|Application No.||Application Title||Issue Date|
|20130101857||THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, ACTIVE ESTER RESIN, SEMICONDUCTOR ENCAPSULATING MATERIAL, PREPREG, CIRCUIT BOARD, AND BUILD-UP FILM|
A thermosetting resin composition contains an active ester resin (A) and an epoxy resin (B) as essential components, the active ester resin (A) having a resin structure which includes a polyaryleneoxy structure (I) and in which aromatic carbon atoms in a plurality of th...
|20110282010||EPOXY RESIN COMPOSITION|
An epoxy resin composition having low moisture permeability, transparency and a high refractive index. The epoxy resin composition includes an epoxy compound, and a compound having two or more crosslinking groups that are reactive with the epoxy compound. The weight rat...
|20110275739||EPOXY RESIN COMPOSITION, CURED ARTICLE THEREOF, SEMICONDUCTOR SEALING MATERIAL, NOVEL PHENOL RESIN, NOVEL EPOXY RESIN, METHOD FOR PRODUCING NOVEL PHENOL RESIN, AND METHOD FOR PRODUCING NOVEL EPOXY RESIN|
An epoxy resin composition including an epoxy resin and a curing agent as essential components, in which the curing agent comprises a phenol resin which has each structural moiety of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P), an alkoxy group-co...
A resin composition which is low in a roughness of an insulating layer surface and capable of forming thereon a plated conductor layer having a sufficient peel strength in a wet roughing step and which is excellent in dielectric characteristics and a coefficient of ther...
|20110132646||FLAME RETARDANT EPOXY RESIN COMPOSITION, PREPREG AND LAMINATE THEREOF|
There is provided herein a curable epoxy resin composition comprising at least one brominated epoxy resin, at least one flame retardant curing agent, and at least one curing catalyst....
|20110112222||FIBER REINFORCED POLYMERS, EPOXY-BASED POLYMERIC COMPOSITIONS AND USE THEREOF|
A composition including an epoxy resin having at least a difunctional epoxy resin and at least one cross-linking agent for epoxy resin. The difunctional epoxy resin has a viscosity of from 1000 to 5000 mPa·s. The composition may include a low viscosity diluent for modu...
|20110084408||THERMOSETTING DIE-BONDING FILM|
An object of the present invention is to provide a thermosetting die-bonding film that is capable of preventing warping of an adherend by suppressing curing contraction of the film after die bonding, and a dicing die-bonding film. The present invention relates to a ther...
|20100324228||INSULATING POLYMER MATERIAL COMPOSITION|
An insulating polymer material composition is obtained by adding curing agent (amine, acid anhydride, or phenol, preferably imidazole), curing accelerator, etc. (curing accelerator such as organic peroxide, amine, imidazole, or the like, and reaction aid such as peroxid...
|20100298491||ADAMANTANE DERIVATIVE, RESIN COMPOSITION CONTAINING SAME, AND OPTOELECTRONIC MEMBER AND SEALING AGENT FOR ELECTRONIC CIRCUIT USING THOSE|
Disclosed is an adamantane derivative which provides a cured product excellent in optical characteristics such as transparency and light resistance, long-term heat resistance, electrical characteristics such as and dielectric constant, and low water absorption. Also dis...
|20100197859||BLENDS FROM BRANCHED POLYARYL ETHERS AND HYDROPHILIC POLYMERS|
The present invention provides polymer blends comprising the components
|20100160572||Branched Polycarbonate Resin Composition, and Branched Polycarbonate Resin and Molded Product Made Using the Same|
Disclosed are a branched polycarbonate resin composition that includes: (A) a polycarbonate resin; (B) a polymer including a reactive group being capable of reacting with a hydroxyl group; and (C) an ionic compound including an alkali metal ion, organic cation, or a com...
|20100084170||COMPOSITE-FORMING METHOD, COMPOSITES FORMED THEREBY, AND PRINTED CIRCUIT BOARDS INCORPORATING THEM|
A composite-forming process includes impregnating a reinforcing structure with a curable composition at a temperature of about 10 to about 40° C. The curable composition includes specific amounts of an epoxy resin, a poly(arylene ether), a solvent, and a curing promote...
