Famous Patents
In 1879, Auguste Bartholdi received design patent number 11,023 titled "Design for a Statue". It was for the Statue of Liberty.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7717987 | Coating material based on a copper-indium-gallium alloy, in particular for the production of sputter targets, tubular cathodes and the like The copper-indium-gallium (CuInGa) alloy is in particular to be used for the production of sputter targets, tubular cathodes and similar coating material sources. It has a phase corresponding to a Cu5Zn8 prototype phase in which the lattice sites of the zinc atoms (... | 05/18/2010 |
| 7300501 | Electroless gold plating liquid The object is to provide an electroless gold plating liquid which has an adequate deposition speed for practical use without containing any thallium or other heavy metal ions, excellent stability of the plating liquid and contains a non-cyanide gold salt as a gold s... | 11/27/2007 |
| 7267713 | Conductive paste and glass circuit structure Provided is a conductive paste capable of adjusting resistivity and forming a conductor film having high strength of bonding with a glass substrate and high mounting strength of a metal terminal. The conductive paste contains a conductive component, a glass frit hav... | 09/11/2007 |
| 7264848 | Non-cyanide electroless gold plating solution and process for electroless gold plating The present invention provides a non-cyanide electroless gold plating solution free from a cyanide compound, comprising, as a completing agent of gold, a compound represented by the formula shown below or a salt thereof: X—(CH2)n—... | 09/04/2007 |
| 7232513 | Electroplating bath containing wetting agent for defect reduction An electroplating solution contains a wetting agent in addition to a suppressor and an accelerator. In some embodiments, the solution has a cloud point temperature greater than 35° C. to avoid precipitation of wetting agent or other solute out of the plating soluti... | 06/19/2007 |
| 7189341 | Electrochemical sensor ink compositions, electrodes, and uses thereof The invention is directed to conductive polymer compositions, catalytic ink compositions (e.g., for use in screen-printing), electrodes produced by deposition of an ink composition, as well as methods of making, and methods of using such compositions and electrodes.... | 03/13/2007 |
| 7166732 | Copper (I) compounds useful as deposition precursors of copper thin films Copper (I) amidinate precursors for forming copper thin films in the manufacture of semiconductor devices, and a method of depositing the copper (I) amidinate precursors on substrates using chemical vapor deposition or atomic layer deposition processes. ... | 01/23/2007 |
| 7156904 | Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby An aqueous copper-to-resin bonding layer solution comprising: (a) at least one acid type; (b) tin salt or tin oxide; (c) salt or oxide of at least one type of metal selected from the group consisting of: silver, zinc, aluminum, titanium, bismuth, chromium, iron, cob... | 01/02/2007 |
| 7155319 | Closed loop control on liquid delivery system ECP slim cell A method for controlling liquid delivery in a processing chamber. The method includes generating an analog input (AI) signal proportional to a process variable and calculating an analog output (AO) signal based on a setpoint and a deadband. The setpoint is a target ... | 12/26/2006 |
| 7150781 | Pyrophosphoric acid bath for use in copper-tin alloy plating The invention relates to a pyrophosphoric acid bath for use in cyanogen-free copper-tin alloy plating that contains an additive (A) composed an amine derivative, an epihalohydrin and a glycidyl ether compound with ratios of epihalohydrin to glycidyl ether compound b... | 12/19/2006 |
| 7135061 | Conductive paste and glass circuit structure Provided is a conductive paste capable of adjusting resistivity and forming a conductor film having high strength of bonding with a glass substrate and high mounting strength of a metal terminal. The conductive paste contains a conductive component, a glass frit hav... | 11/14/2006 |
| 7087267 | Materials and methods for immobilization of catalysts on surfaces and for selective electroless metallization A method of immobilizing a catalyst on a substrate surface involves providing novel ligating copolymers comprising functional groups capable of binding to a substrate surface and functional groups capable of ligating to catalysts such as metal ions, metal complexes,... | 08/08/2006 |
