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Class 700/110 - Defect analysis or recognition


Subclass of Class 700 - Data processing: generic control systems or specific applications
Definition: Subject matter wherein the data processing system or calculating
No. of applications: 343
Last issue date: 05/24/2012


1                  
Application No.Application TitleIssue Date
20120130526Air Wipe and Sheet Guide Temperature Control on Paper and Continuous Web Scanners
Paper and continuous web scanners operate at varying and high temperature conditions. Regulating the temperature within the measurement gap between dual scanner heads during measurement and calibration modes of operation by employing air wipe and sheet guide temperature...
05/24/2012
20120083917PREDICTED FAULT ANALYSIS
Example methods, apparatuses and systems to correlate candidate factors to a predicted fault in a process control system are disclosed. Techniques may include obtaining a value associated with a particular factor corresponding to a process, and predicting a fault based ...
04/05/2012
20120072002MANUFACTURING PROCESS MONITORING SYSTEM AND MANUFACTURING PROCESS MONITORING METHOD
According to one embodiment, a manufacturing process monitoring system for monitoring anomaly in a manufacturing process for products, the system includes an information storage section, a selection information section, a reference space formation section and a monitori...
03/22/2012
20120072003IMPRINTING METHOD, SEMICONDUCTOR INTEGRATED CIRCUIT MANUFACTURING METHOD AND DROP RECIPE CREATING METHOD
According to one embodiment, a defect inspection is made on a pattern transferred on substrates to be processed, thereby generating defect image data. When a defect is detected, a defect contour is extracted from the generated image data, the extracted defect contour is...
03/22/2012
20120053723Method of Controlling a Process and Process Control System
A system and a method for controlling a semiconductor manufacturing process are disclosed. The method comprises providing a plurality of structured wafers and taking a series of images from the plurality of structured wafers, wherein one image is taken for each structur...
03/01/2012
20120046778DEFECT ANALYZING METHOD AND DEFECT ANALYZING APPARATUS
A defect analyzing method according to the present invention includes: acquiring a position and a size of a defect obtained in a defect inspection of a semiconductor device and a waveform of a reflected light in a region which includes the defect, the waveform being obt...
02/23/2012
20120046777Integrated machining and part inspection method
A CNC machining method that incorporates a dimensional probe that allows inspection after stages of machining to determine actual dimensions with respect to the target dimension allows for corrective measures before advancing to the next step of the process so as to red...
02/23/2012
20120041583MEASUREMENT SYSTEM AND METHOD
A method of measuring planar defects in a substrate may include positioning a sensor proximate to an area configured to receive a substrate....
02/16/2012
20120041584ENDPOINT DETECTION DEVICE FOR REALIZING REAL-TIME CONTROL OF PLASMA REACTOR, PLASMA REACTOR WITH ENDPOINT DETECTION DEVICE, AND ENDPOINT DETECTION METHOD
An endpoint detection device, a plasma reactor with the endpoint detection device, and an endpoint detection method are provided. The endpoint detection device includes an OES data operation unit, a data selector, a product generator, an SVM, and an endpoint determiner....
02/16/2012
20120029679DEFECT ANALYSIS METHOD OF SEMICONDUCTOR DEVICE
A defect analysis method of semiconductor device, wherein defect percentage data for each of inspection units within a wafer and information pieces regarding manufacturing conditions for the wafer are loaded into a computer; statistical testing of the defect percentage ...
02/02/2012
20120004758Method and System for Excursion Monitoring in Optical Lithography Processes in Micro Device Fabrication
A process monitoring system may detect out-of-control situations on the basis of a single criterion for a plurality of different lithography processes. To this end, each data set related to a specific type of lithography process may be processed so as to determine relat...
01/05/2012
20110313559Use Of Printed Circuit Board, Electronic Component, And Semi-Conductor Assembly Equipment For The Assembly Of Razors And Components Thereof
The invention discloses a novel application of standard printed circuit board (PCB) assembly modules, electronic assembly, and/or semiconductor assembly equipment for the assembly of consumer products, such as razor cartridges. In addition, nozzles of the pick/place com...
12/22/2011
20110307091Air Disk Brake Caliper Pre-Stressing Method and Pre-Stressed Caliper Apparatus
A cast iron brake caliper with improved fatigue life, and a process and process equipment for pre-stressing a cast iron brake caliper to provide improved fatigue life, is provided. In the process, a load is applied to a cast iron caliper, where the load is high enough t...