A curable composition comprising
|20100048826||Polyphenylene ether oligomer compound, derivatives thereof and use thereof|
The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for ...
|20100036032||Vanish, heat-dissipation prepreg, and manufacturing method thereof|
A vanish, a heat-dissipation prepreg, and the manufacturing method thereof are disclosed. The vanish has a curing agent with structure as indicated in formula (1). The vanish based on this curing agent will improve thermal stability and peel strength. Glass fabric cloth...
|20100025094||EPOXY RESIN COMPOSITION FOR PRINTED WIRING BOARD, RESIN COMPOSITION VARNISH, PREPREG, METAL CLAD LAMINATE, PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD|
An epoxy resin composition for printed wiring board, characterized by containing (A) an epoxy resin component containing an epoxy resin (A-1) having nitrogen and bromine atoms in the same molecule, (B) a phenolic curing agent component containing a phenol resin (B-1), a...
|20100006998||LIQUID RESIN COMPOSITION, SEMICONDUCTOR WAFER HAVING ADHESIVE LAYER, SEMICONDUCTOR ELEMENT HAVING ADHESIVE LAYER, SEMICONDUCTOR PACKAGE, PROCESS FOR MANUFACTURING SEMICONDUCTOR ELEMENT AND PROCESS FOR MANUFACTURING SEMICONDUCTOR PACKAGE|
A liquid resin composition of the present invention is a liquid resin composition for bonding a semiconductor element on a support, exhibiting a tackiness of 0.05 N or less after heating at 120° C. for 10 min and a tackiness of 1 N or more at 80° C. A semiconductor wa...
|20090133833||Epoxy Resin Composition and Die Bonding Material Comprising the Composition|
A composition comprising
|20090111948||Compositions comprising polyimide and hydrophobic epoxy and phenolic resins, and methods relating thereto|
Water absorption resistant compositions of the present disclosure, e.g., pastes (or solutions), are well suited for electronic screen-printable materials and electronic components. The composition of the present disclosure may optionally contain thermal crosslinking age...
|20090088497||PAVING MATERIAL AND METHOD FOR CONSTRUCTION OF PAVED BODY USING THE SAME|
The purposes of the present invention are to provide a paving material which is easy to be handled, has less restriction on the conditions of execution of work, decomposes fast, and is superior in durability, and a method for construction of paved body using the paving ...
|20090042036||HIGH-SOLID ANTICORROSIVE COATING COMPOSITION|
[Problems] To provide a high solid type anticorrosive coating composition excellent in drying properties during coating, and capable of forming a coating film having excellent oil resistance, solvent resistance, chemical resistance and anticorrosive properties.
A curable composition comprising
a) an epoxy resin containing on average more than one epoxy group per molecule, and
|20090004484||Resine Composition For Printed Circuit Board And Composite Substrate And Copper Laminates Using The Same|
Disclosed is a resin composition for a PCB, the composition including: (a) a polyphenylene ether resin modified via a redistribution reaction of polyphenylene ether in the presence of 9,9-bis(hydroxyaryl)fluorene or 9,10-dihydro-9-oxa-10-(dihydroxyaryl)-10-phosphaphenan...
|20090000736||Oxidant-Containing Adhesive Enabling Disassembly|
An object of the present invention is to provide an easily disassemblable adhesive that is an adhesive for forming a structure by adhering members and enables easy disassembly of the adhered structure owing to possessing disassemblability. The invention provides a disas...
|20080268239||REINFORCED POLYMERIC MATERIALS, METHODS OF MANUFACTURE THEREOF AND ARTICLES COMPRISING THE SAME|
Disclosed herein is a polymeric composite comprising a first organic polymer that forms a first organic polymer phase; and a low molecular weight compound that exists in the form of a second crystalline phase; wherein the second crystalline phase is dispersed within the...
|20080251757||Latent Hardener For Epoxy Resin and Epoxy Resin Composition|
A subject of the present invention is to provide a one-pot type epoxy resin composition having both high curability and storage stability and a latent hardener for obtaining the same, and to provide anisotropic conductive materials, conductive adhesive materials, insula...
