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Class 73/842 - Bond


Subclass of Class 73 - Measuring and testing
Definition: Subject matter wherein the specimen includes an interface
No. of applications: 14
Last issue date: 11/10/2011


Application No.Application TitleIssue Date
20110271767TEST DEVICE
Shear test apparatus for gold and solder balls of a semiconductor substrate comprises a support element (21) on which is provided a piezo-electric crystal (24) in the direct shear load path. The crystal (24) may have a shield (25). The interf...
11/10/2011
20110118994Strength Measurement for Bond Lines
The different advantageous embodiments provide a method and apparatus for inspecting a structure. In one advantageous embodiment, an electromagnetic force is generated on a portion of a bond line for a plurality of parts in the structure. The structure contains a conduc...
05/19/2011
20100288012APPARATUS FOR TESTING BONDING STRENGTH OF ELECTRICAL CONNECTIONS AND FRICTIONLESS CALIBRATION DEVICE FOR THE SAME
An apparatus for testing bonding strength of electrical connection comprises a platform including a two-axis drive, a device holder positioned on the two-axis drive and configured to receive an electronic device, a vertical drive positioned on the platform, a cantilever...
11/18/2010
20100218616SHEAR TEST DEVICE
Shear test apparatus for gold and solder balls of a semiconductor substrate comprises a support element (21) on which is provided a piezo-electric crystal (24) in the direct shear load path. The crystal (24) may have a shield (25). The interf...
09/02/2010
20100218615APPARATUS AND METHOD FOR DETERMINING FAILURE MODE IN A SHEAR OR PULL TEST DEVICE
A method and apparatus for determining a mode of failure of a bond between an electrically conductive ball deposit and a substrate when breaking the ball deposit off of the substrate. The method and apparatus utilize tool force and displacement values to plot a force/di...
09/02/2010
20100154558METHOD AND INSTALLATION FOR EXPOSING THE SURFACE OF AN INTEGRATED CIRCUIT
The invention relates to a method for exposing an integrated circuit by ablating the polymer coating initially covering the integrated circuit, characterised in that it comprises the combined application of a laser radiation and a plasma onto the coating initially cover...
06/24/2010
20100116063SHEAR TEST APPARATUS AND METHOD
A test apparatus for applying shear loads to a deposit on a substrate comprises a cantilevered shear tool (18) having a tip (24) for contact with the deposit, and a back face having a piezo-electric crystal thereon. In use, the back face is subject to a co...
05/13/2010
20090266174ADHESION INSPECTION APPARATUS AND ADHESION INSPECTION METHOD USING THE SAME
An object of the present invention is to provide an adhesion inspection apparatus and method that can provide a reliable detection even for defect without the need of any complicated works, such as adjusting of an optical axis of instrument. An adhesion inspection appar...
10/29/2009
20090056469APPARATUS AND METHOD FOR DETERMINING FAILURE MODE IN A SHEAR OR PULL TEST DEVICE
A method and apparatus for determining a mode of failure of a bond between an electrically conductive ball deposit and a substrate when breaking the ball deposit off of the substrate. The method and apparatus utilize tool force and displacement values to plot a force/di...
03/05/2009
20090013796TEST APPARATUS TO DETERMINE THE SHEAR STRENGTH OF A COMPOSITE SANDWICH BEAM UNDER A HIGH HYDROSTATIC LOAD
An apparatus for determining the strength of composite sandwich beam in which an enclosure and insertable bladder is provided. The apparatus comprises positioning a bladder within the enclosure. The beam to be tested is slid through a cutout or aperture of the enclosure...
01/15/2009
20080314159Shear Test Device
Shear test apparatus for gold and solder balls of a semi-conductor substrate comprises a support element (21) on which is provided a piezo electric crystal (24) in the direct shear load path. The crystal (24) may have a shield (25). The inter...
12/25/2008
20080254286Method of Evaluating Adhesion Property, Low-Adhesion Material, and Mold for Molding Resin
A mold surface of an upper mold with which a fluid resin comes into contact has an oxide therein. The oxide contains a metal cation and an ion. Field strength is calculated based on a valence of the metal cation and ionic radius of the ion. Based on predetermined relati...
10/16/2008
20070186675Rubber specimen-stretching jig and apparatus and method for analyzing molecular structure and molecular motion of stretched rubber specimen
A rubber specimen-stretching jig including a jig body has a disk-shaped pedestal; a columnar rubber specimen-fitting support erected on the pedestal; and a columnar retaining ring-fitting support projected from an upper end surface of the rubber specimen-fitting support...
08/16/2007
20060272425Mounting structure of resin molded part
There is provided a resin molded part mounting structure in which a resin molded part is fixed to a mating member via a clip, wherein a connecting portion is provided on the resin molded part, wherein the clip is made up of a seat portion adapted to be joined to the con...
12/07/2006
 
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