| 7083744 | Terminal electrode compositions for multilayer ceramic capacitors The present invention relates to terminal electrode compositions for multilayer ceramic capacitors. More specifically, it relates to terminal electrode compositions for multilayer ceramic capacitors which have a metal oxide component selected from SnO2, V... | 08/01/2006 |
| 7081271 | Cyclical deposition of refractory metal silicon nitride Embodiments of the invention relate to an apparatus and method of cyclical layer deposition utilizing three or more precursors. In one embodiment, the method includes providing at least one cycle of precursors to form a ternary material layer. Providing at least one... | 07/25/2006 |
| 7060325 | Simulated patina for copper A process for imparting a simulated patina appearance to a copper substrate, and a substrate having that appearance. A colorant having the desired initial patina color tone is employed to produce a non-continuous layer of colorant on the surface of a copper substrat... | 06/13/2006 |
| 7029761 | Bonding layer for bonding resin on copper surface A bonding layer for bonding resin is provided that is formed on a copper surface, and contains an alloy of: (a) copper; (b) tin; and (c) at least one type of metal (third metal) selected from the group consisting of: silver, zinc, aluminum, titanium, bismuth, chromi... | 04/18/2006 |
| 7018677 | Simulated patina for copper A process for imparting a simulated patina appearance to a copper substrate, and a substrate having that appearance. A colorant having the desired initial patina color tone is employed to produce a non-continuous layer of colorant on the surface of a copper substrat... | 03/28/2006 |
| 6986810 | Aqueous binder formulation for metal and ceramic feedstock for injection molding and aqueous coating composition Additionally, a coating composition comprising gelatine, water and a metal and/or ceramic powder is used to form coating layers on selected materials. ... | 01/17/2006 |
| 6979491 | Antimicrobial yarn having nanosilver particles and methods for manufacturing the same The present invention provides a yarn with antimicrobial effects. The antimicrobial antifungal effect of the yarn is derived from nanosilver particles (diameter between 1 and 100 nm) which are adhered to the yarn. The yarn contains fibers which are made of cotton, l... | 12/27/2005 |
| 6911405 | Semiconductor device and method of manufacturing the same A process gas consisting of one of N2, N2O or a mixture thereof is converted to a plasma and then a surface of a copper wiring layer is exposed to the plasma of the process gas, whereby a surface portion of the copper wiring layer is reformed a... | 06/28/2005 |
| 6908504 | Electroless plating bath composition and method of using The present invention relates to a cobalt electroless plating bath composition and method of using it for microelectronic device fabrication. In one embodiment, the present invention relates to cobalt electroless plating in the fabrication of interconnect structures... | 06/21/2005 |
| 6875474 | Electroless copper plating solutions and methods of use thereof Electroless copper plating solutions and methods of use thereof are disclosed. A representative electroless copper plating solution includes a reducing agent that is a source of hypophosphite ions and at least one accelerator compound that accelerates the rate of co... | 04/05/2005 |
| 6852210 | Plating method and plating bath precursor used therefor To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing ... | 02/08/2005 |
| 6811828 | Electroless gold plating solution and method for electroless plating The present invention is aimed to provide an electroless gold plating solution which requires less amount of a reducing agent, retains a sufficient deposition rate for a practical use, and has an excellent stability as a plating solution; and a method for carrying o... | 11/02/2004 |
| 6776826 | Composition and method for electroless plating of non-conductive substrates Compositions and methods for coating and plating a non-conductive substrate, the substrate having a surface, comprising coating the surface with a binding solution composition, the binding solution composition comprising between approximately 30% by weight and appro... | 08/17/2004 |
| 6770122 | Copper deposition using copper formate complexes The present invention relates to novel copper formate complexes and the deposition of metallic copper on substrates or in or on porous solids using these novel copper complexes. ... | 08/03/2004 |
| 6749775 | Conductive via composition A conductive composition for filling a via. The composition is based on total composition and has 4.0-12.0 wt. % organic vehicle and 88.0-96.0 wt. % electrically conductive particles selected from the group consisting of silver and nickel and mixtures thereof. ... | 06/15/2004 |