|20080153976||Epoxy Resin, Epoxy Resin Composition, And Cured Material Thereof|
An object of the present invention is to provide an epoxy resin that can be easily produced, can easily achieve a molecule-aligned state, and can be cured to provide a cured material with optical anisotropy and excellent toughness and thermal conductivity. The epoxy res...
|20080131639||Adhesive Composition for Semiconductor Device and Cover Lay Film, Adhesive Sheet, and Copper-Clad Polymide Film Made With the Same|
An adhesive composition for semiconductor devices which comprises an epoxy resin, a phenoxy resin, and a hardener, wherein part or all of the epoxy resin comprises at least one type of epoxy resin selected from the followings:
|20080071035||CURABLE POLY(ARYLENE ETHER) COMPOSITION AND METHOD|
A curable composition includes an epoxy resin and a bifunctional poly(arylene ether) having an intrinsic viscosity of about 0.03 to about 0.2 deciliter per gram. After curing, the composition exhibits markedly improved impact strength relative to a corresponding composi...
|20080071036||CURED POLY(ARYLENE ETHER) COMPOSITION, METHOD, AND ARTICLE|
A cured composition is prepared by curing a curable composition including an epoxy resin and a bifunctional poly(arylene ether) having an intrinsic viscosity of about 0.03 to about 0.2 deciliter per gram. The cured composition exhibits markedly improved impact strength ...
This invention relates to a process for stabilising and at the same time phase compatibilising plastics or plastic compositions by incorporating polymeric compounds obtainable by reacting a compound selected from the group consisting of the sterically hindered phenols, ...
|20080039591||Acid Anhydride Ester and Composition Thereof, and Heat-Curable Resin Composition and Cured Product Thereof|
The present invention provides an acid anhydride ester obtained by esterifying cyclohexane-1,2,4-tricarboxylic acid-1,2-anhydride and a composition of the ester, and a heat-curable resin composition and a cured product of the composition. _Provided is an epoxy resin com...
|20080020231||Epoxy Resin Composition|
To provide an epoxy resin composition which can form a cured material having low dielectric constant and low dielectric loss tangent in a radio frequency region, and a film obtained by using the epoxy resin composition. An epoxy resin composition comprising: (A) at leas...
|20070287801||MOLDABLE POLY(ARYLENE ETHER) THERMOSETTING COMPOSITIONS, METHODS, AND ARTICLES|
A method of forming a poly(arylene ether)-containing solid concentrate is described. The method includes blending a poly(arylene ether), a thermosetting resin, and a compatibilizing agent in the presence of a solvent to form a homogeneous solution, and removing the solv...
|20070093614||Epoxy resin composition|
The present invention relates to an epoxy resin composition comprising a polyphenylene ether having a number average molecular weight of 1,000, to 4,000 and containing components having a molecular weight of 20,000 or more in an amount of substantially 20% or less, and ...
|20070043166||Epoxy resin composition for encapsulating semiconductor chip and semiconductor device|
An epoxy resin composition for encapsulating a semiconductor chip having an improved flowability, an improved sequential moldability and the like, and additionally having improved characteristics of a cured product thereof, such as an improved mold-releaseability, an im...
|20070036866||Cationic block copolymers|
The invention relates to cationic block copolymers of formula A(—X—B)n or C(—Y—D)m, wherein A represents a hydrophilic polymer, B represents polyethyleneimine (PEI), X represents a bridge, n represents 1-200, C represents PEI, D represents ...
|20070004871||Curable composition and method|
A curable resin composition useful for encapsulating solid state devices is described. The composition includes an epoxy resin, a poly(arylene ether) resin, a latent cationic cure catalyst effective to cure the epoxy resin, and about 70 to about 95 weight percent of an ...
|20070004872||Molding composition and method, and molded article|
A molding composition suitable for encapsulating solid state devices includes an epoxy resin, a hardener, a poly(arylene ether) resin comprising less than 5 weight percent of particles greater than 100 micrometers, and about 70 to about 95 weight percent of a silica fil...
|20070004819||Molding composition and method, and molded article|
A curable method useful for encapsulating solid state devices includes (A) an epoxy resin; (B) an effective amount of a cure catalyst comprising (B1) a first latent cationic cure catalyst comprising a diaryl iodonium hexafluoroantimonate salt; (B2) a second latent catio...