insulating layer with the use of an electroless plating bath com... | 07/08/1997 |
| 5562760 | Plating bath, and corresponding method, for electrolessly depositing a metal onto a substrate, and resulting metallized substrate An electroless metal plating bath composition, a corresponding method for electrolessly depositing a metal onto a substrate surface, as well as the resulting, metallized substrate, are disclosed. The inventive bath composition includes water, a soluble so... | 10/08/1996 |
| 5552031 | Palladium alloy plating compositions A palladium alloy plating composition comprising 4 to 20 g/l of palladium ion, 0.3 to 2.0 g/l of gold ion, 5 to 100 g/l of a conductive salt and 0.5 to 20 g/l of a complexing agent, and optionally 0.3 to 5 g/l of an alloying metal ion provides a plating w... | 09/03/1996 |
| 5503663 | Sable coating solutions for coating valve metal anodes Stable catalytic coating solutions are prepared using soluble compounds of at least two platinum group metals or at least one platinum group metal and at least one soluble compound of a valve metal. Valve metal anode bases coated with mixed oxide catalyti... | 04/02/1996 |
| 5480477 | Cobalt as a stabilizer in electroless plating formulations A process for the electroless deposition of metals and alloys onto a substrate by immersion of the substrate into an electroless plating composition. Said electroless plating composition comprises a solvent, a metallic compound, an electroless reducing ag... | 01/02/1996 |
| 5384076 | Resistive film-forming composition and electronic components using the same A resistive film-forming composition to be coated on a substrate and calcined to form a resistive film is disclosed, which contains an organic iridium compound selected from a compound represented by formula (I): ##STR1## wherein R1 repres... | 01/24/1995 |
| 5364459 | Electroless plating solution In order to provide an electroless plating solution containing trivalent titanium ions for serving as a reductant which can deposit a plating film in a pH range between a weak acid level and a weak alkaline level with excellent stability, carbonate such a... | 11/15/1994 |
| 5300330 | Stabilized composite electroless plating compositions A process of electrolessly metallizing a body on the surface thereof with a metal coating incorporating particulate matter therein, which process comprises contacting the surface of said body with a stable electroless metallizing bath comprising a metal s... | 04/05/1994 |
| 5277844 | Resistor composition Low ohm RuO2 -based resistors are positively adjusted to 0 HTCR, without increasing resistance, using modified zeolite components of FCC catalyst. The non-metallic 0.2-8.0 wt % additions do not adversely affect past rheology or the physical pro... | 01/11/1994 |
| 5196053 | Complexing agent for displacement tin plating An environmentally innocuous effective replacement for thiourea is disclosed for use as a complexing agent in displacement plating processes in which the plating solution is applied to the substrate surface to be plated by immersion or by spraying, cascad... | 03/23/1993 |
| 5158604 | Viscous electroless plating solutions Viscous aqueous electroless plating solutions comprising ionic depositable metal species such as copper or nickel, metal complexing agent such as EDTA, metal reducing agent such as formaldehyde or hypophosphite and thickener such as xantham gum, silica or... | 10/27/1992 |
| 5053283 | Thick film ink composition An abrasion resistant low temperature air fired thick film ink composition is disclosed. The composition includes a glass matrix material having a softening point below about 700° C., a particulate conductive material and a particulate reinforcing materi... | 10/01/1991 |
