Did You Know...
...that two musicians were responsible for the invention of color print film? Fascinated by photography, Leopold Godowsky and Leopold Mannes worked together to produce an easy-to-use, practical color film. They worked full time as music teachers and gave concerts while experimenting during their off hours in Mannes' kitchen. Their success earned them full-time, well-paying jobs at Kodak and their efforts resulted in Kodachrome film, which was introduced in 1935.
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| Number | Title | Issue Date |
| 7214881 | High temperature electrical connection An electrical connection is made by connecting a metal element to a second element to which the electrical connection is desired to be made by means of a conductive material disposed onto one or both of the metal element and the second element so as to contact and d... | 05/08/2007 |
| 7211205 | High conductivity inks with improved adhesion Conductive ink compositions which can be cured to highly conductive metal traces by means of “chemical welding” include adhesion promoting additives for providing improved adhesion of the compositions to various substrates. ... | 05/01/2007 |
| 7166152 | Pretreatment solution for providing catalyst for electroless plating, pretreatment method using the solution, and electroless plated film and/or plated object produced by use of the method A pretreatment solution for providing a catalyst for electroless plating and a pretreatment method using the solution are provided. The pretreatment solution comprises a silver colloidal solution containing, as essential components, at least the following components... | 01/23/2007 |
| 7141185 | High conductivity inks with low minimum curing temperatures Conductive ink compositions which can be cured to highly conductive metal traces by means of “chemical welding” include additives which reduce the curing temperatures for use with low-temperature substrates. Conductive ink compositions can be deposited on a subs... | 11/28/2006 |
| 7053313 | Transparent substrate provided with electroconductive strips The present invention relates to a method of manufacturing electrically conducting tracks on a transparent substrate, by screen printing with an electrically conducting paste, and to the transparent substrate provided with said tracks. According to the invent... | 05/30/2006 |
| 7014979 | Organometallic precursor mixture for forming metal alloy pattern and method of forming metal alloy pattern using the same An organometallic precursor mixture for forming a metal alloy pattern and a method of forming the metal alloy pattern using the same, wherein the metal alloy pattern having improved adhesive force to a substrate, heat resistance, and resistance to atmospheric corros... | 03/21/2006 |
| 7011697 | Electroless gold plating solution An electroless gold plating solution is provided that includes a cyanide compound and ascorbic acid or a derivative thereof, the electroless gold plating solution containing one or more than one deposition accelerator selected from the group consisting of a copper c... | 03/14/2006 |
| 6979491 | Antimicrobial yarn having nanosilver particles and methods for manufacturing the same The present invention provides a yarn with antimicrobial effects. The antimicrobial antifungal effect of the yarn is derived from nanosilver particles (diameter between 1 and 100 nm) which are adhered to the yarn. The yarn contains fibers which are made of cotton, l... | 12/27/2005 |
| 6951666 | Precursor compositions for the deposition of electrically conductive features A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a viscosity of at least about 1000 centipoise and can be deposited by screen printing. The precursor composit... | 10/04/2005 |
| 6736997 | Sol-gel derived resistive and conductive coating A composition for application to a substrate to form a an electrically conductive coating thereon. The composition includes a sol-gel solution filled with a conductive powder. The coating may be conductive or resistive depending on the application. A process is prov... | 05/18/2004 |
| 6723350 | Lubricious coatings for substrates The invention provides methods and kits to form water swellable gel coatings, preferably lubricious coatings, on substrates, and coated substrates thus formed. The coatings contain one or more antimicrobial metals formed with atomic disorder, together with one or mo... | 04/20/2004 |
| 6712997 | Composite polymers containing nanometer-sized metal particles and manufacturing method thereof The present invention relates to composite polymers containing nanometer-sized metal particles and manufacturing method thereof, which can be uniformly dispersed nanometer-sized metal particles into polymers, thereby allowing the use thereof as optically, electrical... | 03/30/2004 |