| 6723350 | Lubricious coatings for substrates The invention provides methods and kits to form water swellable gel coatings, preferably lubricious coatings, on substrates, and coated substrates thus formed. The coatings contain one or more antimicrobial metals formed with atomic disorder, together with one or mo... | 04/20/2004 |
| 6709563 | Copper-plating liquid, plating method and plating apparatus There is provided a copper-plating liquid free from an alkali metal and a cyanide which, when used in plating of a substrate having an outer seed layer and fine recesses of a high aspect ratio, can reinforce the thin portion of the seed layer and can embed copper co... | 03/23/2004 |
| 6656255 | Copper source liquid for MOCVD processes and method for the preparation thereof Provided is a copper source liquid useful in MOCVD processes for forming copper thin films on semiconductor wafers. The source liquid comprises water and a source component wherein the source component contains at least 90 weight % Cu(hfac)TMVS and the co... | 12/02/2003 |
| 6607654 | Copper-plating elecrolyte containing polyvinylpyrrolidone and method for forming a copper interconnect A copper-plating electrolyte includes an aqueous copper salt solution, a water-soluble ଲ-naphtholethoxylate compound having the formula ##STR1## wherein n is an integer from 10 to 24, one selected from the group consisting of a disulfide having the ... | 08/19/2003 |
| 6576114 | Electroplating composition bath There is provided an electrodeposit free of cobalt, cadmium and nickel which contains 1.25 to 1.55% w/w iron, 1 to 2 ppm zirconium; and 97.7 to 98.2% gold and has a pale yellow color less than 3N on the NIHS scale. The invention also provides an electropl... | 06/10/2003 |
| 6569359 | Transparent conductive layer forming coating liquid containing formamide The object is to provide a transparent conductive layer forming coating liquid capable of forming a transparent conductive layer having such characteristics as high transmittance, low resistance, low reflectance and high strength and with few film defects... | 05/27/2003 |
| 6533849 | Electroless gold plated electronic components and method of producing the same An neutral electroless gold plating method that minimises "black band" corrosion problem in the final product. The electroless gold plating solution is provided at neutral pH in the presence of a reducing agent, a complexing agent and an accelerator to al... | 03/18/2003 |
| 6475644 | Radioactive coating solutions methods, and substrates Radioactive coating solutions and sol-gels, and corresponding methods for making a substrate radioactive by the application of the radioactive coating solutions and sol-gels thereto. The radioactive coating solution comprises at least one carrier metal an... | 11/05/2002 |
| 6440202 | Pyrazolate copper complexes, and MOCVD of copper using same Copper pyrazolate precursor compositions useful for the formation of copper in semiconductor integrated circuits, e.g., interconnect metallization in semiconductor device structures, as an adhesive seed layer for plating, for the deposition of a thin-film... | 08/27/2002 |
| 6428880 | Paste gold and golden ornaments A gold paste for painting glass or a ceramic, exhibits gold color by being sintered. The gold paste comprises metal components having a metal composition within the following range: gold 82.0-99.1% by weight, bismuth 5.0-0.4% by weight, silicon 3.0-0.2% b... | 08/06/2002 |
| 6423202 | Process for making gold salt for use in electroplating A process for producing sodium gold sulfite in solution is described. The sodium gold sulfite solution is useful in gold electroplating baths, and can be used in applications which require pure, soft gold deposits.... | 07/23/2002 |
| 6416571 | Cyanide-free pyrophosphoric acid bath for use in copper-tin alloy plating The present invention provides a pyrophosphoric acid bath for use in Cu--Sn alloy plating without containing a cyanic ion comprising a reaction product (A) of an amine derivative and an epihalohydrin in a 1:1 mole ratio and a cationic surfactant (B) and, ... | 07/09/2002 |
| 6398854 | Chemical solution for forming silver film and process for forming silver film using same The present invention relates to a chemical solution for forming a silver film on a substrate. This chemical solution has (1) an ammoniac silver nitrate solution; (2) a reducing solution containing a reducing agent and a base component; and (3) an additiv... | 06/04/2002 |