12/15/2011
20110301737INSTANT PRODUCTION PERFORMANCE IMPROVING METHOD
The invention discloses a real-time production performance improving method comprising a real-time monitoring step, a performance satisfaction determination step and a real-time performance improving step. The real-time monitoring step monitors an operation status of a ...
12/08/2011
20110295407METHOD AND APPARATUS FOR CONDITION MONITORING OF VALVE
In the method and apparatus of the invention, the process point is taken into account when the condition and performance of a control valve are monitored. In the condition monitoring of the valve, process measurements are used in addition to measurements inside the valv...
12/01/2011
20110288674APPARATUS FOR MANAGING A HOLDER, APPARATUS FOR MANUFACTURING A LAYERED SEMICONDUCTOR AND METHOD FOR MANAGING A HOLDER
Management of the holding member that holds the semiconductor substrate is efficiently implemented. Provided is a holding member management apparatus that manages a substrate holding member that holds a semiconductor substrate in a manufacturing apparatus that manufactu...
11/24/2011
20110282481 PRINTED CIRCUIT BOARD MANUFACTURE
Method and systems for circuit board manufacture and inspection are provided. A captured image of a circuit board is compared with a target image of a reference circuit board at a similar stage in manufacture. The target image and a captured image are aligned. The captu...
11/17/2011
20110282480Process Quality Predicting System and Method Thereof
The invention discloses a process quality prediction system and a method thereof. When a processing apparatus performs a process on a target, the process is measured by a measurement apparatus to receive a process value. The process value and several previous quality da...
11/17/2011
20110282482HYBRID SCANNER FABRICATOR
A system and method to fabricate three dimensional objects. A set of fabrication tools include at least a coarse deposition head and a fine additive head, a fine subtractive head or both employed concurrently within a single housing. A scanner may also be used within th...
11/17/2011
20110276170ENHANCING INVESTIGATION OF VARIABILITY BY INCLUSION OF SIMILAR OBJECTS WITH KNOWN DIFFERENCES TO THE ORIGINAL ONES
A system, method and/or computer program product for analyzing a functionality of at least two manufactured products obtain a first characteristic of a first manufactured product. The system acquires a second characteristic of a second manufactured product. The system i...
11/10/2011
20110270433METHOD AND SECTION FOR COOLING A MOVING METAL BELT BY SPRAYING LIQUID
The invention relates to a method for monitoring the cooling of a moving metal belt (B) in a cooling section of a continuous processing line by spraying a liquid or a mixture consisting of a gas and a liquid onto the belt, the cooling depending on parameters including t...
11/03/2011
20110270432SCALABLE MANUFACTURING ASSEMBLY VERIFICATION SYSTEM
A scalable manufacturing assembly verification system for use in a manufacturing facility to verify assembly of a product, the system comprising assembly process work stations and assembly verification system stations. The assembly process work stations are each configu...
11/03/2011
20110264973METHODS AND SYSTEMS FOR TESTING ELECTRONIC CIRCUITS
A system for testing electronic circuits is configured to receive a test signal and an ideal response signal and output a test result signal. The system for testing electronic circuits includes a circuit portion to be tested, a comparator and a comparison result recorde...
10/27/2011
20110257779Phase-locked Web Position Signal Using Web Fiducials
Approaches for enhancing web position determination involve phase locking a web movement encoder signal to a sensed web fiducial signal. Fiducials disposed along a longitudinal axis of a substrate are sensed and corresponding sensor signals are generated. An estimated w...
10/20/2011
20110251707MANUFACTURING EXECUTION SYSTEM WITH VIRTUAL-METROLOGY CAPABILITIES AND MANUFACTURING SYSTEM INCLUDING THE SAME
A manufacturing execution system (MES) with virtual-metrology capabilities and a manufacturing system including the MES are provided. The MES is built on a middleware architecture (such as an object request broker architecture), and includes an equipment manager, a virt...
10/13/2011
20110251713DEFECT ANALYZER
The present invention provides methods, devices, and systems for analyzing defects in an object such as a semiconductor wafer. In one embodiment, it provides a method of characterizing defects in semiconductor wafers during fabrication in a semiconductor fabrication fac...