| 6623663 | Electroconductive paste and method for manufacturing a multilayer ceramic electronic part using the same An electroconductive paste is provided containing from about 5% to 18% by weight of an organic vehicle comprising a solvent and a binder, from about 80% to 93% by weight of an electroconductive metal powder in a spherical or granular shape and with a part... | 09/23/2003 |
| 6576114 | Electroplating composition bath There is provided an electrodeposit free of cobalt, cadmium and nickel which contains 1.25 to 1.55% w/w iron, 1 to 2 ppm zirconium; and 97.7 to 98.2% gold and has a pale yellow color less than 3N on the NIHS scale. The invention also provides an electropl... | 06/10/2003 |
| 6558581 | Transparent electro-conductive structure, process for its production, transparent electro-conductive layer forming coating fluid used for its production, and process for preparing the coating fluid A transparent electro-conductive structure comprising a transparent substrate and formed successively thereon a transparent electro-conductive layer and a transparent coat layer, which is used in, e.g., front panels of display devices such as CRTs. The tr... | 05/06/2003 |
| 6533849 | Electroless gold plated electronic components and method of producing the same An neutral electroless gold plating method that minimises "black band" corrosion problem in the final product. The electroless gold plating solution is provided at neutral pH in the presence of a reducing agent, a complexing agent and an accelerator to al... | 03/18/2003 |
| 6524499 | Transparent conductive film and display device The transparent conductive film of the present invention is formed to have a conductive layer containing at least ruthenium fine particles, gold fine particles and silver fine particles, the weight ratio of ruthenium fine particles and gold fine particles... | 02/25/2003 |
| 6475644 | Radioactive coating solutions methods, and substrates Radioactive coating solutions and sol-gels, and corresponding methods for making a substrate radioactive by the application of the radioactive coating solutions and sol-gels thereto. The radioactive coating solution comprises at least one carrier metal an... | 11/05/2002 |
| 6455446 | High-temperature high-pressure processing method for semiconductor wafers, and an anti-oxidizing body used for the method A high-temperature high-pressure processing method for semiconductor wafers in which semiconductor wafers are charged into a pressure vessel to carry out processing under the gas atmosphere of high-temperature high-pressure, wherein the high-temperature h... | 09/24/2002 |
| 6428880 | Paste gold and golden ornaments A gold paste for painting glass or a ceramic, exhibits gold color by being sintered. The gold paste comprises metal components having a metal composition within the following range: gold 82.0-99.1% by weight, bismuth 5.0-0.4% by weight, silicon 3.0-0.2% b... | 08/06/2002 |
| 6197222 | Lead free conductive composites for electrical interconnections An electrically conductive paste which includes a thermoplastic polymer, a conductive metal powder and an organic solvent system is disclosed. The invention further encompasses an electrically conductive composite which includes the aforementioned thermop... | 03/06/2001 |
| 6086790 | Transparent conductive film and composition for forming same The present invention discloses a double-layer structured low-resistance and low-reflectivity transparent conductive film, comprising a lower high-reflectivity conductive layer containing a fine metal powder in a silica-based matrix and a silica-based low... | 07/11/2000 |
| 5985308 | Process for producing anti-microbial effect with complex silver ions Production of an anti-microbial effect in an alcohol or water based electrolyte is achieved by preparing silver materials that form complex ions other than Ag+, Ag2+, or Ag3+, and which produce an anti-microbial effect tha... | 11/16/1999 |
| 5972485 | Electroconductive composition for glass substrate and anti-fog window glass for automobiles Disclosed herein is an electroconductive composition for a glass substrate and an anti-fog window glass for automobiles making use of the composition. The electroconductive composition of the present invention can be fired at low temperature, and forms a ... | 10/26/1999 |
| 5922245 | Conductor paste for plugging through-holes in ceramic circuit boards and a ceramic circuit board having this conductor paste A conductor paste for plugging a through-hole in a ceramic substrate which includes an electrically conductive powder having a metal powder as its main component, a swelling agent and a vehicle, and may also include adhesion improvers. After sintering the... | 07/13/1999 |
| 5866044 | Lead free conductive composites for electrical interconnections An electrically conductive paste which includes a thermoplastic polymer, a conductive metal powder and an organic solvent system is disclosed. The invention further encompasses an electrically conductive composite which includes the aforementioned thermop... | 02/02/1999 |