10/13/2011
20110245956Method and system for managing semiconductor manufacturing device
A management system includes a variable-period setting unit that sets a variable period in which quality-control values vary. Then, a retrieving unit retrieves events sandwiching the variable period. The events can be a maintenance of the semiconductor manufacturing dev...
10/06/2011
20110238200METHOD FOR DETERMING THE MACHINING QUALITY OF COMPONENTS, PARTICULARLY FOR METAL CUTTING BY NC MACHINES
The present invention relates to a method for determining a selected machining quality of components in a manufacturing process, particularly during metal cutting, having at least the following method steps:
09/29/2011
20110238197DYNAMIC COMPENSATION IN ADVANCED PROCESS CONTROL
A method of semiconductor fabrication is provided. The method includes providing a model for a device parameter of a wafer as a function of first and second process parameters. The first and second process parameters correspond to different wafer characteristics, respec...
09/29/2011
20110231002METHOD AND DEVICE FOR FILLING CARRIER TAPES WITH ELECTRONIC COMPONENTS
A method for filling a carrier tape (10) with electronic components (12) and for removing and replacing defective electronic components (13) from the carrier tape, comprising the steps of:
09/22/2011
20110231001Method of Producing a Complement of Parts Required for Assembly of a Product
A method of producing a set of parts which may be assembled to form a product generally consisting of programming a CNC machine to selectively execute a first routine to form a set of parts from a first panel of material, and generate a map of the layout of the parts on...
09/22/2011
20110208343Tracking and Marking Specimens Having Defects Formed During Laser Via Drilling
A method and system increase processed specimen yield in the laser processing of target material that includes multiple specimens formed on a common substrate. Preferred embodiments implement a feature that enables storage in the laser processing system a list of defect...
08/25/2011
20110202163PLANT PROTECTION SYSTEM AND METHOD USING FIELD PROGRAMMABLE GATE ARRAY
Provided is a plant protection system, which determines initiation of protective actions for the plant, and more particularly to the plant protection system including four channels which controls systems that shut down the plant or mitigate consequences of abnormal cond...
08/18/2011
20110190921FLEXIBLE PROCESS CONDITION MONITORING
The present invention generally relates to a method for flexible process condition monitoring. In a process that utilizes RF power, the RF power may be applied at different levels during different points in the process. Software may be programmed to facilitate the monit...
08/04/2011
20110190919Method of Controlling Semiconductor Device Fabrication
A semiconductor wafer fabrication metrology method in which process steps are characterised by a change in wafer mass, whereby during fabrication mass is used as a measurable parameter to implement statistical process control on the one or more of process steps. In one ...
08/04/2011
20110190920PRODUCT AUTHENTICATION
The present invention provides methods, reagents, and apparatus for authenticating products. Methods of the invention are easy to implement but difficult to replicate, simulate, alter, transpose, or tamper with. In particular, the present invention relates to a product ...
08/04/2011
20110184547SYSTEM FOR MONITORING PLANT EQUIPMENT
A system for monitoring plant equipment is provided. Another aspect provides an automated analysis system wherein software instructions operably compare sensor data to predefined valves and determine mechanical problems in multiple machines. In another aspect, a cement ...
07/28/2011
20110183295METHOD AND SYSTEM FOR PROVIDING AUTOMATED HIGH SCALE FABRICATION OF CUSTOM ITEMS
Method and system for providing volume manufacturing of customizable items including receiving a data package including a plurality of manufacturing parameters, each of the plurality of manufacturing parameters associated with a unique item, verifying the received data ...
07/28/2011
20110178628N-CHANNEL FLOW RATIO CONTROLLER CALIBRATION
Embodiments of the present invention generally relate to methods of controlling gas flow in etching chambers. The methods generally include splitting a single process gas supply source into multiple inputs of separate process chambers, such that each chamber processes s...
07/21/2011
20110172806DEFECTIVE-RATIO PREDICTING METHOD, DEFECTIVE-RATIO PREDICTING PROGRAM, MANAGING METHOD FOR SEMICONDUCTOR MANUFACTURING APPARATUS, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
In a managing system for a semiconductor manufacturing apparatus, a predicting unit 121 predicts a characteristic defective ratio and a foreign-substance defective ratio of each process obtains an actual defective ratio of each fail bit mode and a critical area o...
07/14/2011
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