| 5863355 | Flux for soldering electronic components on circuit substrates, and mounted or unmounted circuit substrate The invention provides a soldering flux for mounting circuit substrates, which is free from any organic solvent attributable to air pollution and dispenses with any washing step. The soldering flux is obtained by dissolving a rosin modified by an unsatura... | 01/26/1999 |
| 5830389 | Electrically conductive compositions and methods for the preparation and use thereof Electrically conductive adhesive compositions and methods for the preparation and use thereof, in which a solder powder, a chemically protected cross-linking agent with fluxing properties and a reactive monomer or polymer are the principal components. Dep... | 11/03/1998 |
| 5814248 | Conductive paste composition and method for producing a ceramic substrate A conductive paste composition comprises an organic vehicle, copper powder and an organometallic resinate which includes, as the metal, at least one metal selected from the group consisting of Pt, Ni and Bi. The amount of the metal component in the organo... | 09/29/1998 |
| 5807508 | Copper conductor paste and production method of copper conductor film A conductor paste comprising a high-polymer composite obtained by dispersing super-fine-granulated copper oxide in a polymer without being aggregated, mixed copper powders mainly composed of a base copper powder having a mean particle size of 1 to 10 μm ... | 09/15/1998 |
| 5803957 | Electroless gold plating bath To an electroless gold plating bath comprising a water-soluble gold compound, a complexing agent, and a reducing agent is added a small amount of polyvinyl pyrrodidone. The bath allows a satisfactory gold plating film to be formed on metal portions on a n... | 09/08/1998 |
| 5769932 | Surface treatment material required in fusing dental porcelain which prevents deposition of coat due to antioxidant and strongly bonds metal frame and dental porcelain with each other A surface treatment material used in fusing dental porcelain, containing powder of gold terpene sulfide, is applied and sintered on a metal frame. Then, the terpene and sulfur oxidize to suppress oxidation of gold and the like. A surface treatment layer h... | 06/23/1998 |
| 5753251 | Anti-microbial coating for medical device Anti-microbial coatings and method of forming same on medical devices are provided. The coatings are formed by depositing a biocompatible metal by vapor deposition techniques to produce atomic disorder in the coating such that a sustained release of metal... | 05/19/1998 |
| 5738914 | Electroless metal plating solution An electroless metal plating solution comprising metal ions to be reduced for plating onto a substrate and a chelate for the metal to prevent or reduce metal hydroxide precipitates forming and to buffer the amount of metal ions available for reduction, wh... | 04/14/1998 |
| 5723535 | Pastes for the coating of substrates, methods for manufacturing them and their use The present invention relates to pastes for the coating of substrates, consisting of powdery materials present in liquid dispersion from the group of the metals, metal compounds and/or metal alloys and/or boron and/or carbon, methods for manufacturing the... | 03/03/1998 |
| 5723073 | Conductive paste containing 2-tetradecanol and ceramic circuit substrate using the same A conductive paste for filling through holes for the interlayer electrical connection in a low-temperature firable ceramic circuit substrate to be fired at 800° to 1,000° C., which comprises a) 100 parts by weight of flaky and/or spherical silver-based ... | 03/03/1998 |
| 5678168 | Two-layer solderable gold for thick film circuits A system of two thick film pastes containing gold, in which the first paste is deposited directly onto a substrate, and the second is deposited directly onto the first, contain Cr2 O3 and Bi2 O3, which enhance t... | 10/14/1997 |
| 5618470 | Electrically conductive paste An electrically conductive paste effectively protects copper powder from oxidation and provides good solderability and terminal strength. It is composed of a copper powder, a glass frit in an amount of 2-20 wt % of the copper powder, an organic vehicle in... | 04/08/1997 |
| 5429670 | Gold paste for a ceramic circuit board An improved gold paste for use in the manufacture of ceramic circuit boards is disclosed, which has a composition comprising an inorganic component, an organic binder, a solvent. The inorganic component contains (a) 84-94 wt % powdery gold with a particle... | 07/04/1995 |
| 5418193 | Copper paste for forming conductive thick film Disclosed herein is copper paste for forming a conductive thick film, which contains 80 wt. % to 95 wt. % of spherical first copper powder of 1 μm to 10 μm in mean particle diameter, 0.5 wt. % to 15 wt. % of second copper powder of less than 1 μm in me... | 05/23/1995 |